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6616718 |
Aqueous solution for colloidal polishing of silicate substrates
A two-part reagent method for polishing an inorganic silicate substrate is provided. The method comprises: providing a silicate substrate; providing a reagent comprising: a first part consisting...
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6613113 |
Abrasive product and method of making the same
The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar...
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6612911 |
Alkali metal-containing polishing system and method
The invention provides a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety...
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6610114 |
Oxidizing polishing slurries for low dielectric constant materials
An oxidizing slurry for removal of low dielectric constant materials. The slurry is formed utilizing non-oxidizing particles with a separate oxidizing agent, oxidizing particles alone or reducible...
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6610113 |
Process for heat treating ceramics and articles of manufacture made thereby
A process for making a heat treated ground ceramic cutting tool and the resultant cutting tool. The process comprising the steps of: providing an uncoated ground ceramic cutting tool having at...
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6607571 |
Polishing composition and method
To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface,...
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6605128 |
Abrasive article having projections attached to a major surface thereof
The present invention provides abrasive articles having projections attached to a major surface thereof, and methods of making such articles. The articles include (1) a reaction product of...
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6599837 |
Chemical mechanical polishing composition and method of polishing metal layers using same
The present invention provides a chemical mechanical planarization (CMP) polishing composition that polishes metal layers at a good removal rate and that provides good planarization of metal layers...
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6596041 |
Fused AL2O3-MgO-rare earth oxide eutectic abrasive particles, abrasive articles, and methods of making and using the same
Fused abrasive particles comprising eutectic material comprising Al 2 O 3 —MgO-REO eutectic. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives,...
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6589304 |
Method of bonding porous abrasive solid mass to base member with provision of sealing film on bonding surface of the abrasive solid mass
A method of bonding an abrasive solid mass to a desired member with an adhesive, wherein the abrasive solid mass has a porous abrasive structure in which a multiplicity of abrasive grains are held...
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6585786 |
Slurry for chemical mechanical polishing
By using a polishing slurry which contains, at least, a polishing grain, an oxidizing agent and a basic amino acid compound, it is possible to suppress dishing and erosion liable to be produced in...
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6582487 |
Discrete particles that include a polymeric material and articles formed therefrom
The present invention provides discrete particles and methods of preparing the discrete particles. The discrete particles include a plurality of abrasive grits and a polymeric material that...
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6572666 |
Abrasive articles and methods of making the same
Abrasive articles comprising abrasive particles and at least one of (a) a reaction product of components comprising a resole phenolic resin and a bisphenol/fornaldehyde resin, (b) a bond system is...
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6569214 |
Composite polymer blast media
A method for making a polymeric blast media, and a product of this method. The first step involves blending a melamine compound with a cellulosic material and compression molding said first blend...
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6569216 |
Abrasive fluid compositions
A polishing composition comprising a chelating compound or a salt thereof; a partially esterified product and/or partially etherified product of a polyhydric alcohol compound; and water; a...
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6569215 |
Composition for polishing magnetic disk substrate
An object of the present invention is to provide a composition for polishing a magnetic disk substrate that is used as a storage device for a computer or the like, and is capable of producing a...
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6562091 |
Slurry for chemical mechanical polishing of a semiconductor device and preparation method thereof
A method for preparing a slurry for a chemical mechanical polishing process for a semiconductor device includes putting an organic matter in a solvent, preparing a solution by adding a dispersant...
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6562090 |
Fluid abrasive suspension for use in dentifrices
A fluid abrasive suspension composition has an abrasive, suspending vehicle, and a water-swellable or water-soluble polymer. This composition is used to make a stable dentifrice formulation.
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6554878 |
Slurry for multi-material chemical mechanical polishing
In a first aspect a slurry is provided for chemically mechanically polishing alumina and nickel iron to a common plane and in a second aspect a slurry is provided for additionally chemically...
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6551366 |
Spray drying methods of making agglomerate abrasive grains and abrasive articles
Spray drying methods for making agglomerate abrasive grains. The agglomerate abrasive grains are useful for making abrasive articles.
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6551367 |
Process for preparing metal oxide slurry suitable for semiconductor chemical mechanical polishing
There is disclosed a process for preparing a metal oxide CMP slurry suitable for semiconductor devices, wherein a mixture comprising 1 to 50 weight % of a metal oxide and 50 to 99 weight % of water...
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6551175 |
Polishing composition
A polishing composition comprising an abrasive and water, wherein the abrasive has a particle size distribution such that (1) a ratio of D90 to D50 (D90/D50) is from 1.3 to 3.0, and (2) D50 is from...
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6544307 |
Polishing composition and manufacturing and polishing methods
A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium...
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6544306 |
Abrasive product and method of making the same
The invention provides an abrasive product having a sheet-like backing including a plurality of concavoconvex portions, the backing also having a first major surface including convex portions and...
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6533832 |
Chemical mechanical polishing slurry and method for using same
An aqueous chemical mechanical polishing slurry useful for polishing the polysilicon layer of a semiconductor wafer comprising an aqueous solution of at least one abrasive, and at least one...
