Title:
Heat sink
Document Type and Number:
United States Patent D496006
Inventors:
Application Number:
D/167276
Publication Date:
09/14/2004
Filing Date:
09/12/2002
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Referenced by:
Export Citation:
Assignee:
DaTech Technology Co., Ltd. (Taipei Hsien, TW)
Primary Class:
Field of Search:
206/728, 297/727, 361/271, 206/713, 361/274.3, 206/714, 297/707, 297/686, 165/104.14, 361/702, 165/80.3, 297/706, 206/716, 361/709, 165/104.33, 297/719, 297/722, D13/179, 361/697, 361/711, 361/704, 165/185, 297/720, 361/710, 297/718, 206/715, 165/180, 174/52.4, 165/122, 174/16.3, 206/727, 165/121
US Patent References:
| 5558155 | Cooling apparatus and assembling method thereof | Ito | 165/80.3 | |
| 5761811 | Assembling method for cooling apparatus | Ito | 29/890.054 | |
| 6104609 | Structure computer central processing unit heat dissipater | Chen | 361/695 | |
| 6340056 | Flow channel type heat dissipating fin set | Huang et al. | 165/185 | |
| 6474407 | Composite heat sink with high density fins and assembling method for the same | Chang et al. | 165/80.3 | |
| 6487079 | Heat sink and mounting structure for heat sink | Katsui | 361/704 |
Primary Examiner:
Hyder, Philip S.
Assistant Examiner:
Sikder, Selina
Attorney, Agent or Firm:
Troxell, Law Office Pllc
Claims:
1. The ornamental design for a heat sink, as shown and described.
Description:
FIG. 1 is a perspective view of a heat sink, in accordance with the present invention, the enlarged detail is shown for ease of illustration;
FIG. 2 is a front elevational view thereof, the enlarged detail is shown for ease of illustration;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof, the enlarged detail is shown for ease of illustration; and,
FIG. 7 is a bottom plane view thereof.