Title:
IC module
United States Patent D434418
Inventors:
Shinada, Satoshi (Nagano, JP)
Application Number:
D/111928
Publication Date:
11/28/2000
Filing Date:
10/06/1999
Export Citation:
Assignee:
Seiko Epson Corporation (Tokyo, JP)
Primary Class:
Field of Search:
D14/432, D14/435-438, 361/686, 361/728, 361/737, 361/736, D13/182, D19/9-10
View Patent Images:
US Patent References:
5982624IC cardNovember, 1999Onoda et al.
D389130IC moduleJanuary, 1998Ishihara
D387746IC moduleDecember, 1997Ishihara
5576935Common circuit board connectable to multiple alternative single-sided expansion boardsNovember, 1996Freer et al.
D374870Smart card with two external contact regionsOctober, 1996Gaumet
D370904Rear portion of an optical communication cardJune, 1996Nakata et al.
D369157IC cardApril, 1996Ohmori et al.
D386903Tool boxApril, 1996Ohmori et al.
Primary Examiner:
Tung M. H.
Attorney, Agent or Firm:
Stroock & Stroock & Lavan LLP
Claims:
1. The ornamental design for an IC module, as shown and described.

Description:

FIG. 1 is a perspective view of the front, bottom and right side of an IC module showing my new design;

FIG. 2 is a perspective view of the rear, bottom and left side thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof; and,

FIG. 8 is a left side elevational view thereof.