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7504442 |
Condensation-crosslinking two-component dental molding material made of alkoxysilyl- and hydroxysilyl-functional polyethers
Condensation-crosslinking two-component dental molding materials based on polyethers, which are particularly suitable for taking impressions, as well as mixtures that can be obtained from them, and...
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7378523 |
Quinolinols as fluxing and accelerating agents for underfill compositions
Underfill compositions comprise a quinolinol or a quinolinol derivative as a fluxing agent, as an accelerating agent, or as both. The compositions are sufficiently acidic to perform well as fluxes,...
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7351784 |
Chip-packaging composition of resin and cycloaliphatic amine hardener
A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition...
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7157509 |
Curable compositions
Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an...
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7056978 |
Toughened epoxy-anhydride no-flow underfill encapsulant
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear...
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7037399 |
Underfill encapsulant for wafer packaging and method for its application
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy...
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6946503 |
Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins
Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins.
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6893736 |
Thermosetting resin compositions useful as underfill sealants
The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor...
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6800157 |
Bonding members with epoxy composition containing chain extender, toughener and catalyst
A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second...
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6797821 |
Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins
The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured...
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6649673 |
Single component room temperature curable low VOC epoxy coatings
A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is...
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6645631 |
Flame retardant phosphorus element-containing epoxy resin compositions
A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated...
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6627683 |
Reworkable thermosetting resin compositions and compounds useful therein
Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions...
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6624246 |
Method for the preparation of 1-benzotriazolyl carbonate esters of poly(ethylene glycol)
The invention provides a method for preparing a 1-benzotriazolylcarbonate ester of a water-soluble and non-peptidic polymer by reacting a terminal hydroxyl group of a water-soluble and non-peptidic...
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6624216 |
No-flow underfill encapsulant
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear...
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6613839 |
Polyepoxide, catalyst/cure inhibitor complex and anhydride
An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of...
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6608161 |
Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same
The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a...
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6605355 |
Epoxy resin composition
An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups...
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6562410 |
Heat curable epoxy compositions
Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic...
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6559269 |
Curable resin composition and novel latent curing agent
A curable resin composition which has excellent curability and storage stability, and in particular, which has improved storage stability under the condition where the resin composition only...
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6548620 |
Epoxy resin composition and process for producing the same
The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and...
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6548576 |
Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C....
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6548189 |
Epoxy adhesive
In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may...
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6531549 |
Crystallized epoxy resins, their production method, and curable compositions comprising them
A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an...
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6512074 |
Polymerization catalysts of oxirane compounds and process for preparing polymers of oxirane compounds using the catalysts
Polymerization catalysts of oxirane compounds are catalysts which are suitable to carry out suspension precipitation polymerization of the oxirane compounds in an organic solvent which cannot...
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6495270 |
Compounds, hardening accelerator, resin composition, and electronic part device
Nitrogen compounds represented by formula (XXIa) or (XXIb); an epoxy resin hardening accelerator and a resin composition each containing any of the compounds; and an electronic part device...
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6486256 |
Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A...
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6465597 |
Epoxy-amine compositions containing sulfur as a cure accelerator
An epoxy-amine composition includes an epoxy resin, an amine curing agent and elemental sulfur as a cure accelerator. The degree of acceleration is highly regulated by the concentration of sulfur...
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6462164 |
2-phenylimidazole-phosphoric acid salt as an accelerator for acid anhydride curatives in one-component epoxy compositions
A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for...
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6433042 |
Curing agents for epoxy resins
A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH 2 )n- or —(CH 2 )1-Y—(CH...
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6423250 |
Flame retardant compositions utilizing a mixture of cyanuric acid and cyamelide compounds
Flame retardant compositions of this invention are produced by applying on or incorporating a mixture of cyanuric acid and cyamelide composition in a more flammable organic material. The mixture of...
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6376638 |
Latent curing agent for epoxy resin initiated by heat and UV-light and epoxy resin composition containing the same and cured epoxy products
The present invention relates to a novel latent curing agent which is capable of controlling the initiation reaction stage and is curable by heat and/or UV-light, an epoxy resin composition...
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6376604 |
Method for the preparation of 1-benzotriazolylcarbonate esters of poly(ethylene glycol)
The invention provides a method for preparing a 1-benzotriazolylcarbonate ester of a water-soluble and non-peptidic polymer by reacting a terminal hydroxyl group of a water-soluble and non-peptidic...
