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7621281 |
Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C):
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7612028 |
Thinner composition, method of preparing the same and method of recovering the same
A thinner composition is provided which includes about 60-80% by weight of propylene glycol mono-alkyl ether having a boiling point of T 1 ° C., about 10-30% by weight of alkyl acetate having a...
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7608540 |
Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition
A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to...
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7605113 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an...
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7595289 |
Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards
The present invention concerns the field of fluorinated hydrocarbons and relates to novel compositions containing fluorinated hydrocarbons, secondary butanol and optionally DMSO. These novel...
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7591270 |
Process solutions containing surfactants
Process solutions comprising one or more surfactants are used to reduce the number of pattern collapse defects on a plurality of photoresist coated substrates during the manufacture of...
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7589052 |
Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals
The present invention is related to a slurry composition for polishing copper integrated with tungsten containing barrier layers and its use in a CMP method. The present invention is also related...
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7579309 |
Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor
The present invention relates to a method for characterizing defects on silicon surfaces, such as silicon wafers, a method for treating silicon surfaces with an etching solution, and an etching...
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7579308 |
Compositions and processes for photoresist stripping and residue removal in wafer level packaging
Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board...
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7579307 |
Cleaner for semiconductor devices
The invention has for its object the provision of a cleaner capable of removing particles and metal impurities present on the surface of a wafer without corrosion of wirings, gates or the like yet...
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7576046 |
Cleaning liquid for lithography and method of cleaning therewith
A cleaning liquid for lithography that exhibits equally excellent cleaning performance for resists of a wide variety of compositions, such as various resists for i-line, KrF and ArF, silicic resist...
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7572758 |
Cleaning liquid and cleaning method
A cleaning liquid is provided, which comprises an aqueous solution containing nitric acid, sulfuric acid, a fluorine compound, and a basic compound. The concentration of water in the cleaning...
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7569336 |
Composition for removing photoresist and method of forming a pattern using the same
In a method of forming a pattern using a composition for removing photoresist, a layer is formed on a substrate, and then a photoresist pattern is formed on the layer. A portion of the layer...
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7563754 |
Composition for removing photoresist residue and polymer residue
A composition for removing a photoresist residue and a polymer residue remaining on a semiconductor substrate after dry etching and after ashing is provided, the composition containing at least one...
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7563753 |
Cleaning solution for removing photoresist
Cleaning solutions for removing photoresist resins and a method of forming patterns using the same are disclosed. The cleaning solution includes water (H 2 O) as main component, one or more...
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7562662 |
Cleaning solution and cleaning method of a semiconductor device
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide...
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7557073 |
Non-fluoride containing supercritical fluid composition for removal of ion-implant photoresist
A method and composition for removing ion-implanted photoresist from semiconductor substrates having such photoresist is described. The removal composition contains supercritical CO 2 (SCCO 2 ), a...
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7553803 |
Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions
A method and composition for removing silicon-containing particulate material, such as silicon nitrides and silicon oxides, from patterned Si/SiO 2 semiconductor wafer surfaces is described. The...
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7547669 |
Remover compositions for dual damascene system
A new remover chemistry based on a choline compound, such as choline hydroxide, is provided in order to address problems related to removal of residues, modified photoresists, photoresists, and...
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7543592 |
Compositions and processes for photoresist stripping and residue removal in wafer level packaging
Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board...
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7541322 |
Cleaning solution for substrate for semiconductor device and cleaning method
To provide a cleaning solution for a substrate for a semiconductor device capable of removing particle contamination, organic contamination and metal contamination at the same time without...
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7534753 |
pH buffered aqueous cleaning composition and method for removing photoresist residue
A residue cleaning composition includes: (a) water; (b) a fluoride; (c) a pH buffer system including an organic acid and a base. The organic acid can be an aminoalkylsulfonic acid and/or an...
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7534752 |
Post plasma ashing wafer cleaning formulation
A semiconductor wafer cleaning formulation for use in post plasma ashing semiconductor fabrication comprising at least one organic chelating agent and at least one polar solvent, wherein the...
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7531491 |
Aqueous cleaning solution for integrated circuit device and method of cleaning using the cleaning solution
Aqueous cleaning solutions are provided for cleaning an integrated circuit device formed on a wafer, as well as methods of cleaning a wafer using the aqueous cleaning solution. In one aspect, an...
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7528098 |
Semiconductor process residue removal composition and process
A residue remover for removing polymeric material and etch residue includes 2-(2-aminoethylamino)-ethanol and optionally another two-carbon atom linkage alkanolamine compound, gallic acid or...
