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7595144 |
Sulfonate-containing anti-reflective coating forming composition for lithography
There is provided an anti-reflective coating forming composition for lithography comprising a polymer compound, a crosslinking compound, a crosslinking catalyst, a sulfonate compound and a solvent....
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7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
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7504471 |
Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1):
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7491789 |
Disulfide-containing phenolic resin as curing agent for epoxy resin
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1):
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7491774 |
Producing granular epoxy resin by refining and pulverizing solid epoxy resin
A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and...
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7479527 |
Polyepoxide and reaction product of aminoalkylimidazole, polyamine, urea and diepoxide as curing component
A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a...
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7470754 |
Biphenylaralkyl epoxy and phenolic resins
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent...
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7442729 |
Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device...
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7425598 |
Adhesive of epoxy resin and curing agent with xylylene diamine structure
The present invention provides an adhesive for laminates containing, as a main component, an epoxy resin composition comprising an epoxy resin and an epoxy resin-curing agent, the epoxy resin...
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7423096 |
Underfill of resin and sulfonic acid-releasing thermally cleavable compound
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip...
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7345102 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D):
(A) an epoxy resin component comprising a novolak type epoxy resin having at...
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7307128 |
Epoxy compound, preparation method thereof, and use thereof
The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property...
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7285602 |
Granular epoxy resin, production method thereof, and granular epoxy resin package
A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the...
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7271225 |
Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition
A phosphorus-containing epoxy resin has a structural unit derived from a secondary phosphine derivative represented by the following formula:
wherein R 1 represents an alkylene group that may...
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7268191 |
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby
A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy...
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7265167 |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the...
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7259213 |
Indole resins epoxy resins and resin compositions containing the same
This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as...
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7247683 |
Low voiding no flow fluxing underfill for electronic devices
A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about...
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7098276 |
Flame-retardant epoxy resin composition and semiconductor device made using the same
An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure...
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7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an...
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7094843 |
Epoxy compositions having improved shelf life and articles containing the same
Epoxy systems having improved shelf life are disclosed. The epoxy systems are suitable for use in a number of applications, including as an adhesive or as a sealant (e.g., as a component in a...
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7087664 |
Resin film and multilayer printed wiring board using thereof
A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content...
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7009009 |
Fluxing underfill compositions
A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset...
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7001560 |
Molding resin composition and method of molding
The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for...
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6992151 |
Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same
The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between...
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6955739 |
Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet...
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6946421 |
Latent catalyst
This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a...
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6942922 |
Cationic paint composition
The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy...
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6933618 |
Tablet comprising epoxy resin composition
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the...
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6916890 |
Thermally reworkable epoxy resins and compositions based thereon
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a...
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6916539 |
Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof
A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum...
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6900270 |
Curable coating compositions with carbamate compounds
Provided is a curable coating composition comprising a reactive compound having one or more structures of the formula:
wherein X is a primary carbamate group, Y is a hydroxy or halide group, n...
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6890994 |
Curable coating compositions with carbamate-containing acrylic polymers
The invention provides an acrylic polymer or oligomer comprising random repeating units of the formula:
a method of making said polymers and curable coating compositions comprising the same.
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6881812 |
Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst
This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a...
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6858674 |
Carbamate functional materials, a method of making said materials, and curable coating compositions containing said materials
The invention provides a primary carbamate functional material of the formula:
a method of making said materials and curable coating compositions comprising the primary carbamate functional...
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6852263 |
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the...
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6831129 |
Resin-coated copper foil, and printed wiring board using resin-coated copper foil
An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water...
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6815495 |
Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder
A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at...
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6784260 |
Powder coating of thermosetting resin(s), polyphenylene ether(s) and curing agent(s)
A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins;...
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6749927 |
Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom
A dielectric resin composition comprising at least one type of epoxy resin and at least one type of cyanate ester which would react with said epoxy resin, together with a metal ion catalyst system,...
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6727325 |
Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when...
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6723803 |
Adhesive of flexible epoxy resin and latent dihydrazide
Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not...
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6713571 |
Process for producing epoxy resin composition for photosemiconductor element encapsulation
A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for...
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6664344 |
Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That...
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6664325 |
Fiber processing agent, reinforcing fiber processed by the fiber processing agent and rubber product reinforced by the reinforcing fiber
A reinforcing fiber is provided, which can exhibit sufficient adhesive strength even with single layer film coating, a fiber processing agent which can enhance the strength of adhesion between the...
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6646064 |
Reacting epoxy resin with p-containing dihydric phenol or naphthol
A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of...
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6616984 |
Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl
A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R 1...
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6613848 |
Phosphorus-containing phenolic, thiophenolic or aminophenyl flame-retardant hardener, and epoxy resins cured thereby
A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl...
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6608161 |
Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same
The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a...
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6605354 |
High nitrogen containing triazine-phenol-aldehyde condensate
There is disclosed a triazine-phenol-aldehyde condensate which contains at least 15% of nitrogen, has a melt viscosity of not greater than 2,000 cps at 175° C. and a solubility of at least 80% by...
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