Matches 401 - 450 out of 51590 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
7281967 Machine for grinding optical lenses  
The invention relates to a machine comprising a train of grinding stones ( 21 ), mounted to rotate about a first axis (A–A′), a lens support ( 15 ), provided with means ( 37 ), for rotating the...
7281809 Open lattice mirror structure and method of making same  
A method of making a mirror structure includes assembling a supporting isogrid framework, assembling an isogrid back plane, interconnecting the supporting isogrid framework with the isogrid back...
7281537 Multi-station block-texture modifying system and block-spacer  
Disclosed herein is a block-texture-modifying apparatus for modifying the surface texture of blocks. The apparatus comprises a support for supporting blocks thereon, a multi-station block-texture...
7281535 Saw singulation  
Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate...
7281317 Manufacturing method of flying magnetic head slider  
A manufacturing method of a flying magnetic head slider includes a step of providing a substrate with a plurality of inductive write head elements formed thereon, each head element having a pair of...
7278911 Conductive polishing article for electrochemical mechanical polishing  
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive...
7278910 Wheel scraper for a floor sander  
A wheel scraper for a floor sander attaches to the swivel support wheel of a floor sander and scraper debris from the support wheel in order to prevent debris accumulation on the support wheel. The...
7278909 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method for manufacturing semiconductor device and polishing apparatus  
In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched...
7278908 Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular  
A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached,...
7278907 Method of adhering polishing pads and jig for adhering the same  
The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing...
7278906 Adhesive tape and edging method using same  
An adhesive tape which is to be arranged between a lens and at least one of a plurality of chucks in an edge-machining apparatus comprises an adhesive face for being in contact with the lens. A...
7278905 Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation  
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then...
7278904 Method of abrading a workpiece  
A method of abrading a surface of a workpiece with a structured abrasive article in the presence of a liquid comprising water and at least one of a sulfonate or sulfate anionic surfactant.
7278903 Processing method for wafer and processing apparatus therefor  
A processing method for wafers includes: a preparing step for preparing a wafer having an active device region and a reinforcing rib region. The active device region having plural devices is formed...
7278902 Enabling location specific burnishing of a disk  
Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to...
7278901 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film  
A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided....
7278206 Method of preparing terminal board  
A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its...
7275981 Symmetrical wall sander  
A disc-shaped sanding pad has a round perimeter. Centrally located in the pad is a socket. A ball, coupled to the end of a handle, is inserted into the socket, permitting the sanding pad to both...
7275980 Abrasive articles with novel structures and methods for grinding  
Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade,...
7275979 Apparatus for treating edges of panels and method  
An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced...
7275978 Hand power tool which receives its operating voltage from a power supply unit  
A hand power tool is connectable to a power supply unit via a multi-wire cable including a plurality of lines for delivering an operative voltage, and the power supply unit is adjustable by an...
7275311 Apparatus and system for precise lapping of recessed and protruding elements in a workpiece  
An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with...
7275306 Damascene method for forming write coils of magnetic heads  
An improved damascene method of forming a write coil of a magnetic head. The method includes the steps of forming a hard mask layer over an insulator layer; forming a photoresist layer over the...
7273412 Abrasive wheel with improved composing structure  
An abrasive wheel with improved structure comprises: an abrasive component, an adapting ring received by the combining hole in the central region of the abrasive component, two covers which are...
7273411 Polishing apparatus  
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then...
7273410 Guiding and pressing device for a belt sander  
A guiding and pressing device for a belt sander includes two triangular guiding blocks or sheet-like inclined guiding blocks, which are disposed at suitable positions on a front side frame of the...
7273409 Process for forming spherical components  
A process is disclosed for forming a spherical component using a centrifugal processing machine. The process includes the steps of providing a component having an initial shape with at least a...
7273408 Paired pivot arm  
The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one...
7273407 Transparent polishing pad  
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an...
7273406 Glass treatment system and method  
A system for abrading and scoring glass. An abrading/scoring station includes a table for supporting a large sheet of glass on a generally flat support. A first tool support moves an abrading tool...
7273405 Sintered rare earth magnetic alloy wafer and wafer surface growing machine  
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic...
7272883 Methods of forming an electrical connection in a magnetic head using a damascene process  
In one illustrative example disclosed, a method for use in making a magnetic head involves forming a thermal-assist heater for the magnetic head; forming a plurality of coil layers of a write coil...
7271888 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures  
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint...
7270598 Orbital sander  
An orbital sander is provided having a number of novel features including a high speed permanent magnet DC motor having a relatively flat rpm versus torque curve. The sander includes an AC to DC...
7270597 Method and system for chemical mechanical polishing pad cleaning  
In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and...
7270596 Chemical mechanical polishing process  
A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided...
7270595 Polishing pad with oscillating path groove network  
A polishing pad ( 20 ) for polishing a wafer ( 32 ) or other article, the pad having a groove network ( 60 ) configured to increase the residence time polishing medium ( 46 ) on the pad. The groove...
7270594 Polishing apparatus  
A polishing apparatus has a polishing table ( 12 ) with a polishing surface ( 10 ) attached thereon, and a top ring ( 20 ) for pressing a workpiece (W) against the polishing surface ( 10 ). The top...
7270593 Light beam targeting and positioning system for a paint or coating removal blasting system  
A blasting system for the removal of coatings or paint from an underlying surface uses an optical device to position the blasting nozzle an appropriate stand-off distance from the surface. The...
7270592 Milling machine  
The improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and...
7270591 Electric sander and motor control therefor  
A hand held orbital sander has a housing having an electronically commutated motor disposed therein and an orbit mechanism disposed beneath the housing. A motor controller is coupled to the motor....
7268281 Apparatus for abrading a reed used in a musical instrument  
An apparatus for abrading a reed for a musical instrument comprises: a base having two top surfaces tilted toward each other and having tapered parallel tracks in its side edge surfaces; and a...
7267841 Method for manufacturing single-sided sputtered magnetic recording disks  
An information-storage media is provided that includes: (a) a substrate disk 312 having first and second opposing surfaces; (b) a first interface layer 304 on the first surface, the...
7267610 CMP pad having unevenly spaced grooves  
A chemical mechanical polishing pad ( 100 ) having a circular polishing track ( 124 ) and a concentric center ( 116 ). The polishing pad ( 100 ) includes a polishing layer ( 104 ) having a groove...
7267609 Dual purpose sanding and collecting abrading device  
A dual purpose abrading device for smoothing, sanding or finishing a surface of an object while simultaneously surrounding, collecting and containing the particles or debris as they are being...
7267608 Method and apparatus for conditioning a chemical-mechanical polishing pad  
A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or...
7267607 Transparent microporous materials for CMP  
The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01...
7267605 Method and apparatus for abrasive recycling and waste separation system  
The present invention provides a method of handling abrasive solids materials used in an abrasive cutting procedure which jets a high-pressure abrasive slurry through a nozzle ( 7 ) onto a work...
7267604 Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method  
Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a...
7267603 Back grinding methods for fabricating an image sensor  
Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the...
Matches 401 - 450 out of 51590 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >