|
Match
|
Document |
Document Title |
|
|
8182312 |
CMP system with wireless endpoint detection system
A CMP polishing pad with an optical sensor assembly embedded in the pad, connected to a transceiver and/or power supply mounted at the center of the pad or at the outer edge of the pad which...
|
|
|
8172642 |
Multi-sander
A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool...
|
|
|
8166630 |
Magnetic head slider manufacturing method
To provide a manufacturing method which can adjust the lengths of a recording element and a reproducing element for enabling manufacture of high-quality magnetic head sliders. The manufacturing...
|
|
|
8161627 |
Method of making a write head lapping guide about aligned to a non-magnetic layer surrounding a write pole
A method in one embodiment includes forming an electric lapping guide layer; forming a write pole; forming a first gap layer over the write pole; masking a portion of the first gap layer for...
|
|
|
8157617 |
Method for polishing a semiconductor wafer
Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material...
|
|
|
8157616 |
Polishing end point detection method
A method for detecting an end point of a polishing operation (e.g., a polishing stop point or a changing point of polishing conditions) of a film of a substrate is described. The method includes...
|
|
|
8160737 |
Machine tool with numerical controller and on-machine measuring device
A machine tool is fitted with a position detector for detecting a position of a moving axis of the machine tool and an on-machine measuring device for measurement on the machine tool. An axial...
|
|
|
8152597 |
Wafer grinding method and wafer grinding machine
A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding...
|
|
|
8152594 |
Polishing apparatus
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top...
|
|
|
8145342 |
Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side...
|
|
|
8129279 |
Chemical mechanical polish process control for improvement in within-wafer thickness uniformity
A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the...
|
|
|
8128458 |
Polishing apparatus and substrate processing method
A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate...
|
|
|
8123591 |
Abrasive pump for an abrasive jet cutting machine
An abrasive supply system may, for example, be used to supply abrasive particles such as garnet to a cutting nozzle of an abrasive jet cutter. According to an embodiment, the abrasive is propelled...
|
|
|
8123593 |
Configuring of lapping and polishing machines
A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a...
|
|
|
8113017 |
Method for cleaning a glass substrate, method for fabricating a glass substrate, and magnetic disk using same
A method for cleaning a glass substrate which ensures removal of abrasive and other foreign matter without making a cleaning step complicated involves cleaning the glass substrate by scrubbing...
|
|
|
8106651 |
Methods and apparatuses for determining thickness of a conductive layer
Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current...
|
|
|
8100740 |
Corner saw
A cutting apparatus for cutting corner pieces formed of stone or other materials for use as building faces or for cutting flat pieces is disclosed herein. The cutting apparatus includes a frame...
|
|
|
8096148 |
Method for fabricating a glass substrate, magnetic disk, and method for fabricating the same
A method for fabricating a glass substrate containing SiO2 as a main ingredient thereof and having a uniform and minute pattern of stripes formed on the surface thereof by ultraprecision polishing...
|
|
|
8078419 |
Polishing monitoring method and polishing apparatus
A method monitors a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value...
|
|
|
8070554 |
Distributed shunt structure for lapping of current perpendicular plane (CPP) heads
An apparatus and method for lapping and fabricating a read/write head is described. The lapping method includes performing a first lapping process on a structure having the read/write head...
|
|
|
8057280 |
Chemical mechanical planarization apparatus
A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at...
|
|
|
8047896 |
Polishing apparatus, polishing method, and processing apparatus
The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a...
|
|
|
8047894 |
Apparatus for evaluating the quality of a lapping plate
Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, an information receiver receives information while the lapping plate is being used to...
|
|
|
8043870 |
CMP pad thickness and profile monitoring system
In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein...
|
|
|
8038507 |
Eyeglass lens processing apparatus
An eyeglass lens processing apparatus includes: an edge position detector which detects front and rear edge positions of an eyeglass lens based on target lens shape data; a bevel locus setting unit...
|
|
|
8038509 |
Chemical mechanical polishing apparatus
Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto...
|
|
|
8029333 |
Device for polishing peripheral edge of semiconductor wafer
A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the...
|
|
|
8025554 |
Method of polishing work
In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps...
|
|
|
8025555 |
System for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system
A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens,...
|
|
|
8021210 |
Polishing head and polishing apparatus having the same
The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from...
|
|
|
8003304 |
Method for manufacturing a perpendicular magnetic write pole using an electrical lapping guide for tight write pole flare point control
A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method provides for accurate definition of a device feature such as a write pole flare point. A functional...
|
|
|
7996986 |
Apparatus for forming magnetic recording heads
An apparatus includes: a first layer having a near field transducer positioned in a waveguide cladding; a second layer having a magnetic pole piece; a third layer including a solid immersion...
|
|
|
7987583 |
Magnetic head slider testing apparatus and magnetic head slider testing method
A step portion for mounting a row bar is provided at a table stepping down from the face of the table, and by lowering a pair of hooks crossing over the step portion in its width direction, a row...
|
|
|
7980922 |
Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate....
|
|
|
7972195 |
Tire grinding method and grinding device
In a grinding device, first, an eddy-current-sensor detects a distance from the eddy-current-sensor to an outer peripheral surface of a belt layer while a tire to be retreaded held by a pair of...
|
|
|
7972196 |
Methods of crystallographically reorienting single crystal bodies
A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and...
|
|
|
7967661 |
Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system...
|
|
|
7969111 |
Numerical controller for controlling a five-axis machining apparatus
A numerical controller capable of moving a tool end point position to an accurate position in a five-axis machining apparatus. Compensation amounts are set, which correspond to respective ones of a...
|
|
|
7963823 |
Machining machine with means for acquiring machining parameters
A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining...
|
|
|
7950982 |
Method for achieving stripe height control at bow compensated lapping
A lapping device comprises a mounting surface for coupling at least one non-parted slider row. At least one lever arm is coupled to at least one distal end of the mounting surface. The lever arm...
|
|
|
7946906 |
Tile saw with laser guide
A tile cutting machine includes a tub for receiving water and a tile to be cut therein. A cutting head assembly having a motor driven blade is positioned above a tile supporting surface located in...
|
|
|
7941911 |
Planarization methods for patterned media disks
A method is provided for forming a plurality of regions of magnetic material in a substrate having a first approximately planar surface. The method comprises the steps of fabricating projections in...
|
|
|
7938713 |
Device for water-jet cutting or abrasive water-jet cutting units
Control device and method for controlling the impingement of the workpiece by a water jet or an abrasive water jet in a cutting unit. Control device includes a feeder composed of at least two...
|
|
|
7931522 |
Removable optical monitoring system for chemical mechanical polishing
A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a...
|
|
|
7930058 |
Nanotopography control and optimization using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side...
|
|
|
7927181 |
Apparatus for removing material from microfeature workpieces
Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises...
|
|
|
7927182 |
Polishing system with in-line and in-situ metrology
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an...
|
|
|
7922561 |
System for providing quantitative process control of finesse polishing
A system for providing quantitative process control of a finesse polishing based upon feedback to the operator as to whether he/she is meeting the one or more predetermined key control...
|
|
|
7922562 |
Systems and methods for reducing electrostatic charge of semiconductor wafers
A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and...
|
|
|
7914362 |
Method of evaluating the quality of a lapping plate
Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the...
|