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7763702 |
Synthesis of polyphosphazenes with sulfonimide side groups
The invention relates to sulfonimide bearing phenolic compounds and the use of those compounds to produce polyphosphazenes functionalized by one or more of those compounds alone, or in combination...
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7074738 |
Curing accelerator, epoxy resin composition, and semiconductor device
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device...
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7056978 |
Toughened epoxy-anhydride no-flow underfill encapsulant
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear...
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6946421 |
Latent catalyst
This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a...
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6887919 |
Pressure sensitive adhesive and its preparation
A pressure sensitive adhesive composed of a mixture comprising a) a styrene block copolymer having a star-shaped structure and a molecular weight Mw of more than 300,000 g/mol, or having elastomer...
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6881812 |
Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst
This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a...
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6830825 |
Epoxy resin composition and semiconductor device
An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame...
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6828407 |
Polymer electrolyte composition and uses thereof
The present invention provides a polymer electrolyte composition excellent in radical resistance and/or proton conductivity. The polymer electrolyte composition comprises an aromatic polymer...
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6803004 |
High throughput process for reactive extrusion of epoxy resin
The present invention provides low cost resins (e.g., advanced epoxy resins), processes for making these resins, and coatings made with theses resins. Specifically, the present invention provides...
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6800717 |
Acid catalyzed copolymerization of water and epoxy resin and uses thereof
Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product...
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6797821 |
Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins
The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured...
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6765043 |
Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof
An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin...
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6762251 |
Thermoplastic polyhydroxypolyether resin and an insulation film produced therefrom
The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and...
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6753086 |
Thermosetting resin composition, epoxy resin molding material and semiconductor device
An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl...
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6670017 |
Photocurable form-in-place gasket for electronic applications
Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin...
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6649728 |
Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition
A catalyst for curing epoxy resins comprises a tetraalkylphosphonium tetrafluoroborate represented by Formula (1): wherein R1, R2, R3, and R4 are each C1-C5 linear or branched alkyl and may be the...
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6645631 |
Flame retardant phosphorus element-containing epoxy resin compositions
A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from:(A) a non-halogenated...
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6613839 |
Polyepoxide, catalyst/cure inhibitor complex and anhydride
An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of gre...
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6599960 |
Storage-stable cationcally polymerized preparations with improved hardening characteristics
The invention relates to preparations with improved curing behavior, which are characterized in that they contain 0.0005 to 50 wt. % of soluble and/or fine-particle organic and/or inorganic...
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6562410 |
Heat curable epoxy compositions
Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic...
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6555628 |
Epoxy resins and process for making the same
A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by...
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6551714 |
Flame-retardant resin composition, and prepregs and laminates using such composition
The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition....
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6548620 |
Epoxy resin composition and process for producing the same
The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and...
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6548627 |
Flame-retardant phosphorus-modified epoxy resins
The present invention relates to novel flame-retardant phosphorus-containing epoxy resins with an epoxy value of from 0.05 to 1.0 moll 100 g containing structural units which derive from (A)...
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6531549 |
Crystallized epoxy resins, their production method, and curable compositions comprising them
A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epiha...
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6524989 |
Tetraorganophosponium dicyclic tetraorganoborate catalyst
This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a...
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6512074 |
Polymerization catalysts of oxirane compounds and process for preparing polymers of oxirane compounds using the catalysts
Polymerization catalysts of oxirane compounds are catalysts which are suitable to carry out suspension precipitation polymerization of the oxirane compounds in an organic solvent which cannot...
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6492483 |
Integrated continuous process for upstaging epoxy resins
The present invention discloses a continuous process and the associated system for upstaging liquid epoxy resins to produce resins with higher molecular weight. The process comprises passing...
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6462164 |
2-phenylimidazole-phosphoric acid salt as an accelerator for acid anhydride curatives in one-component epoxy compositions
A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for...
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6441064 |
Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions
A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, dicyandiamide latent heat activated curing agent and an accelerator for the...
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6420460 |
Cationically curable compositions containing triarylcyclopropenylium salts
The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and...
