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7632895 |
Curable resin composition
A curable resin composition includes (A) a cationically polymerizable-compound, (B) a cationic photopolymerization initiator, and (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to...
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7608672 |
Infiltrant system for rapid prototyping process
An infiltrant system for rapid prototyping processes. The infiltrant system generally includes a resin component and a hardener component. The resin component typically includes an epoxy resin, and...
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7569163 |
Polythioether amine resins and compositions comprising same
Polythioether amine resin compounds and compositions comprising the same are disclosed.
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7566757 |
Flame retarding epoxy resin composition containing no halogen
The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding...
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7560501 |
Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic
An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of...
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7560143 |
Aqueous non-ionically stabilized epoxy resins
Aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC. Resins ABC are an adduct mixture of: adducts formed by the reaction of polyethylene glycol-modified epoxy...
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7547373 |
Two-part epoxy adhesives with improved flexibility and process for making and using same
A two-part epoxy adhesive having a resin component containing a mixture of an epoxy resin and an internally flexibilized epoxy resin and a hardener component containing a mixture of a flexibilizer...
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7514507 |
Comb-shaped epoxy resin and method for preparing comb-shaped epoxy resin
The present invention provides a comb-shaped epoxy resin represented by the following formula (1):
in the formula (1), X 1 and X 2 represent a divalent group having a residue selected from...
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7511097 |
Two-component adhesive of epoxy resins and amine compound
The present invention relates to a two-component epoxy adhesive composition comprising
a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being...
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7498384 |
Multi-component epoxy-amine primer systems comprising a polythioether
Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as...
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7498389 |
Multi-component kit of epoxy resin and mannich base components
A multi-component kit for a curable composition for fixing purposes, comprising an epoxy component (a), which comprises curable epoxides, and a hardener component (b), which comprises a Mannich...
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7491774 |
Producing granular epoxy resin by refining and pulverizing solid epoxy resin
A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and...
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7470755 |
Polyepoxide, amine and mercaptan-terminated polyoxyalkylene
Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component...
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7438782 |
Activatable material for sealing, baffling or reinforcing and method of forming same
An activatable material and articles incorporating the same is disclosed. The activatable material includes at least two of epoxy resin; impact modifier; blowing agent; curing agent; and filler....
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7423096 |
Underfill of resin and sulfonic acid-releasing thermally cleavable compound
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip...
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7410673 |
Smooth board and process for preparing a smooth board
The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form...
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7396885 |
Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board
A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid...
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7390859 |
Compositions and methods of making compositions exhibiting fuel resistance
Curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies, and methods of using curable compositions comprising polythioether polymers and polybasic acid-based...
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7388646 |
Perfluoropolyethers
Use in optical systems as liquids to transmit light at wave lengths lower than 250 nm, in particular at 157 nm, of perfluoropolyethers having the following formula:
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7384682 |
Electronic package with epoxy or cyanate ester resin encapsulant
An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor...
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7381359 |
Method for making filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and...
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7345140 |
Phenol-reacted non-ester alicyclic diepoxides
The present invention provides a non-ester type epoxy resin having a low hydrolytic chlorine content and containing no ester bond that is easily hydrolyzed, and a resin composition containing the...
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7321005 |
Encapsulant composition and electronic package utilizing same
A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a...
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7300963 |
Hardeners for water-based epoxy resin systems and processes for using the same
Hardeners for water-based epoxy resin systems, the hardeners being obtainable by reacting a mixture of: (A) at least one epoxidized polyalkylene oxide selected from the group of epoxidized...
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7294660 |
Epoxy resin composition
An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The...
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7285602 |
Granular epoxy resin, production method thereof, and granular epoxy resin package
A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the...
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7276563 |
Polyphenylene ether oligomer compound, derivatives thereof and use thereof
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a...
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7247684 |
Network polymers comprising epoxy-terminated esters
The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the...
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7244793 |
Adhesive compositions
Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include...
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7223820 |
Amine hardener for epoxy resins
Compounds of formula Ia or Ib
wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5,
E is an (m+1)-valent aliphatic,...
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7208228 |
Epoxy resin for fiber reinforced composite materials
An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing...
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7196124 |
Elastomeric material compositions obtained from castor oil and epoxidized soybean oil
Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally...
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7179552 |
Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board:
(A) an epoxy resin having 2 or more epoxy...
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7157143 |
Two-component epoxy adhesive formulation for high elongation with low modulus
Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one...
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7150913 |
Sizing agent for carbon fiber, aqueous dispersion of the same, carbon fiber treated by sizing, sheet comprising the carbon fiber, and carbon fiber-reinforced composite material
A sizing agent for carbon fiber comprising either a component (A) and a component (B), or alternatively, a component (A′), a component (B′) and a component (D), each of which is described...
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7150902 |
High Tg coatings
Articles are coated by applying a coating composition of a high T g phenoxy-type material having a T g of at least about 75° C. to at least a portion of a surface of an article, and forming a...
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7094844 |
Liquid epoxy resin composition and semiconductor device
A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is...
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7087684 |
Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same
Self-dispersing, hardenable epoxy resins produced by reacting one or more α,β-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed...
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7084207 |
Thermoplastic polyurethane composition and process for producing the same
The present invention provides a thermoplastic polyurethane composition which comprises an ethylene-vinyl alcohol copolymer and/or a polyamide, and a thermoplastic polyurethane, in which the...
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7041749 |
Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds
Photopolymerizable liquid oligomeric compositions are disclosed. The oligomeric compositions are formed from cycloaliphatic epoxides and Michael addition polyacrylate resins, synthesized from...
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7012120 |
Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a...
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7009009 |
Fluxing underfill compositions
A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset...
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6998011 |
Epoxy adhesive having improved impact resistance
In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated...
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6987161 |
Epoxy hardeners for low temperature curing
Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from...
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6955739 |
Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet...
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6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction...
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6924008 |
Curable resin composition, a method for the preparation thereof, and a coated article thereof
There are provided a curable resin composition composed of an epoxy compound having an ionic polymerizability and viscosity of not more than 1,000 cP at 25° C., an acrylic resin having an ionic...
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6916890 |
Thermally reworkable epoxy resins and compositions based thereon
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a...
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6890999 |
Coating powder of epoxy resin and low temperature curing agent
A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature...
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6887951 |
Solvent based epoxy-phenoxy solution and lacquers or inks formed therefrom
The present printing process provides a multilayer coating system comprising a low viscosity, latent, heat-curable thermoplastic adhesive layer, colored ink interlayer, and an abrasion-resistant...
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