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8445605 |
Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom
The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant...
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8445590 |
Compositions useful for preparing composites and composites produced therewith
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional...
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8440781 |
Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest...
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8440771 |
Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
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8420749 |
Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest...
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8399576 |
Phosphorus containing novalac phenol resins, methods for manufacturing the same, and formulae containing the same
Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from —, —CH2—, ...
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8362116 |
Low dielectric resin varnish composition for laminates and the preparation thereof
A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or...
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8349989 |
Method of sealing a semiconductor element with an epoxy resin composition
A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound...
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8324326 |
Epoxy resin composition and semiconductor device
An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein...
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8293132 |
Phenalkamine and salted amine blends as curing agents for epoxy resins
The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin,...
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8278401 |
Radiation or thermally curable barrier sealants
This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted...
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8217115 |
Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° ...
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8202948 |
Phosphorus-containing compounds useful for making halogen-free ignition-resistant polymers
Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P═O; the group P—H and the group...
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8198381 |
Phenol aralkyl epoxy resin with secondary hydroxyl groups
Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1)...
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8173745 |
Compositions useful for preparing composites and composites produced therewith
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional...
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8168731 |
Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board...
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8153709 |
Halogen-free prepreg and resin for preparing the same
A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant,...
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8143357 |
Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
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8124716 |
Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound
Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P═O; the group P—H and the group...
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8093105 |
Method of fabricating a capillary-flow underfill compositions
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method...
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8084553 |
Curable adhesive compositions, process, and applications
The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected...
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8058362 |
Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications
An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A...
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8048969 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of...
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8039560 |
Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof
The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the...
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8022151 |
Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof
Provided are: an adamantane derivative represented by the following general formula (I) giving a cured product excellent in optical characteristics such as transparency and light resistance,...
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8013039 |
Encapsulant composition for a light-emitting diode
An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy...
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7994271 |
Phenolic resin, production method and use thereof
Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also...
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7989561 |
Composition of liquid, solid and semisolid epoxy resins
A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and ...
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7985808 |
Distortional matrix of epoxy resin and diamine
The disclosure relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von...
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7968194 |
Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
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7968195 |
Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
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7960483 |
Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition
An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W...
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7948090 |
Capillary-flow underfill compositions, packages containing same, and systems containing same
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method...
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7884172 |
Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane
To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy...
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7799852 |
Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler
An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure...
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7786223 |
Epoxy resin and curing agent of di- and/or mono-glycidyether/monoamine-polyamine reaction product
A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, andb) as curing agent a composition comprisingb1) 40-100 wt % of a reaction product...
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7781543 |
Curable alicyclic diepoxy resin composition
An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic...
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7745549 |
Distortional matrix of epoxy resin and diamine
The invention relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von...
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7723444 |
Epoxy resin composition, process for providing latency to the composition and a semiconductor device
An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component...
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7696286 |
Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing...
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7671114 |
Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing...
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7666953 |
Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent
The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring...
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7662902 |
Phenolic resin with low level of free bisphenol
A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an...
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7655386 |
Polymer having antireflective properties, hardmask composition including the same, process for forming a patterned material layer, and associated device
An antireflective hardmask composition includes an organic solvent, and at least one polymer represented by Formulae A, B or C: In Formulae A and B, the fluorene group is unsubstituted or...
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7595144 |
Sulfonate-containing anti-reflective coating forming composition for lithography
There is provided an anti-reflective coating forming composition for lithography comprising a polymer compound, a crosslinking compound, a crosslinking catalyst, a sulfonate compound and a solvent....
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7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
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7504471 |
Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1— (1) wherein R1 represents a hydrocarbon...
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7491789 |
Disulfide-containing phenolic resin as curing agent for epoxy resin
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1— (1) wherein R1 represents a hydrocarbon...
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7491774 |
Producing granular epoxy resin by refining and pulverizing solid epoxy resin
A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and...
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7479527 |
Polyepoxide and reaction product of aminoalkylimidazole, polyamine, urea and diepoxide as curing component
A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a...
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