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7541410 |
Thermosetting resin composition, thermosetting resin molding compound and cured product thereof
A thermosetting resin composition comprising a novolac-type phenolic resin, a polyacetal resin and a cyclohexyl compound represented by the general formula (1) as a curing catalyst, a thermosetting...
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7538165 |
Conductive polyaniline composition, film thereof and processes for producing these
The invention provides an electrically conductive polyaniline composition comprising polyaniline which contains at least one of novolac resins selected from the group consisting of phenolsulfonic...
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7495060 |
Tetrakisphenol and non-clathrated curing agent for epoxy resin
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when...
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7390847 |
Polymer derivatives for the treatment of metals
A composition for the treatment of metal surfaces and for the deposition of metals or metal alloys on plastics surfaces contains
a) at least one polymer as component A, composed of the structural...
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6902766 |
Two-part aqueous metal protection treatment
A two-part metal protection composition includes: an aqueous metal treatment conversion coating component that includes an admixture of an acid and a coating forming component; and an aqueous...
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6881799 |
Curing agent for epoxy resins and epoxy resin composition
A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde...
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6815491 |
Reinforced thermoplastic composition and articles derived therefrom
A reinforced thermoplastic composition includes a poly(arylene ether), a poly(alkenyl aromatic) compound, a polyolefin, a hydrogenated block copolymer with a high alkenyl aromatic content, a...
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6727325 |
Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when...
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6653371 |
One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a...
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6586498 |
Ink jet ink
An ink jet ink composition comprising from about 0.5% to about 30% by weight of a pigment, a carrier and a dispersant, the dispersant comprising an anionic derivative of an ethoxylated...
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6538048 |
Ink jet printing method
An ink jet printing method, comprising the steps of: A) providing an ink jet printer that is responsive to digital data signals; B) loading the printer with ink jet recording elements; C) loading...
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6437058 |
Polymers and positive resist compositions
A polymer in the form of a novolac resin is provided wherein the novolac resin has a weight average molecular weight of 1,000-30,000, some of the hydrogen atoms of hydroxyl groups are replaced by...
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6387987 |
Acetylide-form propargyl-containing resin composition for cationic electrocoating
An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to...
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6380322 |
Reworkable high temperature adhesives
A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones,...
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6265491 |
Curable thermoset resin composition
A curable composition including a thermoset resin a curing agent component, an amount of a thermoplast component having reactive pendant and/or end groups, an organometallic curing catalyst...
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6232368 |
Ester cured binders
An embodiment of the present invention provides a method for improving the tensile strength of foundry cores and molds over what may be conventionally achieved. The use of acidic methylene...
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6218481 |
Acetylide-form propargyl-containing epoxy resin composition for cationic electrocoating
An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to...
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6130289 |
Aqueous phenolic dispersion
An aqueous phenolic resin dispersion that includes an aqueous continuous phase and, dispersed within the aqueous phase, the reaction product of a phenolic resin precursor and a modifying agent...
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6001428 |
Solid epoxy resin compositions crosslinkable with UV rays
1. A solid composition comprising (a) a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester, a mixture of a solid oligomeric, cationically polymerisable...
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5998575 |
Compatibilizing agent and method of producing the same
A polymer alloy is obtained by adding a hydrophobic compound (1) having a hydrophobic main chain and a functional group containing an active hydrogen atom and a bisoxazoline compound (2) shown by...
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5972423 |
Primerless substrate repair with polyepoxide and polythiol
A primerless method for repairing a substrate surface that includes applying to the surface a curable filler composition that includes (i) an epoxy compound, (ii) a polythiol curing agent, and...
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5925719 |
Photoresist developable in aqueous base made from acid-functional β-hydroxy thiol resin
A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a...
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5907015 |
Aqueous silane adhesive compositions
An adhesive composition based on a combination of a water soluble amino silane and a normally water-immiscible alkenyl-functional silane wherein the latter is hydrolyzed in the presence of the...
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5817736 |
Epoxy resin mixtures for prepregs and composites based on phosphorus-modified epoxies, dicy and/or aminobenzoic compounds
Epoxy resin mixtures to produce prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural...
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5747599 |
Thermosetting coating composition
Disclosed is a thermosetting coating composition comprising (A) an epoxy compound and (B) an aromatic sulfonium salt represented by the formula ##STR1## wherein R 1 represents a hydrogen atom, a...
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5736196 |
Fluid cure of epoxy-based coating powder
A coating powder based on an epoxy resin is applied to a substrate and fused and cured thereon. Curing is effected by exposing the coating powder at the point of application to a fluid curative or...
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5712039 |
Epoxy adhesives with dithiooxamide adhesion promoters
The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula I: ##STR1## in...