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6372825 |
Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these
The present invention provides an aqueous solution of an epoxy resin and a solid thereof, which is obtained by the following manner that an epoxy compound or a solution of the epoxy compound in...
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6369133 |
Polyester-based aqueous coating composition
Polyester-based aqueous coating compositions comprising a mixture of a carboxyl-functional polyester resin (A), a water-insoluble epoxy resin (B), and a hydrophobic solvent (C), the mixture being...
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6355763 |
Epoxy resin, polyamine hardener and N,N′,N″-tris(dialkylaminoalkyl)hexahydrotriazine
The invention relates to curable mixtures based on epoxy resins and aminic hardeners and cure accelerators, and, optionally solvents, plasticisers, UV stabilisers, dyes, pigments and/or fillers,...
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6353080 |
Flame retardant epoxy resin composition
A flame retardant epoxy resin composition containing not more than 10% by wgt. of halogen, comprising an epoxy resin, stated concentrations of phosphoric acid ester, nitrogen—containing...
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6352783 |
Copolyester containing 4,4'-biphenyldicarboxylic acid, 1,4-cyclohexanedimethanol and an ultraviolet light absorbing compound and articles made therefrom
A copolyester blend resistant to ultraviolet radiation consists essentially of a polyethylene terephthalate based copolyester having 1,4-cyclohexanedimethanol residues; an effective amount of an...
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6350825 |
Reacting diglycidyl, bisphenol and monophenol with catalyst and mixing with polyglycidyl
An epoxy resin mixture is prepared by a) the reaction of (i) a diglycidyl compound, (ii) a bisphenol compound and (iii) at least one monophenol at temperatures of from 160 to 170° C. in the...
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6281154 |
Compounds having one group 13 element, bound with one mono- or di-anionic trident ligand, a method of preparation and application thereof as polymerization catalysts
Novel compounds having one group 13 element bound with one mono- or di-anionic tridentate ligand, a method of preparation thereof and use thereof as a copolymerization catalyst.
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6255365 |
Epoxy resin composition for semiconductor encapsulation
An epoxy resin composition comprising (a) an epoxy resin comprising a mixture of the following components: (1) about 50-95 parts by weight of a novolak type epoxy resin, and (2) about 5-50...
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6232426 |
Epoxy resin composition
Disclosed herein is a one-part polythiol-type epoxy resin composition having an excellent low-temperature quick curability and a good storage stability (shelf stability), which can be prepared by...
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6225378 |
Triazine hardener and epoxy composition containing the same
A triazine compound having formula I or formula II: ##STR1## Wherein n is integer from 1 to 5; R 1 is hydrogen, halogen, C 1 -C 4 alkyl, or C 1 -C 4 alkoxyl; and R 2 is aliphatic amine,...
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6207786 |
Ternary systems of benzoxazine, epoxy, and phenolic resins
Low viscosity ternary mixtures of benzoxazine, epoxy and phenolic resins have been developed. The blends render homogeneous and void free cured specimen with a wide range of properties. Melt...
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6194490 |
Curable composition comprising epoxidized natural oils
A composition, which comprises (a) a compound containing at least one epoxy group in inner position per molecule, obtained by epoxidation of a natural unsaturated oil or of its derivative; ...
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6133383 |
Method for preparing a high heat resistant epoxy resin composition comprising quinoxalinium salt containing benzyl group
A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a quinoxalinium salt having a benzyl group to difunctional and...
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6124381 |
Expoxy/acid anhydride composition
An epoxy/acid anhydride composition characterized by containing, as a curing accelerator, a substituted triazine of the formula [I] ##STR1## (wherein X is an amino group, C 1 -18 monoalkylamino...
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6110993 |
Thermosetting epoxy resin composition
The present invention provides a thermosetting epoxy resin composition which copes with both storage stability and curing properties at a low temperature. A thermosetting epoxy resin composition of...
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6107437 |
Curing agents
Curing agents for epoxy resins are provided in which an imidazole is substituted on the nitrogen atom by a long chain group. This provides greater latexing (stability) at ambient temperatures...
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6103853 |
Amine curing agents and epoxy coatings produced using same
Amine adducts comprising a reactive amine curing agent containing an aromatic silane epoxy along with improved coatings made by combining the amine adduct with additional epoxy material. The amine...
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