FIG. 1 is a perspective view of a first embodiment of a case for semiconductor element showing my new design;

FIG. 2 is a top plan view of the first embodiment;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof; and

FIG. 8 is a perspective view of the first embodiment, wherein the broken-line disclosure of the two inserted electronic components is for illustrative purposes only and forms no part of the claimed design;

FIG. 9 is a perspective view of a second embodiment of a case for semiconductor element showing my new design;

FIG. 10 is a top plan view of the second embodiment;

FIG. 11 is a left side elevational view thereof;

FIG. 12 is a front elevational view thereof;

FIG. 13 is a bottom plan view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a rear elevational view thereof; and,

FIG. 16 is a perspective view of the first embodiment, wherein the broken-line disclosure of the two inserted electronic components is for illustrative purposes only and forms no part of the claimed design.