Title:
Light-emitting diode (LED)
Document Type and Number:
United States Patent D571316
Inventors:
Lee, Kwang Cheol (Gwangju, KR)
Choi, Yong Seok (Gwangju, KR)
Choi, Yong Seok (Gwangju, KR)
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Application Number:
D/273700
Publication Date:
06/17/2008
Filing Date:
03/12/2007
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Referenced by:
Export Citation:
Assignee:
LG Innotek Co., Ltd. (Seoul, KR)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
313/483, 257/79, D13/180, 257/98, 313/498, 362/555, 257/81, D26/2, 257/88, 257/100, 257/95, 257/80, 362/800, 257/99, 313/500, 257/89
US Patent References:
| 6495861 | Light-emitting semiconductor chip | December, 2002 | Ishinaga | 257/99 |
| D517027 | Light emitting diode | March, 2006 | Suenaga | D13/180 |
| D524260 | Light emitting diode | July, 2006 | Ishizaka et al. | D13/180 |
| 7153000 | Multi-lens light emitting diode | December, 2006 | Park et al. | 362/268 |
| 20030098459 | Light emitting diode device | May, 2003 | Horiuchi et al. | 257/81 |
| 20040041222 | Power surface mount light emitting die package | March, 2004 | Loh | 257/433 |
| 20040201987 | LED lamp | October, 2004 | Omata | 362/230 |
| 20040207059 | Package structure with a cavity | October, 2004 | Hong | 257/678 |
| 20060220049 | Overmolded lens on leadframe and method for overmolding lens on lead frame | October, 2006 | Flaherty et al. | 257/98 |
| 20070194336 | Light emitting device package and method of manufacturing the same | August, 2007 | Shin et al. | 257/98 |
Primary Examiner:
Sikder, Selina
Attorney, Agent or Firm:
Birch, Stewart, Kolasch & Birch, LLP
Claims:
CLAIM
1. The ornamental design for a light-emitting diode (LED), as shown and described.
1. The ornamental design for a light-emitting diode (LED), as shown and described.
Description:
FIG. 1 is a front, right perspective view of the light-emitting diode (LED) showing our design;
FIG. 2 is a front view thereof, the rear view being a mirror image thereof;
FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a sectional view taken along line 6 — 6 in FIG. 4.