FIG. 1 is a perspective view of the front, bottom and right side of an IC module showing my new design;

FIG. 2 is a perspective view of the rear, bottom and left side thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof; and,

FIG. 8 is a left side elevational view thereof.