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7615595 |
Adhesive of epoxy resin, diene copolymer-modified epoxy resin, phenolic-terminated elastomeric toughener and polyester segment polymer
The present invention relates to an epoxy adhesive composition comprising
a) a first epoxy resin, b) a second epoxy resin modified with a copolymer based on a 1,3-diene and a polar, ethylenically...
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7432335 |
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same
There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of...
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7423096 |
Underfill of resin and sulfonic acid-releasing thermally cleavable compound
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip...
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7393895 |
Forming concentrate of poly(arylene ether), thermosetting resin and compatibilizer
A method of forming a poly(arylene ether)-containing solid concentrate is described. The method includes blending a poly(arylene ether), a thermosetting resin, and a compatibilizing agent in the...
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7348057 |
Acrylic adhesive sheet
An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin,...
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7323521 |
Epoxy polymer additives for powder coatings
Comb polymers prepared by reacting an epoxy resin and a lactone are disclosed. These comb polymers find particular application as additives for powder coating compositions, to improve various...
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7323242 |
Thermally curable binding agents
A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid,...
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7262261 |
Binders and a method of use thereof as coating material for metal containers
Condensation products of dihydroxyaromatics A, alone or in mixture with mono- or polyhydroxyaromatics C, with diepoxides or polyepoxides B which have been alkylolated by reaction with aldehydes D...
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RE39615 |
Adhesive compositions and copper foils and copper clad laminates using same
The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at...
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7193016 |
Epoxy-extended polyacrylate toughening agent
In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example,...
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7101933 |
Process for producing high speed transmitting dielectric material
A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the...
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7094845 |
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same
There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The...
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7087664 |
Resin film and multilayer printed wiring board using thereof
A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content...
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6962957 |
Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary...
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6939431 |
Paste for circuit connection, anisotropic conductive paste and uses thereof
Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on...
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6924328 |
Stabilized coating compositions
A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two...
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6913792 |
Hybrid materials employing PPE/polystyrene/curable epoxy mixtures
A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably...
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6906120 |
Poly(arylene ether) adhesive compositions
An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent....
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6900269 |
Halogen-free resin composition
Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a...
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6887574 |
Curable flame retardant epoxy compositions
A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are...
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6808810 |
Resin composition, laminate and production of laminate
A resin composition comprising 3 to 80 parts by weight of a resol type phenolic resin or 3 to 150 parts by weight of a polyhydric phenol, based on 100 parts by weight of a copolymer (Å) of an...
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6787605 |
Composition of polyphenylene ether, polystyrene and curable epoxy
A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably...
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6770965 |
Wiring substrate using embedding resin
A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening,...
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6664325 |
Fiber processing agent, reinforcing fiber processed by the fiber processing agent and rubber product reinforced by the reinforcing fiber
A reinforcing fiber is provided, which can exhibit sufficient adhesive strength even with single layer film coating, a fiber processing agent which can enhance the strength of adhesion between the...
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6645341 |
Two part epoxide adhesive with improved strength
A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a...
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6610817 |
Coating composition containing alcoholic reactive diluents
Reactive diluents are formed by reaction of a compound having at least two glycidyl ester groups and a compound having at least one hydroxyl and/or carboxyl group. The diluents are useful in...
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6596813 |
Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary...
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6579588 |
Substrate provided with removable adhesive of polyepoxide, curing agent and microspheres
An article comprises a substrate wherein at least a portion of its surface is provided with a thermosettable adhesive composition prepared from a polyepoxide resin, a curing agent and a plurality...
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6559257 |
Adhesive formulations
An adhesive composition that includes a free radical-polymerizable monomer component that includes a reaction product of a (hydroxy)acrylate with an anhydride and is substantially free of at least...
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6544653 |
Adhesive for binding vinyl chloride to steel plates and vinyl chloride-coated steel plates
An adhesive prepared by blending a hardening resin serving as the main component with an urethane resin having a polycarbonate structure. The addition of the urethane resin with the polycarbonate...
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6518362 |
Melt blending polyphenylene ether, polystyrene and curable epoxy
A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably...
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6515081 |
Composition of epoxy resin, curing agent and reactive compound
A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and...
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6509414 |
Epoxy resin, styrene-maleic anhydride copolymer and co-crosslinking agent
A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a...
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6497337 |
Composition and method for promoting adhesion of thermoplastic elastomers to metal substrates
Adhesion of shaped thermoplastic elastomer articles is promoted without the need for special primers or other supplemental resin additives by incorporating in an enamel coating composition, an...
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6491973 |
Powder coating composition, process for the production and use thereof
Powder coating composition obtainable by homogeneous mixing of a separately produced particulate component A prepared from one or more epoxy resins having an epoxy equivalent weight of 250 to...
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6392003 |
Phenol condensate from phenols, aromatic compound and N-containing heterocyclic
The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B)...
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6388008 |
Crosslinking isoprene-isobutylene rubber with alkylphenol-formaldehyde resin, hydrazide and epoxy compound
The present invention provides a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 5 to 25 parts by weight of...
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6376053 |
Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same
An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with...
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6288170 |
Removable adhesive of polyepoxide, curing agent and microspheres
A thermosetting adhesive comprising a polyepoxide resin, a curing agent such as an imidazole and polymeric or elastomeric microspheres is removable when heated to a temperature greater than the use...
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6288169 |
Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary...
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6235842 |
Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin
The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin...
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6197898 |
Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the...
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6133377 |
Compostion of epoxy resin, phenol-triazine-aldehyde condensate and rubber
The present invention provides an epoxy resin composition comprising: (a) an epoxy resin having two or more epoxy groups in each molecule; (b) a phenolic resin composition comprising a condensation...
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6124402 |
Polyaddition copolymer and process for producing the same
A novel polyaddition copolymer having repetition units represented by the following general formula: ##STR1## where R: a lower alkyl group, Ar: a bisphenol compound residue, and X: a CH 2 O group...
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6117944 |
Curable composition
A curable composition comprising a polyfunctional oxetane compound and a polyphenol compound or phenol resin, where a quaternary onium salt or Crown ether compound is preferably further contained...
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6031028 |
Cationic electrodeposition coating composition
This invention provides a cationic electrodeposition coating composition comprising (A) a resin prepared by reacting an epoxy- or carboxyl-containing acrylic polymer, a bisphenol compound and a...
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6017634 |
Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH,...
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5998561 |
Catalyst and composition for silicone dental impression materials
A curable silicone dental impression composition is presented, preferably comprising a polyorganohydrogensiloxane having at least one silicon-bonded hydrogen atom; a silicone polymer having at...
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5990204 |
Crosslinking isoprene-isobutylene rubber with alkyphenol-formaldehyde and epoxy resins
The present invention relates to a method for crosslinking an isoprene-isobutylene rubber with resins, and a crosslinked rubber product obtained by said method. According to the present invention,...
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5965665 |
Low gloss thermoplastic resin composition
A low gloss thermoplastic resin composition containing a rubber modified thermoplastic resin, a gel polymer and a low molecular weight polyolefin polymer provides low surface gloss properties and...
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