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7618711 |
Resin coated metal plate having excellent formability, weldability and corrosion resistance, and worked articles using the resin coated metal plate and method for manufacturing same
A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the...
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7612153 |
Heterobifunctional poly(ethylene glycol) and uses thereof
The present invention provides bifunctional polymers, methods of preparing the same, and intermediates thereto. These compounds are useful in a variety of applications including the PEGylation of...
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7608672 |
Infiltrant system for rapid prototyping process
An infiltrant system for rapid prototyping processes. The infiltrant system generally includes a resin component and a hardener component. The resin component typically includes an epoxy resin, and...
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7608663 |
Method of preparing propionic acid-terminated polymers
The invention provides methods for preparing polymers bearing a terminal propionic acid. The method involves first reacting a water soluble and non-peptidic polymer comprising at least one hydroxyl...
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7591973 |
Method for producing a fiber-reinforced composite material plate
A method for producing a fiber-reinforced composite material plate by heating and pressurizing a prepreg for a molding time of 15 minutes or less, at a molding temperature of at least 120° C. and...
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7582706 |
Low chlorine content epoxy resin
The invention relates to epoxy resins having an extremely low content of chlorine, particularly a low content of organically bound chlorine. The invention also relates to a production method during...
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7572506 |
Aqueous primer surfacer compositions
The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components:
A)...
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7566757 |
Flame retarding epoxy resin composition containing no halogen
The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding...
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7560162 |
Electrodeposition coating composition, coating method and coated article
A coated article is obtained by electrodeposition coating using an electrodeposition coating composition, which comprises: (A) a resin component obtained by reacting an epoxy resin, an amino...
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7547373 |
Two-part epoxy adhesives with improved flexibility and process for making and using same
A two-part epoxy adhesive having a resin component containing a mixture of an epoxy resin and an internally flexibilized epoxy resin and a hardener component containing a mixture of a flexibilizer...
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7541093 |
Coating composition
A coating composition containing an epoxy resin and a curing agent comprising a trimer fatty triamine and/or higher oligomeric amine. The coating composition is particularly suitable for use as a...
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7541075 |
Sealant material for plastic liquid crystal display cells including one component epoxy resin composition
A sealant composition for a plastic liquid display cell is composed of a one-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid...
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7538166 |
Epoxy compounds and cured epoxy resins obtained by curing the compounds
Novel epoxy compounds represented by the general formula (1)
wherein Ar 1 , Ar 2 and Ar 3 are each optionally substituted phenylene, cyclohexanyl or the like, R 1 , R 2 , R 3 , R 4 , R 5 and...
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7528200 |
Epoxy hardener systems based on aminobis(methylene-ethyleneurea)
An epoxy-hardener system is provided having relatively long latency periods combined with relatively short cure times at low cure temperatures. The hardeners of the present invention are...
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7527863 |
Functionalized polyphenylene ether
An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The...
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7524394 |
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing...
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7521511 |
Thermosetting resin composition, multilayer body using same, and circuit board
Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions...
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7514507 |
Comb-shaped epoxy resin and method for preparing comb-shaped epoxy resin
The present invention provides a comb-shaped epoxy resin represented by the following formula (1):
in the formula (1), X 1 and X 2 represent a divalent group having a residue selected from...
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7504460 |
Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine
Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure:
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7501461 |
Composition of epoxy resin, aliphatic amine curing agent and halogenated amine
One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy...
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7501229 |
Anti-reflective coating containing sulfur atom
There is provided an anti-reflective coating forming composition comprising a solid content and a solvent, wherein a proportion of sulfur atom in the solid content is 5 to 25 mass %. The...
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7501087 |
Injection molding thermosetting resin composition into reinforcing fiber substrate
An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic...
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7498389 |
Multi-component kit of epoxy resin and mannich base components
A multi-component kit for a curable composition for fixing purposes, comprising an epoxy component (a), which comprises curable epoxides, and a hardener component (b), which comprises a Mannich...
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7495060 |
Tetrakisphenol and non-clathrated curing agent for epoxy resin
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when...
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7491789 |
Disulfide-containing phenolic resin as curing agent for epoxy resin
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1):
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7491774 |
Producing granular epoxy resin by refining and pulverizing solid epoxy resin
A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and...
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7491290 |
Two-pack type adhesive
Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials...
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7485362 |
Nanoporous laminates
A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups...
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7476444 |
Layer of reaction product of epoxy and phosphorus materials and curing agent on substrate
A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a...
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7470755 |
Polyepoxide, amine and mercaptan-terminated polyoxyalkylene
Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component...
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7468454 |
Amino-functional polyurethane prepolymers and a process for their preparation
The present invention relates to a process for preparing amino-functional polyurethane prepolymers by
a) preparing an NCO-functional polyurethane prepolymer by reacting an excess of one or...
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7459504 |
Reaction product of polyamine and acyclic carbonate
The present invention provides a film-forming composition. The composition includes a reaction product of:
a) a polyamine containing a primary amino group and a secondary amino group; and b)...
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7449526 |
Oligomeric, hydroxy-terminated phosphonates
Epoxy resins that are suitable for forming epoxy laminates that meet a UL-94 rating of V-0 comprise a hydroxy-terminated oligomeric phosphonate comprising the repeating structure...
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7442729 |
Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device...
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7442434 |
Epoxy resin composition
A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary...
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7431990 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack...
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7429800 |
Molding composition and method, and molded article
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than...
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7427652 |
Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler
An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared...
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7425594 |
Copolymer of glycidyl ester and/or ether with polyol
A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein...
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7425347 |
Composition for forming anti-reflective coating for use in lithography
The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a...
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7423097 |
Glycidyloxy groups-containing polybutadiene, mono-oxetane compound and cationic photoinitiator
A radiation curable resin composition comprises a glycidyloxy groups-containing polybutadiene or hydrogenated polybutadiene, a mono-oxetane compound or monofunctional epoxy compound, and a cationic...
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7423096 |
Underfill of resin and sulfonic acid-releasing thermally cleavable compound
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip...
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7414097 |
Curing epoxy resin with aliphatic diamine-styrene product and carboxyl- and hydroxyl-containing accelerator
The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing...
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7399502 |
Composition of perfluoroalkyl group-containing alkylsiloxy cycloaliphatic epoxy resin
An epoxy resin composition can be used for forming a film having excellent water-repellency on a substrate surface. The epoxy resin composition contains (a) an epoxy resin having at least two...
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7396902 |
Epoxy resin curing agent of aliphatic diamine/styrene addition product
The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing...
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7393419 |
Conductive adhesive rework method
A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies,...
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7390859 |
Compositions and methods of making compositions exhibiting fuel resistance
Curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies, and methods of using curable compositions comprising polythioether polymers and polybasic acid-based...
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7390570 |
Maleimide terminated rubber and curable composition produced by using the maleimide terminated rubber
An object of the present invention is to provide a curable composition which exhibits excellent toughness after the curing and excellent long term stability, as well as a rubber used in such...
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7388044 |
Coatings with enhanced water-barrier and anti-corrosive properties
The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids...
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7381359 |
Method for making filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and...
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