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7524801 |
Process for removing contaminant from a surface and composition useful therefor
Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous...
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7521408 |
Semiconductor cleaning solution
The present invention recites a composition comprising a first compound and a second compound. The first compound has the chemical formula ( 1a), wherein m, n and o are independently from each...
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7521407 |
Remover composition
A remover composition used for cleaning of a semiconductor substrate or semiconductor element, wherein (1) the remover composition contains 65% by weight or more of water; (2) the remover...
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7521406 |
Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
Microelectronic cleaning compositions for cleaning microelectronic substrates, and particularly cleaning compositions useful with and having improved compatibility with microelectronic substrates...
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7521405 |
Process solutions containing surfactants
Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce...
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7498295 |
Alkaline chemistry for post-CMP cleaning comprising tetra alkyl ammonium hydroxide
This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline...
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7498294 |
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device
The cleaning composition which comprises organic polymer particles (A) having a crosslinked structure and a surfactant (B) and is used after chemical mechanical polishing. The cleaning method of a...
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7494962 |
Solvents containing cycloakyl alkyl ethers and process for production of the ethers
The present inventions are (A) a solvent comprising at least one cycloalkyl alkyl ether (1) represented by the general formula: R1-O—R2 (wherein R1 is cyclopentyl or the like; and R2 is C1-10...
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7491252 |
Tantalum barrier removal solution
A chemical mechanical planarization solution is useful for removing tantalum barrier materials. The solution includes by weight percent 0 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal...
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7485612 |
Electronic parts cleaning solution
(Object) To provide a new electronic parts cleaning solution that inhibits the corrosion of silicon or metals other than the silicon, and that efficiently cleans off fine dust or organic matters...
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7485611 |
Supercritical fluid-based cleaning compositions and methods
Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One...
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7479474 |
Reducing oxide loss when using fluoride chemistries to remove post-etch residues in semiconductor processing
A novel cleaning composition used for post-etch resist residue removal is disclosed. In contrast to the conventional cleaning solutions based on fluoride chemistries, the present invention can...
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7470767 |
Preparation of ultrapure polymeric articles
Ultrapure olefinic polymeric articles of manufacture can be prepared by a process comprising: providing olefinic polymeric material containing impurities, subjecting the olefinic polymeric material...
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7459398 |
Slurry for CMP, polishing method and method of manufacturing semiconductor device
Disclosed is a CMP slurry comprising an abrasive grain, and a mixed surfactant comprising a first polyether type nonionic surfactant having an HLB value ranging from 3 to 9 at room temperature, and...
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7456141 |
Photo resist stripper composition
A photo resist stripper composition includes PGME or its derivatives and ANONE or its derivatives characterized by low toxicity, safe use, free of odors, environment friendly, easy disposal of...
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7456140 |
Compositions for cleaning organic and plasma etched residues for semiconductor devices
A composition for the stripping of photoresist and the cleaning of residues from substrates, and for silicon oxide etch, comprising from about 0.01 percent by weight to about 10 percent by weight...
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7442675 |
Cleaning composition and method of cleaning semiconductor substrate
A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total...
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7435712 |
Alkaline chemistry for post-CMP cleaning
This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline...
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7435711 |
Cleaning agent for removing solder flux and method for cleaning solder flux
The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a...
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7435301 |
Cleaning solution of silicon germanium layer and cleaning method using the same
Disclosed are a cleaning solution for preventing damage of a silicon germanium layer when cleaning a semiconductor device including the silicon germanium layer and a cleaning method using the same....
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7427586 |
Degreasing agent
A degreasing agent includes a mixture of trisodium phosphate, sodium silicate, sodium carbonate, sodium dodecyl benzene sulphonate, sodium hydrosulphite and octyl-phenol-polyoxyethylene ether. The...
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7422019 |
Composition and method for treating a semiconductor substrate
The invention relates to a method for cleaning semiconductor surfaces to achieve to removal of all kinds of contamination (particulate, metallic and organic) in one cleaning step. The method...
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7419946 |
Chemical solution feeding apparatus and method for preparing slurry
An apparatus for feeding slurry to an external device. The apparatus includes a preparation tank for preparing the slurry. A circulation pipe is connected to the preparation tank to circulate the...
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7419945 |
Microelectronic cleaning compositions containing oxidizers and organic solvents
Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k dielectrics and copper or aluminum metallizations contain an oxidizing agent and a...
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7419911 |
Compositions and methods for rapidly removing overfilled substrates
This invention relates to compositions and methods for removing overfilled substrates, preferably at a relatively high removal rates. Advantageously, a composition according to the invention can...
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