Match Document Document Title
6616718 Aqueous solution for colloidal polishing of silicate substrates  
A two-part reagent method for polishing an inorganic silicate substrate is provided. The method comprises: providing a silicate substrate; providing a reagent comprising: a first part consisting...
6613113 Abrasive product and method of making the same  
The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar...
6612911 Alkali metal-containing polishing system and method  
The invention provides a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety...
6610114 Oxidizing polishing slurries for low dielectric constant materials  
An oxidizing slurry for removal of low dielectric constant materials. The slurry is formed utilizing non-oxidizing particles with a separate oxidizing agent, oxidizing particles alone or reducible...
6610113 Process for heat treating ceramics and articles of manufacture made thereby  
A process for making a heat treated ground ceramic cutting tool and the resultant cutting tool. The process comprising the steps of: providing an uncoated ground ceramic cutting tool having at...
6607571 Polishing composition and method  
To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface,...
6605128 Abrasive article having projections attached to a major surface thereof  
The present invention provides abrasive articles having projections attached to a major surface thereof, and methods of making such articles. The articles include (1) a reaction product of...
6599837 Chemical mechanical polishing composition and method of polishing metal layers using same  
The present invention provides a chemical mechanical planarization (CMP) polishing composition that polishes metal layers at a good removal rate and that provides good planarization of metal layers...
6596041 Fused AL2O3-MgO-rare earth oxide eutectic abrasive particles, abrasive articles, and methods of making and using the same  
Fused abrasive particles comprising eutectic material comprising Al 2 O 3 —MgO-REO eutectic. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives,...
6589304 Method of bonding porous abrasive solid mass to base member with provision of sealing film on bonding surface of the abrasive solid mass  
A method of bonding an abrasive solid mass to a desired member with an adhesive, wherein the abrasive solid mass has a porous abrasive structure in which a multiplicity of abrasive grains are held...
6585786 Slurry for chemical mechanical polishing  
By using a polishing slurry which contains, at least, a polishing grain, an oxidizing agent and a basic amino acid compound, it is possible to suppress dishing and erosion liable to be produced in...
6582487 Discrete particles that include a polymeric material and articles formed therefrom  
The present invention provides discrete particles and methods of preparing the discrete particles. The discrete particles include a plurality of abrasive grits and a polymeric material that...
6572666 Abrasive articles and methods of making the same  
Abrasive articles comprising abrasive particles and at least one of (a) a reaction product of components comprising a resole phenolic resin and a bisphenol/fornaldehyde resin, (b) a bond system is...
6569214 Composite polymer blast media  
A method for making a polymeric blast media, and a product of this method. The first step involves blending a melamine compound with a cellulosic material and compression molding said first blend...
6569216 Abrasive fluid compositions  
A polishing composition comprising a chelating compound or a salt thereof; a partially esterified product and/or partially etherified product of a polyhydric alcohol compound; and water; a...
6569215 Composition for polishing magnetic disk substrate  
An object of the present invention is to provide a composition for polishing a magnetic disk substrate that is used as a storage device for a computer or the like, and is capable of producing a...
6562091 Slurry for chemical mechanical polishing of a semiconductor device and preparation method thereof  
A method for preparing a slurry for a chemical mechanical polishing process for a semiconductor device includes putting an organic matter in a solvent, preparing a solution by adding a dispersant...
6562090 Fluid abrasive suspension for use in dentifrices  
A fluid abrasive suspension composition has an abrasive, suspending vehicle, and a water-swellable or water-soluble polymer. This composition is used to make a stable dentifrice formulation.
6554878 Slurry for multi-material chemical mechanical polishing  
In a first aspect a slurry is provided for chemically mechanically polishing alumina and nickel iron to a common plane and in a second aspect a slurry is provided for additionally chemically...
6551366 Spray drying methods of making agglomerate abrasive grains and abrasive articles  
Spray drying methods for making agglomerate abrasive grains. The agglomerate abrasive grains are useful for making abrasive articles.
6551367 Process for preparing metal oxide slurry suitable for semiconductor chemical mechanical polishing  
There is disclosed a process for preparing a metal oxide CMP slurry suitable for semiconductor devices, wherein a mixture comprising 1 to 50 weight % of a metal oxide and 50 to 99 weight % of water...
6551175 Polishing composition  
A polishing composition comprising an abrasive and water, wherein the abrasive has a particle size distribution such that (1) a ratio of D90 to D50 (D90/D50) is from 1.3 to 3.0, and (2) D50 is from...
6544307 Polishing composition and manufacturing and polishing methods  
A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium...
6544306 Abrasive product and method of making the same  
The invention provides an abrasive product having a sheet-like backing including a plurality of concavoconvex portions, the backing also having a first major surface including convex portions and...
6533832 Chemical mechanical polishing slurry and method for using same  
An aqueous chemical mechanical polishing slurry useful for polishing the polysilicon layer of a semiconductor wafer comprising an aqueous solution of at least one abrasive, and at least one...
