|
Match
|
Document |
Document Title |
|
|
6755878 |
Abrasive articles and methods of making and using the same
Abrasive articles have an adhesive layer in contact with a liner having protrusions that contact the adhesive layer.
|
|
|
6752844 |
Ceric-ion slurry for use in chemical-mechanical polishing
The invention provides a chemical-mechanical polishing slurry comprising a liquid, cerium ions as an oxidizer, an abrasive, and a pH increasing substance. The cerium ions are in the liquid in a...
|
|
|
6750257 |
Colloidal silica slurry
The present invention provides the colloidal silica slurry which does not have a bad influence, such as corrosion, to a silicon wafer and wiring material on a silicon wafer and inhibits growth of...
|
|
|
6749653 |
Abrasive particles containing sintered, polycrystalline zirconia
Abrasive particles and methods of making abrasive particles are disclosed. The abrasive particles may be incorporated into a variety of abrasive articles, including bonded abrasives, coated...
|
|
|
6746498 |
Abrasive with a modified surface and a method for making it
A composition is described that comprises an abrasive, and a hydrocarbon containing component that is coupled to the abrasive. Such a composition may be included in a slurry that is used to polish...
|
|
|
6743267 |
Gel-free colloidal abrasive polishing compositions and associated methods
Gel-free colloidal abrasive polishing compositions and associated methods for polishing (e.g., chemical mechanical polishing) are described. These abrasive polishing compositions are comprised of a...
|
|
|
6743268 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy
A tantalum-based liner for copper metallurgy is selectively removed by chemical-mechanical planarization (CMP) in an acidic slurry of an oxidizer such as hydrogen peroxide, deionized water, a...
|
|
|
6736869 |
Method for forming a planarizing pad for planarization of microelectronic substrates
A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas...
|
|
|
6733577 |
Liquid polish
The invention pertains to a liquid polish for metals, glass, plastics and their derivatives: the novel liquid polish reduces application and buffing time significantly compared to prior art...
|
|
|
6733553 |
Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same
The present invention can provide an abrasive composition for polishing a semiconductor device which composition contains water, microparticles of an abrasive, and a chelating agent, wherein the...
|
|
|
6726534 |
Preequilibrium polishing method and system
The invention provides a polishing system that comprises a liquid carrier, an alkali metal ion, hydroxide ions, and a polishing pad and/or an abrasive. The abrasive can be dispersed in the liquid...
|
|
|
6723143 |
Reactive aqueous metal oxide sols as polishing slurries for low dielectric constant materials
An aqueous metal oxide sol slurry has been developed for removal of low dielectric constant materials. The slurry is formed directly in solution utilizing non-dehydrated chemically active metal...
|
|
|
6723144 |
Semiconductor device fabricating method
A film formed on a surface of a wafer on which an integrated circuit is to be constructed can be planarized by using a fixed abrasive tool regardless of the width of elements of a pattern...
|
|
|
6719819 |
Polishing composition
For aluminum disks and glass-made hard disks, those disks having a mean waviness of less than 3 Å are being desired in order to increase the density of memory capacity. The present invention...
|
|
|
6709317 |
Method and apparatus for uniformly planarizing a microelectronic substrate
A method and apparatus for planarizing a microelectronic substrate. The apparatus can include a planarizing medium having a relatively hard polishing pad and a planarizing liquid disposed on a...
|
|
|
6706083 |
Fused—Al2O3-MgO-Y2O3 eutectic abrasive particles, abrasive articles, and methods of making and using the same
Fused abrasive particles comprising eutectic material comprising Al 2 O 3 —MgO—Y 2 O 3 eutectic. The fused abrasive particles can be incorporated into abrasive products such as coated...
|
|
|
6702867 |
Vitrified bonded abrasive tools
The present invention provides a vitrified-bonded abrasive tool wherein the abrasive grit portion comprises a thermally sensitive abrasive grain, such as sintered sol gel microcrystalline alpha...
|
|
|
6692547 |
Method for preparing abrasive articles
A method for preparing an abrasive article of the present invention comprises coating a conductive binder resin on one surface of a cylinder paper or greige cloth, coating abrasive particles on one...
|
|
|
6689692 |
Composition for oxide CMP
A chemical mechanical polishing composition comprising a soluble cerium compound at a pH above 3 and a method to selectively polish a silicon oxide overfill in preference to a silicon nitride film...
|
|
|
6685757 |
Polishing composition
A polishing composition for polishing a semiconductor wafer includes comprises water, an abrasive that is preferably colloidal silica, water-soluble cellulose having a molecular weight of at least...
|
|
|
6682574 |
Binder for abrasive articles, abrasive articles including the same and method of making same
A binder for abrasive products, coated abrasive articles and a method of making the same comprising a urea formaldehyde resin precursor cured in the presence of a sole catalyst which consists...
|
|
|
6682575 |
Methanol-containing silica-based CMP compositions
The invention provides a polishing composition comprising (a) a silica abrasive, (b) methanol, and (c) a liquid carrier, wherein the polishing composition has a pH of about 1 to about 6, and the...
|
|
|
6679928 |
Polishing composition having a surfactant
A polishing composition for polishing a semiconductor substrate has a pH of under 5.0 and comprises (a) a carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having...
|
|
|
6679929 |
Polishing composition and polishing method employing it
A polishing composition comprising the following components (a) to (g): (a) at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium...
