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7635290 |
Interpenetrating network for chemical mechanical polishing
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive...
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7617579 |
Eyeglass lens processing apparatus
An eyeglass lens processing apparatus includes a lens holding unit for holding an eyeglass lens, a roughing tool, a finishing tool, a drilling tool, a processing water supply unit for applying...
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7604527 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process...
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7572168 |
Method and apparatus for high speed singulation
A method of singulating semiconductor devices applies a blade to a molded strip that includes the semiconductor device. The blade generates a kerf at a contact point between the blade and the...
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7568968 |
Coolant nozzle positioning for machining work-pieces
A method of determining a position of a coolant nozzle relative to a rotating grinding wheel removing material from a work-piece and an apparatus for practicing the method are disclosed. The method...
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7513819 |
Polishing apparatus and method
There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate...
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7485029 |
Double face polishing apparatus
The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an...
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7481696 |
Grinding machine and coolant supplying method therefor
In a rough grinding step the large quantity of coolant supplied to cool the grinding point enables the flow to pass through a wheel-following air layer and reach the grinding point while the supply...
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7473160 |
Method and apparatus for grinding a workpiece
A method and apparatus for cutting a profile in a workpiece, such as a turbine disk, without cracking the parent material which includes providing a grinding wheel having a ceramic grinding surface...
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7419420 |
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to...
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7390240 |
Method of shaping and forming work materials
Method of processing a workpiece comprising (a) providing a tool and a workpiece, wherein the workpiece has an initial shape; (b) placing the workpiece and the tool in contact to form an interface,...
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7364494 |
Eyeglass lens processing apparatus and method of processing eyeglass lens
An eyeglass lens processing apparatus for processing an eyeglass lens includes: a lens chuck that holds the lens; a roughing tool; a finishing tool; a finishing data input unit that inputs...
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7335088 |
CMP system with temperature-controlled polishing head
A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media...
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7306508 |
Multi-wire saw
A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and...
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7297286 |
Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants
A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a...
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7238084 |
Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same
Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing...
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7214123 |
Retainer ring, Polishing head, and chemical mechanical polishing apparatus
A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head...
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7201642 |
Process for producing improved membranes
The present invention relates generally to the field of chemical/mechanical polishing of substrates. In particular the invention relates to methods of producing improved membranes for use in...
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7201634 |
Polishing methods and apparatus
Apparatus for and methods of chemical mechanical polishing (CMP) of semiconductor wafers are disclosed. A preferred embodiment comprises an apparatus for polishing a semiconductor workpiece that...
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RE39547 |
Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates
An apparatus and method for stopping mechanical and chemical-mechanical polishing of a substrate at a desired endpoint. In one embodiment, a polishing machine has a platen, a polishing pad...
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7182669 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator that is adapted to change an optical property in response to a planarizing condition. This process indicator...
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7182674 |
Coolant delivery apparatus for machine tool
A coolant delivery apparatus for a machine tool wherein the position of the coolant delivery apparatus is controllable such that coolant may be delivered to the machining contact zone of a tool...
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7156720 |
Substrate holding apparatus
A substrate holding apparatus can accurately control temperature of a substrate in a direct manner with a relatively simple arrangement. The substrate holding apparatus has a top ring configured to...
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7153189 |
Coolant supply method and apparatus for grinding machine
In a coolant supply method and apparatus for a grinding machine, when an end surface of a workpiece is ground with a grinding wheel end surface of a grinding wheel with coolant being supplied...
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7153188 |
Temperature control in a chemical mechanical polishing system
The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and...
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7121922 |
Method and apparatus for polishing a workpiece surface
The invention relates to a method for machining a workpiece surface, wherein an area to be machined of the workpiece surface is machined under the influence of a polishing operation and wherein,...
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7101258 |
Double sided polishing machine
Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each...
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7086931 |
Magnetic head bar holding unit, lapping device, and method of lapping medium-opposing surface of thin-film magnetic head
The heaters in the respective thin-film magnetic head in the bar are electrically connected to its neighbors, and a variable resistor is connected to each of the heaters in parallel. The resistance...
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7086930 |
Coherent jet nozzles for grinding application
A nozzle assembly and method is configured to apply coherent jets of coolant in a tangential direction to the grinding wheel in a grinding process, at a desired temperature, pressure and flowrate,...
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7048610 |
Conditioning polishing pad for chemical-mechanical polishing
In one embodiment, a CMP pad is conditioned by repeatedly cycling the CMP pad between a first temperature and a second temperature higher than the first temperature to eliminate at least one...
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7033249 |
Dry ice blasting cleaning apparatus
The invention is an apparatus used for cleaning equipment including extremely high voltage energized electrical equipment using a dry ice blasting stream as the cleaning agent. The apparatus...
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7029368 |
Apparatus for controlling wafer temperature in chemical mechanical polishing
Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for...
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7029369 |
End-point detection apparatus
An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the...
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7014528 |
Grinding machine and grinding fluid supply-nozzle therefor
It is one object of a grinding machine and a grinding fluid supply-nozzle therefor according to the present invention to supply grinding fluid to a moving grinding point reliably, even if the...
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7014529 |
Substrate processing method and substrate processing apparatus
A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is...
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6984162 |
Apparatus methods for controlling wafer temperature in chemical mechanical polishing
Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for...
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6976902 |
Chemical mechanical polishing apparatus
There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the...
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6966819 |
Injecting an air stream with sublimable particles
Apparatus and method to inject an air stream with dry ice or other sublimable particles to be blasted against a surface to be cleaned. An air lock assembly ( 20 ) with an air stream passage ( 21 )...
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6953750 |
Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization
A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality...
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6945847 |
Method of lapping medium-opposing surface in thin-film magnetic head
A thin-film magnetic head is formed on a support and is provided with a reproducing head part, a recording head part, and a heater for generating heat upon energization. A medium-opposing surface S...
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6942544 |
Method of achieving very high crown-to-camber ratios on magnetic sliders
A method of precisely controlling the amount of flatness or curvature in a lapping plate is disclosed. The lapping plate is formed from two layers of metal alloys, such as tin-antimony and steel. A...
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6937915 |
Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact...
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6932673 |
Grinding method and device for the same
The present invention supplies coolant to a grinding wheel surface and reliably guides the coolant to a grinding point on the grinding wheel surface, thereby significantly reducing the amount of...
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6926592 |
Surface treatment of mechanically abraded glass
A method of treating the surface of mechanically abraded glass includes a first step of providing a glass substrate having opposing first and second surfaces. The glass substrate having a recess in...
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6913515 |
System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders
A system and apparatus precisely controls the amount of flatness or curvature in a lapping plate. The lapping plate is formed from two layers of metal alloys, such as tin-antimony and steel. A...
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6910945 |
Honing method and honing apparatus
In a coarse honing step in a section ( 101 ), a honing head ( 15 ) provided with coarse honing hones ( 17 ) is inserted into a cylinder bore ( 13 ) of a cylinder block ( 11 ), the honing head 15 ...
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6905397 |
Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
A chemical mechanical polishing apparatus is described, which includes a platen, a polishing pad that is attached to the platen, and a means for adjusting the temperature of the polishing pad.
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6902470 |
Apparatuses for conditioning surfaces of polishing pads
The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the...
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6896586 |
Method and apparatus for heating polishing pad
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location...
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6887128 |
Method of reducing thermal distortion in grinding machines
The invention provides a method of reducing thermal distortion in grinding machines. Such machines each comprise a machine base ( 60 ) and a grinding wheel ( 50 ) for grinding components in the...
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