Memory card
United States Patent D552612

Nishizawa, Hirotaka (Tokyo, JP)
Osawa, Kenji (Tokyo, JP)
Osako, Junichiro (Tokyo, JP)
Wada, Tamaki (Tokyo, JP)
Sugiyama, Michiaki (Tokyo, JP)
Totsuka, Takashi (Tokyo, JP)
Application Number:
Publication Date:
Filing Date:
Renesas Technology Corporation (Tokyo, JP)
Primary Class:
International Classes:
(IPC1-7): 1402
Field of Search:
235/443, 438/121, 361/728, 361/729-30, 235/487, 257/E23.064, 235/493, 361/679, 174/260, 361/736, 235/441, 235/492, D14/435-38, D14/478-80, 174/52, 439/946, 361/737, 174/250, 257/678-79, 257/693, 235/495, 710/300-303
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US Patent References:
20050253239Memory cardNovember, 2005Nishizawa et al.
6945465Integrated circuit card having staggered sequences of connector terminalsSeptember, 2005Nishizawa et al.
6858925Semiconductor device and a method of manufacturing the sameFebruary, 2005Wada et al.
D493798Memory cardAugust, 2004Yu et al.D14/436
D494180IC cardAugust, 2004TaniguchiD14/436
D492687Removable electronic cardJuly, 2004Yu et al.D14/436
D488477Removable electronic cardApril, 2004Yu et al.D14/436
6556379Magnetic tape cassette, window member and resin molding productApril, 2003Ashikawa360/132
D467586IC memory cardDecember, 2002Shimoda et al.D14/436
D460456IC memory cardJuly, 2002Shimoda et al.D14/436
D458935Communications cardJune, 2002HirokiD14/436
6381143Card-typed electronic apparatus having a flat card case housing a plurality of electronic partsApril, 2002Nakamura361/737
D446525IC memory cardAugust, 2001Okamoto et al.D14/436
5173841Semiconductor device card and method of manufacturing the sameDecember, 1992Uenaka et al.361/758

Foreign References:
JP2005339496September, 2004
Primary Examiner:
Tung M. H.
Assistant Examiner:
Lee, Susan Moon
Attorney, Agent or Firm:
Reed Smith LLP
Fisher, Esq. Stanley P.
Marquez, Esq. Juan Carlos A.

1. We claim the ornamental design for a memory card, as shown and described.


FIG. 1 is a front elevational view of a memory card showing our new design.;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a sectional view that is taken along line A–A′ of FIG. 1 where the internal mechanism is omitted; and,

FIG. 8 is a perspective view thereof.

The elements shown in broken lines are for illustrative purposes only and form no part of the claimed design.