|
|
|
6676719 |
Aqueous dispersion, a process for the preparation and the use thereof
A pyrogenic process is used to prepare alkali-doped silica particles. Particles produced by this process exhibit homogeneous doping, reduced agglomeration, greater stability and higher removal...
|
|
|
6676718 |
Polishing of semiconductor substrates
According to the invention, an aqueous polishing composition comprises, abrasive particles and water of basic pH to remove a barrier layer by CMP using a polishing pad, the aqueous polishing...
|
|
|
6676484 |
COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHING WITH A FIXED ABRASIVE PAD
The invention comprises copper chemical-mechanical polishing processes using fixed abrasive polishing pads, and copper layer chemical-mechanical polishing solutions specifically adapted for...
|
|
|
6673132 |
SiO2/Al2O3 composite abrasive and method for producing the same
An SiO 2 /Al 2 O 3 composite abrasive is disclosed, which has positive surface charges when dispersed in an alkaline water solution. This SiO 2 /Al 2 O 3 composite abrasive includes an Al 2 O 3 ...
|
|
|
6669748 |
Dispersion liquid of silica particles for polishing, method of producing the same, and polishing agent
The present invention provides a dispersion liquid of silica particles for polishing with a low content of Na ions and also with a content of ions other than Na ions in a prespecified range. This...
|
|
|
6669745 |
Abrasive article with optimally oriented abrasive particles and method of making the same
The invention provides abrasive articles with optimally oriented abrasive particles and a method of making the same. The method involves contacting a substrate with the contact and mating surfaces...
|
|
|
6669746 |
Filamentary brush bristle material
Brush bristles include filaments of synthetic resin material containing two or more types of abrasive particles selected from among diamond powder, stainless-steel powder, titanium powder, silicon...
|
|
|
6663467 |
Process and composition for abrading pre-finished surfaces
An abrading composition and a process for abrading factory pre-finished surface coverings, wherein the abrading composition comprises an effective amount of wear-resistant particles, a rheology...
|
|
|
6663683 |
Aqueous dispersions, process for their production, and their use
An aqueous dispersion containing a cerium oxide-doped, pyrogenically produced silicon dioxide, wherein the cerium oxide is introduced through an aerosol of a cerium salt solution or suspension and...
|
|
|
6656241 |
Silica-based slurry
This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a...
|
|
|
6656240 |
Non-asbestos friction material
A non-asbestos friction material is made by molding and curing a composition which includes a fibrous base other than asbestos, a binder, an organic filler, an inorganic filler and an abrasive. The...
|
|
|
6652612 |
Silica particles for polishing and a polishing agent
Silica particles for polishing have a three-dimensional polycondensation structure with an average particle diameter in a range from 5 to 300 nm. The silica particles have residual alkoxy groups...
|
|
|
6645265 |
Polishing formulations for SiO2-based substrates
Powders of particles comprising a ceramic core and a coating of ceria deposited thereon provide an economical and effective abrasive for glass polishing formulations.
|
|
|
6645471 |
Composite abrasive material for oral compositions, and methods of making and using same
A composition of matter comprising particles of silica, where the silica particles have surfaces at which condensed phosphate is retained, and a production methodology therefor. Oral compositions...
|
|
|
6645263 |
Cellular abrasive article
Abrasive articles abrasive articles (e.g., abrasive wheels) comprised of abrasive agglomerate particles dispersed within cellular polymeric material, and methods of making and using the abrasive...
|
|
|
6641629 |
Abrasion resistant coatings
A coating composition for forming abrasion-resistant, high clarity coatings is described. It has been found that a macrocrystalline or single crystal mineral abrasive can be added at high levels,...
|
|
|
6641631 |
Polishing of semiconductor substrates
An aqueous polishing composition having abrasive particles of a metal oxide has a pH that undergoes pH drift, because ions are provided by dissolution of the metal oxide, and the pH drift is...
|
|
|
6641627 |
Abrasive articles
Abrasive articles (e.g., abrasive wheels) comprised of abrasive particles and polymeric material such as a polymeric reaction product of components comprising saturated polyol, saturated...
|
|
|
6641632 |
Polishing compositions and use thereof
Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planarizing surfaces, and preventing delamination and scratches.
|
|
|
6641630 |
CMP compositions containing iodine and an iodine vapor-trapping agent
The invention provides a chemical-mechanical polishing system, and a method of polishing using the system, comprising (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b)...
|
|
|
6638327 |
Method for repairing and lustering defects on hydrophilic coat surface
A method for repairing and lustering defects on a hydrophilic coat surface is reported. The method comprises the steps of applying a buffing composition on a hydrophilic coat surface; and buffing...
|
|
|
6638326 |
Compositions for chemical mechanical planarization of tantalum and tantalum nitride
The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the...
|
|
|
6638328 |
Bimodal slurry system
A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said...
|
|
|
6626967 |
Polishing composition and polishing method employing it
A polishing composition comprising the following components (a) to (c): (a) colloidal silica; (b) at least one bicarbonate selected from the group consisting of ammonium bicarbonate, lithium...
|
|
|
6620215 |
Abrasive composition containing organic particles for chemical mechanical planarization
The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor...
|
|
|
6620214 |
Method of making ceramic aggregate particles
Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in...
|