6530826 Process for the surface polishing of silicon wafers  
A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a...
6530967 Stabilized slurry compositions  
Provided are slurry compositions suitable for use in a chemical-mechanical planarization process and methods for making same. The compositions include: (a) abrasive particles dispersed in a...
6521214 Process for preparation of abrasive precipitated silica  
A process for the preparation of precipitated silica is disclosed. The precipitated silica has a refractive index from about 1.440 to about 1.450, among other properties. The silica is prepared by...
6521004 Method of making an abrasive agglomerate particle  
A method for making abrasive agglomerate particles from a composition comprising at least a radiation curable binder and solid particulates. The method comprises the steps of forcing the...
6514302 Methods for producing granular molding materials for abrasive articles  
Granular molding materials for fabricating abrasive articles, such as, for example, grinding wheels, are produced by mixing heated abrasive grains with a resin blend including two phenol-novolac...
6506682 Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof  
The present invention relates to non-selective slurries for chemical-mechanical polishing of a metal layer and a method for manufacturing thereof, and further to a method for forming a plug in an...
6500049 Lapping oil composition for finish-grinding  
The present invention relates to a lapping oil composition which is advantageously used in finish-grinding of a material to provide a high-quality grinding surface, without selective grinding,...
6500870 Method for manufacturing of silica sols  
A method for production of high purity silica sols comprising the steps: (a) adding a phosphonic acid-based complexing agent to the silicic acid-containing solution forming complexes with metal...
6494928 Polishing compound for sheet metal coating  
There is provided a polishing compound for sheet metal coating comprising an polishing material and a surfactant in which a RB ceramics and/or CRB ceramics powder is used at least as a part of the...
6488730 Polishing composition  
The present invention relates to a polishing composition comprising 30 to 99 wt % of deionized water, 0.1 to 50 wt % of powder of metallic oxide and 0.01 to 20 wt % of cyclic amine. This polishing...
6482244 Process for making an abrasive sintered product  
A method for making an abrasive product comprising forming a structure of a sinterable retaining matrix having at least one first region containing a plurality of abrasive particles embedded...
6478835 Abrasive composition for polishing magnetic recording disk substrates  
The present invention provides an abrasive composition for polishing magnetic recording disk substrates that results in a low surface roughness of the magnetic recording disk, allows the attaining...
6478832 Grinding stone, process for its production and grinding method employing it  
A grinding stone using a metal material as the main material of a bonding material, which comprises: (A) abrasive grains of at least one member selected from the group consisting of diamond, cubic...
6479036 Particulate materials for use in dentifrice compositions  
Silica particles for incorporation into a dentifrice composition, preferably as a thickening agent, have a polyether glycol such as polyethylene glycol applied thereto in order to enhance...
6478831 Abrasive surface and article and methods for making them  
A method for making an abrasive material comprising a plurality of hard particles providing the abrasive quality distributed in a retaining matrix for holding the particles in place, the method...
6478833 Abrasive composition and tools for stone materials and ceramics  
Abrasive composition for the manufacture of tools for the execution of surface treatments on stone and ceramic materials, comprising a superabrasive and a binder comprising a frit approximately...
6478878 Blasting medium and blasting method  
A blasting medium which has an average grain size of at most 20 μm and contains at least 90 mass % of a water-soluble inorganic salt, wherein the content of grains having grain sizes of at least...
6471735 Compositions for use in a chemical-mechanical planarization process  
Provided are methods for making a slurry composition, suitable for use in a chemical-mechanical planarization process. Also provided are compositions made by such methods. The methods comprise...
6464741 CMP polishing slurry dewatering and reconstitution  
A method of making a slurry, by mixing a quantity of water with dissolvable constituents of an aqueous slurry used for polishing, with the dissolvable constituents being apportioned according to...
6454819 Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device  
A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite...
6447563 Chemical mechanical polishing slurry system having an activator solution  
This invention relates to a CMP slurry system for use in semiconductor manufacturing. The slurry system comprises two parts. The first part is a generic dispersion that only contains an abrasive...
6447372 Polishing agent for semiconductor substrates  
The polishing agent of the invention has polishing grains suspended in a solution. The polishing grains consist essentially of a first substance with a glass transition temperature T G , and the...
6447373 Chemical mechanical polishing slurries for metal  
A slurry for use in chemical-mechanical polishing of a metal layer comprising particles dispersed in an aqueous medium. The slurry particles will tend to agglomerate when the slurry is at rest and...
6443827 Polishing member and process for producing the same  
A polishing member for use in polishing of an end face of an optical fiber connector ferrule comprises a substrate and a polishing layer, which is overlaid on the substrate and which comprises a...
6443811 Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing  
An aqueous based ceria slurry system and method for chemical mechanical polishing of semiconductor wafers, the slurry comprising less than 5 wt % abrasive cerium oxide particles and up to about the...