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8653205 Resin composition for encapsulating semiconductor and semiconductor device  
Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy...
8648154 Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition  
This invention relates to a novel phosphorus-containing phenol novolac resin, use of the phosphorus-containing phenol novolac resin as a halogen-free flame retardant epoxy hardener, and an epoxy...
8642709 Epoxy resin composition with reduced toxicity  
The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which...
8617930 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device  
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
8586699 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8563661 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8541516 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8530604 Deformable shape-memory polymer  
A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first...
8523967 Liquid resin composition for abrasive articles  
The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° ...
8518527 Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg. laminate for printed circuit made by the method  
The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that...
8519067 Epoxy resin composition and semiconductor device  
An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein...
8519065 Epoxy compound, curable composition, and cured product thereof  
A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a...
8445605 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom  
The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant...
8445590 Compositions useful for preparing composites and composites produced therewith  
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional...
8440781 Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin  
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest...
8440771 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8420749 Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin  
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest...
8399576 Phosphorus containing novalac phenol resins, methods for manufacturing the same, and formulae containing the same  
Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from —, —CH2—, ...
8362116 Low dielectric resin varnish composition for laminates and the preparation thereof  
A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or...
8349989 Method of sealing a semiconductor element with an epoxy resin composition  
A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound...
8324326 Epoxy resin composition and semiconductor device  
An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein...
8293132 Phenalkamine and salted amine blends as curing agents for epoxy resins  
The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin,...
8278401 Radiation or thermally curable barrier sealants  
This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted...
8217115 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package  
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° ...
8202948 Phosphorus-containing compounds useful for making halogen-free ignition-resistant polymers  
Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P═O; the group P—H and the group...
8198381 Phenol aralkyl epoxy resin with secondary hydroxyl groups  
Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1)...
8173745 Compositions useful for preparing composites and composites produced therewith  
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional...
8168731 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same  
Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board...
8153709 Halogen-free prepreg and resin for preparing the same  
A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant,...
8143357 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8124716 Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound  
Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P═O; the group P—H and the group...
8093105 Method of fabricating a capillary-flow underfill compositions  
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method...
8084553 Curable adhesive compositions, process, and applications  
The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected...
8058362 Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications  
An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A...
8048969 Semiconductor encapsulating epoxy resin composition and semiconductor device  
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of...
8039560 Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof  
The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the...
8022151 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof  
Provided are: an adamantane derivative represented by the following general formula (I) giving a cured product excellent in optical characteristics such as transparency and light resistance,...
8013039 Encapsulant composition for a light-emitting diode  
An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy...
7994271 Phenolic resin, production method and use thereof  
Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also...
7989561 Composition of liquid, solid and semisolid epoxy resins  
A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and ...
7985808 Distortional matrix of epoxy resin and diamine  
The disclosure relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von...
7968194 Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler  
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
7968195 Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler  
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
7960483 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition  
An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W...
7948090 Capillary-flow underfill compositions, packages containing same, and systems containing same  
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method...
7884172 Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane  
To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy...
7799852 Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler  
An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure...
7786223 Epoxy resin and curing agent of di- and/or mono-glycidyether/monoamine-polyamine reaction product  
A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, andb) as curing agent a composition comprisingb1) 40-100 wt % of a reaction product...
7781543 Curable alicyclic diepoxy resin composition  
An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic...
7745549 Distortional matrix of epoxy resin and diamine  
The invention relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von...