Title:
LED chip
Document Type and Number:
United States Patent D566057
Inventors:
Edmond, John (Cary, NC, US)
Ibbetson, James (Santa Barbara, CA, US)
Bergmann, Michael John (Chapel Hill, NC, US)
Salter, Amber Christine (Durham, NC, US)
Emerson, David Todd (Chapel Hill, NC, US)
Haberern, Kevin (Cary, NC, US)
Ibbetson, James (Santa Barbara, CA, US)
Bergmann, Michael John (Chapel Hill, NC, US)
Salter, Amber Christine (Durham, NC, US)
Emerson, David Todd (Chapel Hill, NC, US)
Haberern, Kevin (Cary, NC, US)
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Application Number:
D/275362
Publication Date:
04/08/2008
Filing Date:
12/21/2006
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Referenced by:
Export Citation:
Assignee:
Cree, Inc. (Durham, NC, US)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
313/483, 257/79, D13/180, 257/98, 313/498, 362/555, 257/81, D26/2, 257/88, 257/100, 257/95, 257/80, 362/800, 257/99, 313/500, 257/89
US Patent References:
| 6097040 | Semiconductor light emitting device that prevents current flow in a portion thereof directly under an electrode wire bonding pad | August, 2000 | Morimoto et al. | 257/91 |
| 6255129 | Light-emitting diode device and method of manufacturing the same | July, 2001 | Lin | 438/26 |
| 6518598 | III-nitride LED having a spiral electrode | February, 2003 | Chen | 257/91 |
| 6847052 | Light-emitting diode device geometry | January, 2005 | Fan et al. | 257/79 |
| 20050023539 | Semiconductor light-emitting device | February, 2005 | Fujiwara et al. | 257/79 |
| 20050067624 | Contacting scheme for large and small area semiconductor light emitting flip chip devices | March, 2005 | Steigerwald et al. | 257/79 |
| 20060049422 | Surface mount LED | March, 2006 | Shoji | 257/100 |
| 20060151800 | Surface mountable light emitting device | July, 2006 | Keong et al. | 257/99 |
| 20060226437 | Light-emitting diode | October, 2006 | Fujita et al. | 257/98 |
| 20070085089 | High power light emitting diode | April, 2007 | Hsu | 257/81 |
| 20070138585 | Image sensor package | June, 2007 | Hsin et al. | 257/433 |
Other References:
Lumileds LED Die; Philips/Lumileds Light from Silicon Valley “LED Die,” pp. 1-2, (2006).
Color photos Lumileds LEDs, 1 page, (for exam purposes, date is assumed to be before Dec. 21, 2006).
Image of Osram chip, 1 page, (prior to Dec. 29, 2005).
“Lumileds LED,” 1 page, (Oct. 2-4, 2002).
SemiLEDS “Products”, 2 pages, http://www.semileds.com/en—04product/asp (2006).
Color photos Lumileds LEDs, 1 page, (for exam purposes, date is assumed to be before Dec. 21, 2006).
Image of Osram chip, 1 page, (prior to Dec. 29, 2005).
“Lumileds LED,” 1 page, (Oct. 2-4, 2002).
SemiLEDS “Products”, 2 pages, http://www.semileds.com/en—04product/asp (2006).
Primary Examiner:
Sikder, Selina
Attorney, Agent or Firm:
Myers Bigel Sibley & Sajovec, P.A.
Claims:
CLAIM
1. The ornamental design for an LED chip, as shown and described.
1. The ornamental design for an LED chip, as shown and described.
Description:
FIG. 1 is a top perspective view of a LED chip showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a first side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a different side view thereof;
FIG. 6 is an end view thereof; and,
FIG. 7 is an opposing end view thereof.