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5667894 |
Cathodic electrocoating compositions containing methane sulfonic acid as a neutralizing agent
An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct which is of an epoxy resin that has been reacted with an amine, and a blocked polyisocyanate...
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5648171 |
Epoxy resin mixtures containing phosphorus acid/epoxy resin adducts
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame...
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5621071 |
Mesogenic novolacs and resins
The present invention discloses novolacs and thermosets thereof containing mesogenic moieties. Certain of said novolacs and thermosets thereof exhibit nonlinear optical properties upon orientation.
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5605984 |
Polymeric compositions and components thereof
Polymer compositions comprising phenol/formaldehyde systems and polyarylsulphones having epoxy pendent or end groups are disclosed together with novel epoxy-ended polyarylsulphones and novel...
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5589553 |
Esterification product of aromatic novolak resin with quinone diazide sulfonyl group
A resin suitable for use as a photoresist that is the esterification product of an o-quinonediazide compound and an aromatic novolak resin. The aromatic novolak resin may be the condensation...
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5587243 |
Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame...
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5541263 |
Polymer having inert blocking groups
An alkali soluble resin, preferably a phenolic resin, having a portion of its phenolic hydroxyl groups reacted to form a blocking group inert to acid or base. The polymer is used for the...
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5541000 |
Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms
A thermally-curable aromatic amine-epoxy composition comprises (a) at least one polyepoxy compound; (b) a curing amount of at least one aromatic polyamine compound; and (c) a catalytically...
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5532314 |
Aqueous silane-phenolic adhesive compositions, their preparation and use
A stable aqueous adhesive composition based on a combination of a normally water-immiscible organo-functional silane and a phenolic resole wherein the silane is dispersed in a stabilized aqueous...
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5494981 |
Epoxy-cyanate ester compositions that form interpenetrating networks via a Bronsted acid
A polymerizable composition of matter comprises a cycloaliphatic epoxy resin, a cyanate ester resin, optionally a polyol, and, as initiator, a Bronsted acid. When cured, the compositions provide...
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5457159 |
Process for the preparation of plastoelastomeric compositions based on a thermoplastic olefinic polymer with an alkylphenol-formaldehydic resin and sodium bisulphite
Process for the preparation of plastoelastomeric preparations comprising an elastomeric phase of an EPDM elastomer and a plastomeric phase of a thermoplastic olefinic polymer, wherein the...
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5447797 |
Reaction resin mixture comprising epoxy resin, benzylthiolanium salt and sensitizer
A reaction resin mixture, which is able to be hardened thermally and by means of UV radiation, contains the following constituents: a cationically polymerizable epoxide resin; a latent...
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5436049 |
Process for the manufacture of a stain resistant carpet
A process for the manufacture of a stain resistant carpet by melt mixing a fiber forming synthetic polyamide with a compound, being capable to react with an amino group, to form a homogeneous...
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5434224 |
Thermoset and polyarylsulfone resin system that forms an interpenetrating network
A polymer composition especially suitable for producing fiber-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component,...
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5428117 |
Treatment for imparting stain resistance to polyamide substrates and resulting stain resistant materials
A composition for imparting stain resistance to polyamide substrates comprising a sulfonated fatty composition and sulfonated hydroxyaromatic formaldehyde condensation polymer. A method for making...
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5403655 |
Toughened thermosetting resin composites and process
Toughened thermosetting resins are disclosed comprising a thermosetting resin having a Tg of at least 150° C., preferably 180° C., and having dispersed substantially uniformly therethrough...
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5376453 |
Epoxy resin compounds in admixture with glycidyl phosphorus compounds and heterocyclic polyamines
The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add...
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5364914 |
Moulding composition comprising a thermoset component and thermoplast component
A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60° C., flowable under shear and self-adhesive at temperatures in...
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5281644 |
Ambient temperature hardening binder compositions
There are disclosed methods and compositions for retarding the ambient temperature hardening of a phenolic resole resin alone or with an aggregate when such resin is contacted with a nitroalkane...
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5278022 |
Polymeric compounds having pendant sulphonate groups for use in a radiation sensitive composition
A polymeric compound is derived from a polyhydric material and has pendant sulphonate groups of the general formula ##STR1## where X is an aliphatic, aromatic, carbocylic or heterocyclic group; Y...
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5248707 |
Accelerators for refractory magnesia
The hardening of a composition containing a phenolic resin solution and a magnesia aggregate is effected by mixing into such composition at a pH of at least 4.5: a compound which provides an...
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5238777 |
Bakeable aqueous photopolymers and their use in printing plates
A radiation-sensitive compound, which comprises a polymer including a plurality of azide-substituted aromatic ester groups and a plurality of carboxylic or sulphonic acid groups capable of...
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5145889 |
Acid anhydride-cured epoxy resin encapsulant with triorganothiophosphite
A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating...
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