Matches 251 - 300 out of 1162 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
6297344 Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range  
A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.0...
6291627 Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide  
A flame-retardant epoxy resin was prepared by reacting an active-hydrogen-containing phosphorus compound with a di- or poly-functional epoxy resin via an addition reaction between the active...
6291626 Phosphorus-containing dihydric phenol or naphthol-advanced epoxy resin or cured  
Flame-retardant advanced epoxy resins and cured epoxy resins contain a rigid phosphorus group emanating from a dihydric phenol or naphthol which provides thermal and flame retardant properties. The...
6268409 Aqueous dispersion of binding agents, method for the production thereof and cathodic electrodeposition paints  
The invention relates to a binder (A) in aqueous dispersion which is obtainable by neutralization of the tertiary amino groups of an amino-epoxy resin a1) with acid and reaction of the resulting...
6265491 Curable thermoset resin composition  
A curable composition including a thermoset resin a curing agent component, an amount of a thermoplast component having reactive pendant and/or end groups, an organometallic curing catalyst...
6262189 Advanced epoxy resin from mixing polyepoxide and OH- or COOH-compound as feedstream  
The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on...
6239232 Polyetherimide or polysulphone with polyepoxide partially reacted with aromatic polyamine  
A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones and at least one epoxy resin modified by at least one aromatic...
6232411 Hydrogenated diglycidyl ethers of bipheny-4,4'-diol  
An epoxy compound formula (1), and a hydrogenation process for preparing thereof; ##STR1## wherein R 1 to R 4 each represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; n...
6218482 Epoxy resin, process for preparing the resin and photo-curable resin composition and resin composition for powder coatings containing the epoxy resin  
An epoxy resin containing group(s) of formula (1) and having a number average molecular weight of 400-10,000, an epoxy equivalent of 100-5,000 and an average number of glycidyl ether groups per...
6211293 Polycarbodiimide compound, production process thereof, resin composition, and treatment method of article  
A polyfunctional polycarbodiimide compound contains at least four molecular chains bonded independently to a backbone. Each of the molecular chains contains a carbodiimido (--NCN--) group....
6203871 Encapsulant for leads in an aqueous environment  
An article, specifically an inkjet printhead, having electrical leads in an aqueous environment in which the leads are encapsulated in a thoroughly cured mixture of 88 parts bis-phenol A epoxy...
6201070 Method for enhancing the toughness of cycloaliphatic epoxide-based coatings  
Methods are disclosed for enhancing the toughness, e.g., resistance to cracking upon flexation, of coatings made from cycloaliphatic epoxide derivatives wherein the cycloaliphatic epoxide...
6197882 Curable resin composition and adhesive  
A curable resin composition contains (A) a curable resin and (B) a ketimine structure-bearing organosilicon compound obtained by reacting an amino-functional alkoxysilane with a monocarbonyl...
6197898 Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent  
A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the...
6194615 Crosslinkers based on dibenzalacetone derivatives  
The present invention relates to the composition, process of preparation, and use of novel derivatives prepared from 1,5-bis-(4'-carbomethoxyphenyl)-1,4-pentadien-3-one. These novel compositions...
6174985 Epoxy resins with N-ester substituted imidazoles  
Curable mixtures comprising a) an epoxy resin having more than one 1,2-epoxy group per molecule and b) as curing catalyst, an imidazole compound of formula I ##STR1## wherein R 1 , R 2 ...
6169159 Alcohol-blocked brominated bisphenol a epoxy resin flame retardants for carbonyl-containing thermoplastic resins  
A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of...
6165558 Storage-stable moulding powder based on epoxy resins  
6159389 Polyether copolymer and crosslinked solid polymer electrolyte  
A polyether copolymer having a weight-average molecular weight of 10 4 to 10 7 , comprising 5 to 40% by mol of a repeating unit derived from epichlorohydrin, 95 to 60% by mol of a repeating unit...
6153672 Composition of tris-pyrrolidonyl triazine and polyfunctional active H-containing material  
A process for preparing a tris-lactam crosslinking agent, tris-pyrrolidonyl triazine, from N,N',N"-tris(4-chlorobutyryl)melamine by treatment of the chlorobutyryl derivative with a base such as...
6150460 Curable compositions containing novel polyfunctional crosslinking agents  
Novel polyfunctional glyoxylated compounds and compositions containing the same are disclosed which are particularly suitable for use as crosslinking components in curable compositions and also...
6150435 One-component epoxy resin for covering electronic components  
A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the...
6147169 Curable coating composition  
A curable coating composition comprising (A) a functional group-containing base resin and (B) a clathrate compound consisting of (i) at least one guest compound selected from the group consisting...
6133357 Mixtures of thermosets and oxidized polyarylene sulfides  
Polymer mixtures comprising at least one thermoset and at least one oxidized polyarylene sulfide have particularly good tribological behavior. Oxidized polyarylene sulfides used in these mixtures...
6113728 Process for connecting circuits and adhesive film used therefor  
An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is...
