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8445605 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom  
The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant...
8445590 Compositions useful for preparing composites and composites produced therewith  
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional...
8440781 Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin  
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest...
8440771 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8420749 Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin  
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest...
8399576 Phosphorus containing novalac phenol resins, methods for manufacturing the same, and formulae containing the same  
Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from —, —CH2—, ...
8362116 Low dielectric resin varnish composition for laminates and the preparation thereof  
A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or...
8349989 Method of sealing a semiconductor element with an epoxy resin composition  
A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound...
8324326 Epoxy resin composition and semiconductor device  
An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein...
8293132 Phenalkamine and salted amine blends as curing agents for epoxy resins  
The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin,...
8278401 Radiation or thermally curable barrier sealants  
This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted...
8217115 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package  
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° ...
8202948 Phosphorus-containing compounds useful for making halogen-free ignition-resistant polymers  
Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P═O; the group P—H and the group...
8198381 Phenol aralkyl epoxy resin with secondary hydroxyl groups  
Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1)...
8173745 Compositions useful for preparing composites and composites produced therewith  
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional...
8168731 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same  
Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board...
8153709 Halogen-free prepreg and resin for preparing the same  
A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant,...
8143357 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers  
Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly...
8124716 Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound  
Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P═O; the group P—H and the group...
8093105 Method of fabricating a capillary-flow underfill compositions  
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method...
8084553 Curable adhesive compositions, process, and applications  
The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected...
8058362 Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications  
An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A...
8048969 Semiconductor encapsulating epoxy resin composition and semiconductor device  
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of...
8039560 Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof  
The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the...
8022151 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof  
Provided are: an adamantane derivative represented by the following general formula (I) giving a cured product excellent in optical characteristics such as transparency and light resistance,...
8013039 Encapsulant composition for a light-emitting diode  
An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy...
7994271 Phenolic resin, production method and use thereof  
Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also...
7989561 Composition of liquid, solid and semisolid epoxy resins  
A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and ...
7985808 Distortional matrix of epoxy resin and diamine  
The disclosure relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von...
7968194 Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler  
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
7968195 Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler  
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which ...
7960483 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition  
An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W...
7948090 Capillary-flow underfill compositions, packages containing same, and systems containing same  
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method...
7884172 Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane  
To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy...
7799852 Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler  
An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure...
7786223 Epoxy resin and curing agent of di- and/or mono-glycidyether/monoamine-polyamine reaction product  
A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, andb) as curing agent a composition comprisingb1) 40-100 wt % of a reaction product...
7781543 Curable alicyclic diepoxy resin composition  
An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic...
7745549 Distortional matrix of epoxy resin and diamine  
The invention relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von...
7723444 Epoxy resin composition, process for providing latency to the composition and a semiconductor device  
An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component...
7696286 Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator  
A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing...
7671114 Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder  
In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing...
7666953 Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent  
The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring...
7662902 Phenolic resin with low level of free bisphenol  
A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an...
7655386 Polymer having antireflective properties, hardmask composition including the same, process for forming a patterned material layer, and associated device  
An antireflective hardmask composition includes an organic solvent, and at least one polymer represented by Formulae A, B or C: In Formulae A and B, the fluorene group is unsubstituted or...
7595144 Sulfonate-containing anti-reflective coating forming composition for lithography  
There is provided an anti-reflective coating forming composition for lithography comprising a polymer compound, a crosslinking compound, a crosslinking catalyst, a sulfonate compound and a solvent....
7544727 Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate  
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
7504471 Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive  
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1— (1) wherein R1 represents a hydrocarbon...
7491789 Disulfide-containing phenolic resin as curing agent for epoxy resin  
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1— (1) wherein R1 represents a hydrocarbon...
7491774 Producing granular epoxy resin by refining and pulverizing solid epoxy resin  
A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and...
7479527 Polyepoxide and reaction product of aminoalkylimidazole, polyamine, urea and diepoxide as curing component  
A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a...