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6530826 |
Process for the surface polishing of silicon wafers
A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a...
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6530967 |
Stabilized slurry compositions
Provided are slurry compositions suitable for use in a chemical-mechanical planarization process and methods for making same. The compositions include: (a) abrasive particles dispersed in a...
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6521214 |
Process for preparation of abrasive precipitated silica
A process for the preparation of precipitated silica is disclosed. The precipitated silica has a refractive index from about 1.440 to about 1.450, among other properties. The silica is prepared by...
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6521004 |
Method of making an abrasive agglomerate particle
A method for making abrasive agglomerate particles from a composition comprising at least a radiation curable binder and solid particulates. The method comprises the steps of forcing the...
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6514302 |
Methods for producing granular molding materials for abrasive articles
Granular molding materials for fabricating abrasive articles, such as, for example, grinding wheels, are produced by mixing heated abrasive grains with a resin blend including two phenol-novolac...
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6506682 |
Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof
The present invention relates to non-selective slurries for chemical-mechanical polishing of a metal layer and a method for manufacturing thereof, and further to a method for forming a plug in an...
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6500049 |
Lapping oil composition for finish-grinding
The present invention relates to a lapping oil composition which is advantageously used in finish-grinding of a material to provide a high-quality grinding surface, without selective grinding,...
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6500870 |
Method for manufacturing of silica sols
A method for production of high purity silica sols comprising the steps: (a) adding a phosphonic acid-based complexing agent to the silicic acid-containing solution forming complexes with metal...
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6494928 |
Polishing compound for sheet metal coating
There is provided a polishing compound for sheet metal coating comprising an polishing material and a surfactant in which a RB ceramics and/or CRB ceramics powder is used at least as a part of the...
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6488730 |
Polishing composition
The present invention relates to a polishing composition comprising 30 to 99 wt % of deionized water, 0.1 to 50 wt % of powder of metallic oxide and 0.01 to 20 wt % of cyclic amine. This polishing...
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6482244 |
Process for making an abrasive sintered product
A method for making an abrasive product comprising forming a structure of a sinterable retaining matrix having at least one first region containing a plurality of abrasive particles embedded...
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6478835 |
Abrasive composition for polishing magnetic recording disk substrates
The present invention provides an abrasive composition for polishing magnetic recording disk substrates that results in a low surface roughness of the magnetic recording disk, allows the attaining...
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6478832 |
Grinding stone, process for its production and grinding method employing it
A grinding stone using a metal material as the main material of a bonding material, which comprises: (A) abrasive grains of at least one member selected from the group consisting of diamond, cubic...
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6479036 |
Particulate materials for use in dentifrice compositions
Silica particles for incorporation into a dentifrice composition, preferably as a thickening agent, have a polyether glycol such as polyethylene glycol applied thereto in order to enhance...
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6478831 |
Abrasive surface and article and methods for making them
A method for making an abrasive material comprising a plurality of hard particles providing the abrasive quality distributed in a retaining matrix for holding the particles in place, the method...
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6478833 |
Abrasive composition and tools for stone materials and ceramics
Abrasive composition for the manufacture of tools for the execution of surface treatments on stone and ceramic materials, comprising a superabrasive and a binder comprising a frit approximately...
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6478878 |
Blasting medium and blasting method
A blasting medium which has an average grain size of at most 20 μm and contains at least 90 mass % of a water-soluble inorganic salt, wherein the content of grains having grain sizes of at least...
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6471735 |
Compositions for use in a chemical-mechanical planarization process
Provided are methods for making a slurry composition, suitable for use in a chemical-mechanical planarization process. Also provided are compositions made by such methods. The methods comprise...
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6464741 |
CMP polishing slurry dewatering and reconstitution
A method of making a slurry, by mixing a quantity of water with dissolvable constituents of an aqueous slurry used for polishing, with the dissolvable constituents being apportioned according to...
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6454819 |
Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite...
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6447563 |
Chemical mechanical polishing slurry system having an activator solution
This invention relates to a CMP slurry system for use in semiconductor manufacturing. The slurry system comprises two parts. The first part is a generic dispersion that only contains an abrasive...
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6447372 |
Polishing agent for semiconductor substrates
The polishing agent of the invention has polishing grains suspended in a solution. The polishing grains consist essentially of a first substance with a glass transition temperature T G , and the...
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6447373 |
Chemical mechanical polishing slurries for metal
A slurry for use in chemical-mechanical polishing of a metal layer comprising particles dispersed in an aqueous medium. The slurry particles will tend to agglomerate when the slurry is at rest and...
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6443827 |
Polishing member and process for producing the same
A polishing member for use in polishing of an end face of an optical fiber connector ferrule comprises a substrate and a polishing layer, which is overlaid on the substrate and which comprises a...
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6443811 |
Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing
An aqueous based ceria slurry system and method for chemical mechanical polishing of semiconductor wafers, the slurry comprising less than 5 wt % abrasive cerium oxide particles and up to about the...
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