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6353080 |
Flame retardant epoxy resin composition
A flame retardant epoxy resin composition containing not more than 10% by wgt. of halogen, comprising an epoxy resin, stated concentrations of phosphoric acid ester, nitrogen—containing c...
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6346329 |
Curable resin composition
The present invention provides a curable resin composition with excellent low temperature curability and good storage stability, which comprises (A) a polyepoxide compound, (B) a curing agent...
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6335304 |
Metal salts of phosphoric acid esters as cross linking catalysts
A metal (M) alkyl acid phosphate catalyst for the reaction of an epoxy compound with a carboxyl compound to provide a coating formulation that is stable at room temperature; that is humidity...
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6306792 |
Evaluating moisture resistance reliability of phosphonium borate catalyst
The moisture resistance reliability of a latent catalyst is evaluated for a phosphonium borate wherein at least one group pendant on the boron atom is a group formed when a proton donor having at...
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6262189 |
Advanced epoxy resin from mixing polyepoxide and OH- or COOH-compound as feedstream
The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on...
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6255365 |
Epoxy resin composition for semiconductor encapsulation
An epoxy resin composition comprising (a) an epoxy resin comprising a mixture of the following components: (1) about 50-95 parts by weight of a novolak type epoxy resin, and (2) about 5-50 parts by...
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6235865 |
Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition
Phosphonium borate compounds of formula (1) are novel. ##STR1##R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at...
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6180695 |
Flame-retardant resin composition and semiconductor sealant using the same
The present invention provides a flame-retardant resin composition comprising: (A) an epoxy resin other than halogenated epoxy resins, having at least two epoxy groups in the molecule, (B) a curing...
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6153719 |
Thiol-cured epoxy composition
A composition that includes an epoxy compound, a thiol curing agent, a catalyst and a phosphorus--containing compound having at least one P--OH group and at least one organic moiety characterized...
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6022931 |
Advanced epoxy resins
The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on...
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5998568 |
Polyesters prepared from alkoxylated intermediates
A method for making a polyester resin comprises reacting a first polyfunctional alcohol or polyfunctional thiol and a carbonate in the presence of a catalyst to form an alkoxylated intermediate....
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5955551 |
Polyglycidyl ethers of secondary alcohols, their preparation, and curable compositions containing them
The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R1 represents (i) a straight chain or branched...
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5908902 |
Self-emulsifying aqueous epoxy resin dispersions
A selif-emulsifying epoxy resin (A), prepared from proportions by mass of (A-1) from 50 to 95% of one or more epoxide compounds having at least two epoxide groups per molecule and an epoxide group...
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5900469 |
Storage-stable, phosphorus-modified epoxy resins
The present invention relates to a storage-stable, phosphorus-modified epoxy resin having an epoxide value of 0.05 to 0.6 mol/100 g and comprising 5 to 25% by weight of an ester-anhydride formed...
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5824752 |
Process for the preparation of advanced resins
The invention provides for a process for the preparation of an advanced resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one...
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5821317 |
Adduct of bisepoxy compound and P guanamine
The invention pertains to an adduct obtainable by condensation of a bisepoxy compound and a P-guanamine according to the formula ##STR1## wherein X is CR3 R4 --(CR1 R2)n --CR5 R6 or o-phenylidene,...
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5811505 |
Energy-polymerizable compositions comprising a cyanate ester monomer or oligomer and a polyol
An energy-polymerizable composition derived from ingredients comprising: a cyanate ester monomer or oligomer comprising an organic radical bonded through aromatic carbon atoms to at least two --OCN...
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5747606 |
Increasing the molecular weight of polyesters and premix useful for this process
An increase in the molecular weight of polyester and recycled polyester can be achieved by blending said polyester with a difunctional epoxy resin and a sterically hindered...
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5734003 |
Charge transporting polymer, process for producing the same, and organic electronic device containing the same
A charge transporting polymer represented by formula ##STR1## wherein R represents a hydrogen atom, an alkyl group, an acyl group or --CONH--R, wherein R' represents an alkyl group or a substituted...
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