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8145342 |
Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side...
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8142257 |
Detecting device for abnormal workpiece rotation in non-circular workpiece grinding machine
In a non-circular workpiece grinding machine, a proximity sensor is arranged to face a non-circular portion of a workpiece for sensing a maximum diameter portion of the non-circular portion to...
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8118640 |
Wafer transferring apparatus, polishing apparatus, and wafer receiving method
A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher...
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8113913 |
Method for the simultaneous grinding of a plurality of semiconductor wafers
Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein...
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8100739 |
Substrate holding apparatus, polishing apparatus, and polishing method
A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a...
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8083571 |
Polishing apparatus
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing...
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8070555 |
Visual feedback for airfoil polishing
A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system...
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8047895 |
Machining device comprising a measuring device for a model
The invention relates to a machining device (5) comprising a workpiece (8) and at least one machining tool (23, 40, 41) and a measuring device (1, 22) and a seat (20) for the workpiece (8) to be...
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8025554 |
Method of polishing work
In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps...
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8002607 |
Polishing apparatus and polishing method
A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member...
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7988528 |
Apparatus and method for grinding threaded portion of workpiece
An apparatus for grinding a threaded portion of a workpiece, is provided. The threaded portion has a spiral groove formed therein. The apparatus includes a motor, a grinding cord, a detector and a...
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7985119 |
Blank for the production of a dental shaped body and method of producing said shaped body
A blank and method for the production of dental shaped bodies in machining equipment having at least two tools located in the machining chamber of the machining equipment, including a corpus of...
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7980920 |
Spectacle lens manufacturing method
A manufacturing method of a spectacle lens improving a manufacturing yield and a production efficiency is provided. The manufacturing method of the spectacle lens in which necessary information for...
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7976358 |
Polishing apparatus and polishing method
A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and...
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7930058 |
Nanotopography control and optimization using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side...
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7927181 |
Apparatus for removing material from microfeature workpieces
Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises...
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7927185 |
Method for assessing workpiece nanotopology using a double side wafer grinder
A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method...
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7916407 |
Holding assembly and transport arrangement for handling lenses and method for finishing lenses
A holding device (1) holds a lens (6) at its lens edge (5) with the aid of an adhesive connection (16, 17). The adhesive connection (16, 17) is applied only at one adhesive point or only at two...
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7909676 |
Independent measuring apparatus for grinding machines
Measuring apparatus (50) of geometrical parameters of cylinders, rolls and similar elements (11), used for the rolling of flat products operating on a machine for the grinding of said cylinders...
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7848843 |
Eyeglass lens processing apparatus and lens fixing cup
In a two-step processing mode in which a cup for attaching a lens to a chuck axis is changed from a large diameter cup to a small diameter cup on the way of processing, a roughing path data...
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7837533 |
Apparatus for processing and measuring workpieces which are provided with cutting teeth
The present invention relates to an apparatus (10) for processing and measuring workpieces, in particular plate-shaped or cylindrical workpieces, which are provided with cutting teeth (S), with a...
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7824246 |
Wheel spindle device for grinding machine
In a wheel spindle device wherein a plurality of grinding wheels are attached in a juxtaposed relation to a wheel spindle rotatably carried on a wheel head of a grinding machine, a reference...
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7811153 |
High throughput servo load cup with integrated wet chemistry delivery
A work piece handling apparatus moves workpieces with a plurality of independently movable load cups that have combined multiple axes of motion. The apparatus can load and unload work pieces from a...
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7803036 |
Method of using a contour follower
A contour follower includes a plurality of sensors spaced around a waterjet nozzle, each of the sensors being configured to measure a distance between a working surface and a first plane,...
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7722437 |
Manufacturing method of semiconductor integrated circuit device
A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad....
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7666062 |
Grinding apparatus with magnetic bearings
A grinding wheel having a convex grinding surface is attached to a wheel spindle that is contactlessly supported by a casing through a controlled type axial magnetic bearing and controlled type...
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7662023 |
Double side wafer grinder and methods for assessing workpiece nanotopology
A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned...
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7645180 |
Method for finishing a workpiece
A method for abrasive material removal that includes the steps of establishing an optimum force profile relating to the force or contact pressure applied by a processing tool on a workpiece. The...
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7635289 |
Contour follower
A collision detection sensor for a waterjet system provides a signal in the event the device approaches to within a selected distance of an obstruction in the plane of the working surface. An...
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7628677 |
Automated insulation milling machine
An automatic insulation block milling machine is disclosed. The machine combines a series of operations into a single, automatic, production-line machine. Blocks of rigid insulation material, such...
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7601049 |
Double side wafer grinder and methods for assessing workpiece nanotopology
A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned...
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7585205 |
Substrate polishing apparatus and method
A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing...
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7544587 |
Wafer dividing method and wafer dividing apparatus
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to...
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7541767 |
Decentralized error response in cam disk axes
The invention relates to a method for error response when an error occurs in response to a motion, particularly of a drive mechanism in a machine, the motion taking place while using at least one...
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7530879 |
Apparatus for reworking a steel edge of a ski
An apparatus is described for reworking a steel edge of a ski (1), comprising at least one grinding apparatus (16) made of a cup-like grinding wheel (18) which is driven by a motor (17) and...
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7527544 |
System of using offset gage for CMP polishing pad alignment and adjustment
A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In...
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7524232 |
Workpiece centering apparatus and method of centering workpiece
The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet...
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7507143 |
Truing method for grinding wheel
In a grinding machine comprising conductive grinding wheels, the invention presents a truing technique capable of truing grindstone surfaces of grinding wheels at high precision in a short time....
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7452262 |
Knife sharpeners with improved knife guides
Various forms of knife guides are provided for knife sharpeners to minimize damage to the knife blade. One of the forms of knife guides comprises non-contact optical arrangements which includes a...
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7438628 |
Device and control unit for belt sanding systems
A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing...
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7438775 |
Lens layout block device
A lens layout block device comprising a seal feeding device that supplies an elastic seal to a seal sticking position (A5). The elastic seal is loaded in a tape loading part in the form of a seal...
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7435158 |
Initial position setting method of grinding wheel in vertical double disc surface grinding machine
The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding...
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7431632 |
Control system and method for processing jewelry and the like
A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a...
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7422511 |
Element for detecting the amount of lapping having a resistive film electrically connected to the substrate
An element for detecting an amount of lapping of a stacked structure that includes a substrate and a magnetic field detecting sensor is provided. The element comprises: a resistive film that is...
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7416474 |
Planarization apparatus
The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge...
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7412999 |
Label remover
The present invention relates to a hand held label removal apparatus, which provides a safe and easy removal of otherwise hard to remove labels that are affixed to various types of containers such...
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7413499 |
Grinding process and apparatus with arrangement for grinding with constant grinding load
A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the...
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7377836 |
Versatile wafer refining
Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New...
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7354332 |
Technique for process-qualifying a semiconductor manufacturing tool using metrology data
A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with...
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7347765 |
Honing installation with several work stations
A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of...
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