| 6097040 | Semiconductor light emitting device that prevents current flow in a portion thereof directly under an electrode wire bonding pad | August, 2000 | Morimoto et al. | 257/91 |
| 6255129 | Light-emitting diode device and method of manufacturing the same | July, 2001 | Lin | 438/26 |
| 6518598 | III-nitride LED having a spiral electrode | February, 2003 | Chen | 257/91 |
| 6847052 | Light-emitting diode device geometry | January, 2005 | Fan et al. | 257/79 |
| 20050023539 | Semiconductor light-emitting device | February, 2005 | Fujiwara et al. | 257/79 |
| 20050067624 | Contacting scheme for large and small area semiconductor light emitting flip chip devices | March, 2005 | Steigerwald et al. | 257/79 |
| 20060049422 | Surface mount LED | March, 2006 | Shoji | 257/100 |
| 20060151800 | Surface mountable light emitting device | July, 2006 | Keong et al. | 257/99 |
| 20060226437 | Light-emitting diode | October, 2006 | Fujita et al. | 257/98 |
| 20070085089 | High power light emitting diode | April, 2007 | Hsu | 257/81 |
| 20070138585 | Image sensor package | June, 2007 | Hsin et al. | 257/433 |
FIG. 1 is a top perspective view of a LED chip showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a first side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a different side view thereof;
FIG. 6 is an end view thereof; and,
FIG. 7 is an opposing end view thereof.