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7632423 |
Reactive fine particles
A reactive fine particle includes one or more functional compounds A or its precursors having a maximal size of less than 2 microns, adapted for synthesis, modification, curing, cross-linking,...
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7632545 |
Radiation shielding composition and a preparation method thereof
In one embodiment, a radiation shielding composition comprises lead oxide or lead composite material of predetermined particle size, and an adhesive, wherein the composition comprises free flow...
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7625477 |
Electrodeposition paint
This invention provides an electrodeposition paint comprising particles of at least one metallic compound selected from bismuth hydroxide, zirconium compound and tungsten compound, said particles...
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7618711 |
Resin coated metal plate having excellent formability, weldability and corrosion resistance, and worked articles using the resin coated metal plate and method for manufacturing same
A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the...
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7601421 |
Fabrication of carbon nanotube reinforced epoxy polymer composites using functionalized carbon nanotubes
The present invention is directed to methods of integrating carbon nanotubes into epoxy polymer composites via chemical functionalization of carbon nanotubes, and to the carbon nanotube-epoxy...
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7511383 |
Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1)
(X is a single bond, CH 2 , C(CH 3 ) 2 , SO...
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7498374 |
Cast polymer and method of making the same
Disclosed is a composite material including from about 50 wt % to about 75 wt % (based on the total weight of the composite material) of inorganic material, wherein the inorganic material includes...
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7485242 |
Reactive fine particles
A reactive fine particle includes one or more functional compounds A or its precursors having a maximal size of less than 2 microns, adapted for synthesis, modification, curing, cross-linking,...
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7474009 |
Optoelectronic molding compound that transmits visible light and blocks infrared light
A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy...
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7446136 |
Method for producing cure system, adhesive system, and electronic device
A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided,...
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7439285 |
Liquid thermosetting ink
Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having...
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7405246 |
Cure system, adhesive system, electronic device
A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided,...
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7381359 |
Method for making filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and...
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7368170 |
Viscous chemical anchoring adhesive
A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000...
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7311972 |
Filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and...
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7312104 |
Resin composition for encapsulating semiconductor device
A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide...
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7304102 |
Process for making encapsulant for opto-electronic devices
An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined...
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7294660 |
Epoxy resin composition
An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The...
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7282266 |
Corrosion and alkali-resistant compositions and methods for using the same
A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a...
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7279223 |
Underfill composition and packaged solid state device
An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional...
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7271206 |
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability...
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7247661 |
Masterbatch pellet mixture
A mixture including a high specific gravity masterbatch pellets group (A) with specific gravity within a range from 1.8 to 3.5, and a low specific gravity masterbatch pellets group (B) with...
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7223472 |
Gloss pigments having high colour saturation
The invention relates to coloured gloss pigments having specific particle dimensions comprising a transparent core of a silicon oxide of the composition SiO 0.03 to SiO 0.95 and, optionally,...
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7157119 |
Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates
A pigmented curable composition adapted for decorating ceramic substrates (e.g., glass bottles) comprises curable organic binder and solid spherical particles (glass or polymer) having diameters of...
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7157507 |
Ultraviolet curable silver composition and related method
A photocurable silver composition is provided which comprises an ultraviolet light curable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake...
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7157313 |
Epoxy resin composition and semiconductor device using thereof
The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability...
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7101596 |
Liquid crystal sealant, liquid crystal display device using the same and method for producing the device
A liquid crystal sealant comprising an epoxy resin represented by the following formula (1): [Formula 1]
(in the formula, n denotes an average polymerization degree and is a positive number of...
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7022410 |
Combinations of resin compositions and methods of use thereof
A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first...
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7008981 |
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof
The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric...
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7008982 |
Surface treated silicas
Disclosed is a silica substrate treated with a polysiloxane, and an organosilane, wherein the organosilane is described by the formula: RSi(R′) x (OR″) 3-x ; wherein R is a long-chain...
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6979722 |
Process for production of alkyllene oxide polymers
According to a process for production of alkylene oxide polymers offered by the present invention, an alkylene oxide is subjected to a polymerization reaction under presence of a catalyst in a...
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6964994 |
Polyreactions in non-aqueous miniemulsions
The invention relates to a method of conducting polymerization in nonaqueous miniemulsions.
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6933333 |
Conductive adhesive sealant for bipolar fuel cell separator plate assemblies
A conductive adhesive sealant comprising vinyl ester resin or polyester resin, graphite powder, peroxide free-radical initiator, milled carbon fiber, and a quinone-based inhibitor such as para...
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6916538 |
Thermosetting resin composition and semiconductor device obtained with the same
A thermosetting resin composition which contains:
(A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general...
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6855751 |
Silica powder and method for producing the same
A silica powder surface-treated with and epoxy compound having a plurality of epoxy groups, in which at least one epoxy group of the epoxy compound is ring-opened to bind to the surface of the...
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6844392 |
Abradable dry powder coatings, methods for making and coating, and coated articles therefrom
An abradable dry powder coating ( 22 ) composition for coating onto a surface ( 12 ) for subsequent curing to form into an abradable coating, including a powder ( 16 ) formed of uncured thermoset...
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6841251 |
Composition having sealing and sound dampening properties and methods related thereto
A composition having sealing and sound dampening properties is disclosed which comprises one or more polyepoxides comprising at least two epoxide groups per molecule; a thermoplastic polyester...
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6830815 |
Low wear and low friction coatings for articles made of low softening point materials
The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so...
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6831116 |
Polymeric modifying agents
Novel modifying agents contain a sharply-melting crystalline polymer ingredient, preferably a side chain crystalline (SCC) ingredient, and an active chemical ingredient. Such modifying agents,...
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6828369 |
Sheet for conducting heat
A heat conductive sheet comprising organic matrix and heat conductive filler contained in the organic matrix at a volume percent between 30% and 80%. The heat conductive filler comprises spherical...
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6822341 |
Latent catalysts for molding compounds
A latent catalyst particularly useful in epoxy molding compositions for use in electronic packaging materials is provided. The latent catalyst is in the form of a curative represented by a...
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6818685 |
Ink-receptive coatings and recording medium prepared therefrom
The coating composition comprises inorganic oxide, e.g., silica, in combination with a binder system comprising a mixture of a water soluble polymer and non-ionic latex polymer. The composition may...
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6791839 |
Thermal interface materials and methods for their preparation and use
A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a...
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6779656 |
Polymerizable preparations based on epoxides that contain silicon
The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another,...
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6749896 |
Self-cross linking powder paint based on epoxy resins and the use thereof
A self-crosslinking powder coating material, comprising (A) up to 50% by weight, based on the powder coating material, of a mixture of (A1) at least one epoxy resin with an epoxy equivalent weight...
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6737157 |
Coating type reinforcement composition of sheet metal
The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent...
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6730402 |
Flame-retardant epoxy resin composition and laminate made with the same
A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain,...
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6709756 |
Optical device-related adhesive and optical device
An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average...
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6706405 |
Composite coating for imparting particel erosion resistance
Erosion resistant coating compositions comprising a poly(Bisphenol A-co-epichlorohydrin) glycidyl end-capped component, an active hydrogen compound, a linear siloxane and a silsesquioxane....
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6699351 |
Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also...
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