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7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
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7538150 |
Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin
The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a...
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7501087 |
Injection molding thermosetting resin composition into reinforcing fiber substrate
An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic...
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7495060 |
Tetrakisphenol and non-clathrated curing agent for epoxy resin
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when...
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7470752 |
Powder coating of amino-urea or urethane catalyst and epoxy and/or siloxane resin
Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure
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7427652 |
Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler
An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared...
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7423096 |
Underfill of resin and sulfonic acid-releasing thermally cleavable compound
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip...
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7410673 |
Smooth board and process for preparing a smooth board
The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form...
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7396885 |
Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board
A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid...
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7381788 |
Method for continuous production of polyamide
Provided is a continuous production method of a polyamide with stabilized polymerization degree and good quality, particularly an aromatic-containing polyamide. A continuous production method of a...
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7354978 |
Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound
One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this...
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7244793 |
Adhesive compositions
Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include...
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7230052 |
Epoxy resin composition and fiber reinforced composite material using epoxy resin composition
A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa·s and provides a cured product displaying a breaking elongation of at...
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7217782 |
Cooling of pellets from pet solid stating reactor with water
Energy savings are realized during the commercial production of polyethylene terephthalate by partially cooling polyethylene terephthalate pellets exiting a solid stating reactor by contact with...
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7148294 |
Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials
An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic...
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7108806 |
Conductive materials with electrical stability and good impact resistance for use in electronics devices
A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more...
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7094844 |
Liquid epoxy resin composition and semiconductor device
A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is...
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7091286 |
Low-cure powder coatings and methods for using the same
Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure
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7087684 |
Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same
Self-dispersing, hardenable epoxy resins produced by reacting one or more α,β-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed...
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7012120 |
Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a...
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7008555 |
Epoxy resin curing agents and epoxy resin compositions
A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The...
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6992151 |
Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same
The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between...
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6987161 |
Epoxy hardeners for low temperature curing
Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from...
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6955739 |
Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet...
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6951907 |
Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy...
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6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction...
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6916890 |
Thermally reworkable epoxy resins and compositions based thereon
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a...
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6890999 |
Coating powder of epoxy resin and low temperature curing agent
A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature...
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6875825 |
Composition of bisphenol or novolak epoxy resin, epoxy resin from monoaromatic backbone and aromatic amine
A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa's, and provides a cured product displays a breaking elongation of at least...
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6864354 |
Modified polyamides, polyamide compositions, and method for making same
The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional...
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6818318 |
Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex
Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least...
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6812299 |
Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin
The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form...
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6780943 |
Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin
A resin composition useful in the fabrication of circuit boards comprises (i) 1˜15 W % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene...
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6743375 |
Epoxy hardener of imidazole or trihydric compound with methylol groups, trimethylolpropane and tetramethylguanidine (adduct)
An epoxy resin hardener having a cure temperature of between about 60° C. and 100° C. comprises a mixture of: a) an imidazole or a trihydric compound having methylol groups at the 2- and...
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6723803 |
Adhesive of flexible epoxy resin and latent dihydrazide
Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not...
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6713571 |
Process for producing epoxy resin composition for photosemiconductor element encapsulation
A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for...
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6670430 |
Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes
Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at...
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6653412 |
Monoamine or polyamine reacted with polyepoxide/monoamine or polyamine precursor, epoxy resin and epoxide thinner
A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an...
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6649729 |
Novolaks as water-unaffected accelerators for epoxy resin hardeners
Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as...
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6646065 |
Product of mono or polyamine and polyepoxide-amine precursor, epoxy resin-amine adduct, monoepoxide-amine adduct and epoxide thinner
A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an...
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6569959 |
Modified phenolic hydroxyl-containing resin by reacting epoxy resin with difunctional phenol
A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500...
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6565772 |
Conductive resin composition
A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure...
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6518331 |
Composition of epoxy resins and curing agent capable of being coarsened
A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production...
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6515047 |
Composition of epoxy resin and triazine-formaldehyde-phenol resin
An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B)...
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6512031 |
Epoxy resin composition, laminate film using the same, and semiconductor device
An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into...
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6491845 |
Epoxy hardener of phenolic or 2° OH polyol and methylol polyol
Hardeners for epoxy resins are disclosed which have the capability of curing at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties....
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6482899 |
Curable resin composition
A latent curing agent is disclosed for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one epoxy groups on the average in the molecule and...
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6462147 |
Epoxy resin compositions for printed circuit board and printed circuit board using the same
An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or...
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6432539 |
Phosphorus-containing polymer having phenolic units and uses thereof
A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy...
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6410658 |
Polyepoxide/polyether mono- or polyamine precursor reacted with mono- or polyamine, epoxy resin-amine adduct and monoepoxide-amine adduct
A curing agent for epoxy resin comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and, optionally, a monoepoxide to obtain an...
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