Temporary package for semiconductor dice

Title:

Temporary package for semiconductor dice

Document Type and Number:

United States Patent D402638

Inventors:

Farnworth, Warren M. (Nampa, ID)
Wood, Alan G. (Boise, ID)
Hembree, David R. (Boise, ID)
Akram, Salman (Boise, ID)

Application Number:

D/070029

Publication Date:

12/15/1998

Filing Date:

04/25/1997

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Referenced by:

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Assignee:

Micron Technology, Inc. (Boise, ID)

Primary Class:

D13/182

Field of Search:

D14/114, D13/182, 257/668, 257/671, 257/672, 257/693, 174/52.1-52.5, 439/55, 439/70, 361/718, 361/820

US Patent References:

D317592	Semiconductor element	June, 1991	Yoshizawa	D13/182
D359028	Socketed integrated circuit package	June, 1995	Siegel et al.	D13/182
5053853	Modular electronic packaging system	October, 1991	Haj-Ali-Ahmadi et al.	257/693
5155067	Packaging for a semiconductor die	October, 1992	Wood et al.	257/693
5173451	Soft bond for semiconductor dies	December, 1992	Kinsman et al.	437/209
5206536	Comb insert for semiconductor packaged devices	April, 1993	Lim	257/668
5302891	Discrete die burn-in for non-packaged die	April, 1994	Wood et al.	324/158F
5408190	Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die	April, 1995	Wood et al.	324/765
5440240	Z-axis interconnect for discrete die burn-in for nonpackaged die	August, 1995	Wood et al.	324/765
5442232	Thin semiconductor package having many pins and likely to dissipate heat	August, 1995	Goto et al.	257/668
5451165	Temporary package for bare die test and burn-in	September, 1995	Cearley-Cabbiness et al.	439/71
5455452	Semiconductor package having an LOC structure	October, 1995	Kiyono	257/668
5471088	Semiconductor package and method for manufacturing the same	November, 1995	Song	257/668
5495179	Carrier having interchangeable substrate used for testing of semiconductor dies	February, 1996	Wood et al.	324/755
5517125	Reusable die carrier for burn-in and burn-in process	May, 1996	Posedel et al.	324/755
5519332	Carrier for testing an unpackaged semiconductor die	May, 1996	Wood et al.	324/755
5530376	Reusable carrier for burn-in/testing of non packaged die	June, 1996	Lim et al.	324/765
5541525	Carrier for testing an unpackaged semiconductor die	July, 1996	Wood et al.	324/755
5543725	Reusable carrier for burn-in/testing on non packaged die	August, 1996	Lim et al.	324/755
5581195	Semiconductor chip holding device	December, 1996	Lee et al.	324/755

Other References:

1994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7 - 7-13, Apr., 1994 .

Primary Examiner:

Tung M. H.

Attorney, Agent or Firm:

Gratton, Stephen A.

Claims:

1. The ornamental design for a temporary package for semiconductor dice, asshown and described.

Description:

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

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