6107370 Single pack siliconized epoxy coating  
A single pack siliconized epoxy coating has been discovered that requires neither heat nor mixing with a catalytic curing agent immediately prior to application. The coating is comprised of an...
6107369 Crosslinked film of tris-pyrrolidonyl triazine and polyfunctional active H-containing material  
A process for preparing a tris-lactam crosslinking agent, tris-pyrrolidonyl triazine, from N,N',N"-tris(4-chlorobutyryl)melamine by treatment of the chlorobutyryl derivative with a base such as...
6107419 Process for preparation of high molecular weight epoxy resin  
Present invention relates to a process for preparing a high molecular weight epoxy resin which has a weight average molecular weight value more than 40,000 and an epoxy equivalent weight less than...
6096836 (Hetero)aromatic ether, (thio)ester or (thio)carbonate epoxy catalyst  
Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R 1 , (II)...
6087417 Epoxy resin/acid/tertiary amine reaction product with reactive diluent  
The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of epoxy resin, acid, and tertiary amine; (B) reactive diluent,...
6077929 Internally blocked polyamine crosslinkers and coating compositions containing the same  
The present invention pertains to coating compositions including a particular class of internally blocked polyamines as replacement for traditional blocked and unblocked polyamine crosslinkers. The...
6074574 Adhesion priming composition for toner fuser member  
A priming agent composition useful for binding a layer containing a fluorocarbon polymeric material to a metallic or an organic polymeric substrate comprises about 98 to 99.99 weight percent of a...
6069211 Chromate-free, one-part, non-curing corrosion inhibitive sealant with resistance to aviation fuel  
A non-curing sealant composition includes a monoepoxy compound, a polysulfide, and a tertiary amine catalyst, and optionally a liquid polythioether polymer having a functionality between about 2...
6057389 Curable compositions  
The present invention provides pourable curable composition which comprises the product obtained by mixing (a) a liquid epoxy resin containing a sufficient amount of a thixotropic agent to induce...
6057465 Arene-transition metal linkers for solid phase synthesis  
Compositions and methods for the solid phase synthesis of organic compounds are provided. The compositions are solid supports having an attached traceless linker precursor and are represented by...
6051632 Free-flowing compression molding compositions and processes for their production and use  
Free-flowing compression molding compositions made up of from about 40 to about 80 wt. % of organic filler, from about 20 to about 60 wt. % of an organic reactive resin, and optionally further...
6046284 Phenolic hydroxyl-containing resin by reacting epoxy resin with excess difunctional phenol and epoxidation thereof  
6045898 Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures  
The present invention provides a prepreg having an excellent self adhesiveness to a honeycomb core, a low porosity when used as skin panels, an excellent surface smoothness due to a low surface...
6045650 Hydrophilic materials and their method of preparation  
A process is described for applying a solid coating onto a surface of an article. The surface of an article has a first physical property measurable as a degree of hydrophobicity and/or...
6040397 Extremely low viscosity matrix epoxy suffusion resin system  
A single component, extremely low viscosity, pre-catalyzed high functionality diepoxide and epoxy resin system has been developed. This resin system has good thermal stability, an extended work...
6037425 Epoxy resin composition  
The present invention provides an epoxy resin composition useful for casting applications, comprising a reaction product obtained by reacting (A) a bisphenol epoxy resin, and (B) bisphenol...
6022931 Advanced epoxy resins  
The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on...
6011130 Epoxy resin composition and process for producing the same  
Provided is an epoxy resin composition comprising a crystalline epoxy resin and an amorphous epoxy curing agent, wherein the crystalline epoxy resin is dispersing uniformly in the amorphous epoxy...
6005060 Epoxy resin composition and cured composite product  
The present invention provides an epoxy resin composition which can provide a cured composite product having a high heat resistance, and an excellent mechanical strength at a high temperature. The...
6001428 Solid epoxy resin compositions crosslinkable with UV rays  
1. A solid composition comprising (a) a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester, a mixture of a solid oligomeric, cationically polymerisable...
6001483 Modified alkyl-terminated encapsulant for semiconductor of epoxy resin and polyethylene oxide  
A composition useful as an encapsulating material for photosemiconductor elements such as a photodetector or light emmitor comprises an epoxy resin, a hardener and at least one compound represented...
5989627 Vinyl ether terminated oligomers and polymers  
The specification describes processes for synthesizing vinyl ether functionalized oligomers or polymers, and methods for coating optical fibers with formulations containing these oligomers or...
5985455 Semiconductor element sealed with an epoxy resin compound  
Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential...
5981629 Epoxy system for bonding to unsanded polymer-coated fiberglass surfaces  
A two-component system for forming a sealing composition for bonding to unsanded, polymer-coated fiberglass surfaces. The system includes a resin component containing a major amount of epoxy resin,...
5972423 Primerless substrate repair with polyepoxide and polythiol  
A primerless method for repairing a substrate surface that includes applying to the surface a curable filler composition that includes (i) an epoxy compound, (ii) a polythiol curing agent, and...
Matches 251 - 300 out of 1162 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >