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7611552 |
Semiconductor polishing composition
A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the...
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7597729 |
Polishing composition and polishing method using the same
A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition...
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7591865 |
Method of forming structured abrasive article
The disclosure is directed to a method of forming a structured abrasive article. The method includes coating a backing with an abrasive slurry comprising binder and abrasive grains, partially...
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7585342 |
Polycrystalline superabrasive composite tools and methods of forming the same
A polycrystalline superabrasive composite tool can be produced using high pressure high temperature processes allowing for increased thermal resistance, wear resistance and toughness of abrasive...
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7582127 |
Polishing composition for a tungsten-containing substrate
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching,...
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7578862 |
Abrasive compound for glass hard disk platter
The present invention provides an abrasive compound suitable for polishing the surface of a glass substrate for an optical disk platter or a magnetic disk platter. More specifically, the present...
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7575615 |
Process for preparing a polishing composition
The present invention relates to a process for preparing a polishing composition comprising a colloidal silica prepared from a silicate. The first step involves adjusting the pH of a silica...
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7569205 |
Nanodiamond fractional and the products thereof
In certain embodiments, a method of processing detonation nanodiamonds to fractionate the detonation nanodiamonds involves, in order forming a combination of detonation nanodiamonds and a solvent,...
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7553346 |
Abrasive product
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
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7553344 |
Shaped thermally stable polycrystalline material and associated methods of manufacture
A new industrial thermally stable polycrystalline diamond (TSP) is disclosed and described as a replacement of natural as well as synthetic diamond grit in concrete cutting, grinding, polishing,...
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7534277 |
Slurry composition for secondary polishing of silicon wafer
Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of...
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7527662 |
Abrasive body and method of manufacturing the same
An abrasive body for polishing includes a resin structure made of resin and a plurality of abrasive grains wherein a critical surface tension of the resin ranges from 1.6×10 −2 to 4.0×10 −2 ...
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7524347 |
CMP composition comprising surfactant
The invention provides a polishing composition comprising fumed alumina, alpha alumina, silica, a nonionic surfactant, a metal chelating organic acid, and a liquid carrier. The invention further...
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7524346 |
Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon...
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7524345 |
Rapid tooling system and methods for manufacturing abrasive articles
A coated abrasive article includes a substrate and a patterned set of abrasive structures. Each abrasive structure of the patterned set of abrasive structures has an engineered microfeature.
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7513920 |
Free radical-forming activator attached to solid and used to enhance CMP formulations
A CMP composition having: a fluid comprising water and at least one oxidizing compound that produces free radicals when contacted with an activator; and a plurality of particles having a surface...
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7510034 |
System, method, and apparatus for enhancing the durability of earth-boring bits with carbide materials
An earth-boring drill bit having a bit body with a cutting component formed from a tungsten carbide composite material is disclosed. The composite material includes a binder and tungsten carbide...
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7507267 |
Abrasive tools made with a self-avoiding abrasive grain array
Abrasive tools contain abrasive grains oriented in an array according to a non-uniform pattern having an exclusionary zone around each abrasive grain, and the exclusionary zone has a minimum...
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7497885 |
Abrasive articles with nanoparticulate fillers and method for making and using them
The disclosure relates to fixed abrasive articles having a plurality of three-dimensional abrasive composites including abrasive particles dispersed in a matrix material including a polymeric...
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7497884 |
Fine abrasive paper backing material and method of making thereof
In one embodiment is provided a method of making an abrasive backing having a smooth surface comprising the steps of providing a paper having a first paper surface and a second paper surface;...
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7494519 |
Abrasive agglomerate polishing method
Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive...
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7491252 |
Tantalum barrier removal solution
A chemical mechanical planarization solution is useful for removing tantalum barrier materials. The solution includes by weight percent 0 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal...
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7491251 |
Method of making a structured abrasive article
A method of making an abrasive product includes compacting a cohesive layer of abrasive particles and particulate curable binder precursor prior to forming curable shaped structures, and then at...
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7485162 |
Polishing composition
A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from...
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7482303 |
Catalytic burning reaction
Catalytic system combining an aluminium or iron containing catalytic support, a rare earth containing porous deposit, carbon nanoparticles and a carbon containing structure making bonds between...
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7470295 |
Polishing slurry, method of producing same, and method of polishing substrate
Disclosed herein is a polishing slurry for chemical mechanical polishing. The polishing slurry comprises polishing particles, which have a particle size distribution including separated fine and...
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7435276 |
Abrasive particles having coatings with tortuous surface topography
The present invention relates to abrasive composites having improved abrasive particle retention due to unique coating designs. The present invention describes coated abrasive particles having...
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7427587 |
Polishing compound
A cleaning and polishing composition contains mineral spirits, a first abrasive component of particles having a median size in a range of 1-4 microns, a second abrasive component of particles...
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7427305 |
Free radical-forming activator attached to solid and used to enhance CMP formulations
This invention relates to a method of making selected oxidizers or other free radical-producing compounds become more effective chemical etchants and/or oxidizers for CMP activities by promoting...
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7419519 |
Engineered non-polymeric organic particles for chemical mechanical planarization
An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry....
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7413832 |
Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains...
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7407523 |
Cutting tool insert and method for producing the same
An improved cutting tool insert and a method for the preparation of such cutting tool insert, having a sintered alumina and silicon carbide whisker composite material body, comprising the steps of...
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7404831 |
Abrasive composite, method for making the same, and polishing apparatus using the same
An abrasive composite, a method for making the abrasive composite, and a polishing apparatus using the abrasive composite are disclosed. The abrasive composite includes a matrix and a plurality of...
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7399330 |
Agglomerate abrasive grains and methods of making the same
An abrasive agglomerate includes a plurality of abrasive grains bonded together in a three-dimensional structure by a substantially continuous, non-porous inorganic binder, wherein the abrasive...
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7396372 |
Abrasive grain and method for producing it, polishing tool and method for producing it, grinding wheel and method for producing it, and polishing apparatus
An abrasive grain including a porous particle material in which a large number of secondary particles contain gaps between primary particles bonded to each other. The secondary particles are...
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7393371 |
Nonwoven abrasive articles and methods
Nonwoven abrasive articles, particularly lofty nonwoven abrasive articles, with a textured, non-planar surface and an abrasive coating thereon. The coating may cover the entire surface or only...
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7384438 |
Fused Al2O3-Y2O3-ZrO2 eutectic abrasive particles, abrasive articles, and methods of making and using the same
Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and...
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7384437 |
Apparatus for making abrasive article
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
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7368387 |
Polishing composition and polishing method
A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second...
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7364600 |
Slurry for CMP and method of polishing substrate using same
Disclosed herein is a polishing slurry and a method of producing the same. The polishing slurry has high selectivity in terms of a polishing speed of an oxide layer to that of a nitride layer used...
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7344575 |
Composition, treated backing, and abrasive articles containing the same
A curable composition comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional urethane(meth)acrylate, dicyandiamide and...
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7344574 |
Coated abrasive article, and method of making and using the same
A coated abrasive article has a backing treatment preparable by at least partially polymerizing an isotropic backing treatment precursor comprising polyepoxide, polyfunctional urethane...
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7332453 |
Ceramics, and methods of making and using the same
Ceramics (including glasses and glass-ceramics) comprising nitrogen, and methods of making the same.
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7306637 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a...
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7303993 |
Chemical mechanical polishing compositions and methods relating thereto
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the...
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7303601 |
Polishing composition
A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R)...
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7303599 |
Manufacture of lapping board
A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an...
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7300874 |
Chemical mechanical polishing compositions and methods relating thereto
A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer...
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7300480 |
High-rate barrier polishing composition
The solution is useful for removing a barrier material from a semiconductor substrate. The solution comprises, by weight percent, 0.01 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal, 0 to...
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7294158 |
Abrasive product, method of making and using the same, and apparatus for making the same
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
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