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7618711 |
Resin coated metal plate having excellent formability, weldability and corrosion resistance, and worked articles using the resin coated metal plate and method for manufacturing same
A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the...
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7585904 |
Curing accelerator, curable resin composition and electronic parts device
A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture...
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7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
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7524394 |
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing...
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7511383 |
Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1)
(X is a single bond, CH 2 , C(CH 3 ) 2 , SO...
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7476444 |
Layer of reaction product of epoxy and phosphorus materials and curing agent on substrate
A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a...
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7423097 |
Glycidyloxy groups-containing polybutadiene, mono-oxetane compound and cationic photoinitiator
A radiation curable resin composition comprises a glycidyloxy groups-containing polybutadiene or hydrogenated polybutadiene, a mono-oxetane compound or monofunctional epoxy compound, and a cationic...
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7396588 |
Curable composition, varnish and laminate
A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major...
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7320830 |
Flame-retardant heat-resistant resin composition and adhesive film comprising the same
The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based...
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7169474 |
Epoxy resin composition and semiconductor device
An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid,...
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7160609 |
Curable composition, varnish, and layered product
A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major...
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7144763 |
Epoxy resin compositions, solid state devices encapsulated therewith and method
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one...
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7138445 |
Flame retardant thermoplastic resin composition
The present invention relates to a flame retardant thermoplastic resin composition that contains a phenol resin derivative having good char formability, regardless of the base resin. A flame...
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7084194 |
Halogen-free resin composition
A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B)...
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7070861 |
Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition
A flame retardant epoxy resin composition containing (A) a phenolic novolak type epoxy resin including a phenolic novolak type epoxy resin of the following formula (1) and/or formula (2) in a...
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7064157 |
Flame retardant resin and flame retardant composition containing the same
The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present...
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7053138 |
Flame-proofing agents
Compounds of formula (I) or (II), wherein R 1 is C 1 –C 18 alkyl; C 5 –C 12 cycloalkyl that is unsubstituted or substituted by one or more C 1 –C 6 alkyl groups or C 1 –C 6 alkoxy groups;...
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6955848 |
Curable composition and multilayered circuit substrate
This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition...
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6933332 |
Powdered epoxy composition
A cured epoxy coating comprising from about 30% to about 40% of at least one epoxy resin selected from the group consisting of diglycidyl ethers of bisphenol A, from about 55% to about 60% of a...
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6924328 |
Stabilized coating compositions
A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two...
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6916539 |
Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof
A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum...
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6916889 |
Epoxy resin compositions, solid state devices encapsulated therewith and method
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one...
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6830825 |
Epoxy resin composition and semiconductor device
An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame...
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6815495 |
Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder
A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at...
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6809162 |
Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst
Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron...
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6803414 |
Damping resin composition and damping resin article for structure using the resin composition
A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C)...
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6797750 |
Flame-retardant epoxy resin composition, molded article thereof, and electronic part
The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to...
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6767941 |
Halogen-free flame-retardant composition
A halogen-free, flame-retardant composition includes (1) organic phosphorus compound (A) and (1′) melamine or a compound derived from melamine (B); or (2) a melamine-phosphorus compound (AB). The...
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6747074 |
Intumescent fire sealing composition
Described is a flexible, solid fire sealant produced by high shear mixing in a substantially volatile-free state and capable of being molded or extruded into a variety of shapes and used as...
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6632892 |
Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one...
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6617400 |
Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is...
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6617401 |
Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron...
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6555227 |
Latent combination compounds and latent ammonium salts comprising epoxide resin curing agents and flame-protection agents as well as epoxide resin systems and products prepared from them
Combination compounds from curing agents/accelerators and flame-protection agents for the latent curing/acceleration of epoxide resin systems and their endowment with flame-retarding properties,...
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6551714 |
Flame-retardant resin composition, and prepregs and laminates using such composition
The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition....
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6528595 |
Adhesive of thiirane and oxirane-containing compound and oxirane-containing compound
A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy...
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6500546 |
Halogen-free phosphorous-containing flame-resistant epoxy resin compositions
Curable flame-resistant substantially halogen free epoxy resin compositions, comprising: (a) one or more bifunctional or polyfunctional epoxy resin; (b) a specific phosphorous-containing compound;...
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6486235 |
Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH)
A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum...
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6486242 |
Flame-retardant resin composition and prepreg and laminate using the same
The present invention provides a flame-retardant resin composition having high flame retardancy without using any halogen compound and suited for printed circuit boards. Specifically, it provides a...
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6451878 |
High molecular weight epoxy resin and resinous composition for printed circuit board
A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the...
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6440567 |
Halogen free flame retardant adhesive resin coated composite
Fire resistant adhesive resins that include a halogen-free and bromine-free flame retardant ingredient and conductive foils coated with the halogen-free fire resistant adhesive resin coated...
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6420459 |
Flame-retarding thermosetting compositions
The invention relates to flame-retardant thermoset compositions which comprise, as flame retardant, at least one phosphinic and/or a diphosphinic salt of these.
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6403690 |
Flame retardant resin composition
A halogen-free flame retardant resin composition comprising a radically polymerizable resin which is modified with a phosphorus-containing compound of the formula (1): in which R is a hydrogen...
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6387537 |
Epoxy resin composition and semiconductor device
The object of the present invention is to provide an epoxy resin compositions for encapsulating of semiconductors containing no bromine compounds and no antimony oxide and excellent in flame...
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6346329 |
Curable resin composition
The present invention provides a curable resin composition with excellent low temperature curability and good storage stability, which comprises (A) a polyepoxide compound, (B) a curing agent...
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6284818 |
Encapsulant composition and electronic device
In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous...
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6180695 |
Flame-retardant resin composition and semiconductor sealant using the same
The present invention provides a flame-retardant resin composition comprising: (A) an epoxy resin other than halogenated epoxy resins, having at least two epoxy groups in the molecule, (B) a...
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6176965 |
Method for producing a bonded structure of aluminum alloy pressed plate
A bonded structure of an Al alloy pressed plate, in which another member is bonded onto the surface of the Al alloy pressed plate that has a lubricant layer by use of an epoxy resin based adhesive....
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6177489 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise...
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6160077 |
Halogen-free epoxy resin
Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar...
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6020069 |
Cathodic electrocoating composition containing an epoxy resin chain extended with a primary amine
An improved aqueous cathodic electrocoating composition of an aqueous carrier having dispersed therein a film forming binder of (1) an epoxy-resin amine adduct and (2) a blocked polyisocyanate...
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