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Match Document Document Title
7473161 Lapping machine and head device manufacturing method  
A lapping machine that polishes a head block in which plural head devices are connected in a row includes a jig that has a bottom surface that opposes to a grinding plane, and fixes the head block...
7473159 Detection of diamond contamination in polishing pad and reconditioning system therefor  
A reconditioning system for reconditioning a damaged polishing pad is disclosed. The reconditioning system includes a reconditioning disk including a plurality of diamonds for reconditioning the...
7452262 Knife sharpeners with improved knife guides  
Various forms of knife guides are provided for knife sharpeners to minimize damage to the knife blade. One of the forms of knife guides comprises non-contact optical arrangements which includes a...
7442111 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting  
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a...
7438627 Polishing state monitoring method  
A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring...
7416474 Planarization apparatus  
The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge...
7416472 Systems for planarizing workpieces, e.g., microelectronic workpieces  
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is...
7413500 Methods for planarizing workpieces, e.g., microelectronic workpieces  
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is...
7409260 Substrate thickness measuring during polishing  
A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a...
7407433 Pad characterization tool  
Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored...
7404754 CNC tungsten steel cutting machine  
A CNC tungsten steel cutting machine suitably used to cut a metal material, such as tungsten carbide steel, includes an operational platform, a cutting mechanism, a feeding mechanism, a delivering...
7384326 Facetting area setting device and eyeglass lens processing apparatus  
A facetting area setting device for setting a facetting area so as to perform a facetting on an edge corner of an eyeglass lens which has been finished, includes: an input unit that inputs a target...
7377837 Grinding or polishing arrangement  
A grinding or polishing machine or device having a grinding or polishing disc for grinding or polishing a work piece for the condition of the work piece placed against the lower surface of the...
7367873 Substrate processing apparatus  
A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus...
7361601 Chemical mechanical polish process and method for improving accuracy of determining polish endpoint thereof  
A method for improving accuracy of determining polish endpoint of chemical mechanical polish (CMP) process is provided. The method is performed before the CMP process. First, a test wafer with a...
7357694 Jet singulation  
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to...
7354334 Reducing polishing pad deformation  
A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring...
7354333 Detection of diamond contamination in polishing pad  
Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned...
7354332 Technique for process-qualifying a semiconductor manufacturing tool using metrology data  
A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with...
7341502 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces  
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process...
7338569 Method and system of using offset gage for CMP polishing pad alignment and adjustment  
A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In...
7338345 Cutting machine  
A cutting machine comprising a chuck table for holding a workpiece, which is arranged such that it can move along a guide rail extending in a predetermined direction, a gate-like support frame that...
7338344 Automated drill bit re-sharpening and verification system  
A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the...
7332438 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool  
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a...
7306507 Polishing pad assembly with glass or crystalline window  
Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first...
7306506 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging  
Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals...
7300332 Polished state monitoring apparatus and polishing apparatus using the same  
A polished state monitoring apparatus capable of easily grasping the progress of polishing is provided. The polished state monitoring apparatus monitors the progress of polishing of a surface to be...
7296956 Machine-tool or production machine with head-up display  
A machine-tool production machine is disclosed, with a workspace that can be viewed by an operator through a window or transparent pane, whereby the window or transparent pane can be used with a...
7294039 Polishing system with in-line and in-situ metrology  
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an...
7291280 Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride  
The present invention provides a method for polishing silica and silicon nitride on a semiconductor wafer comprising the steps of planarizing the silica with a first aqueous composition comprising...
7291057 Apparatus for polishing a substrate  
A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table...
7273407 Transparent polishing pad  
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an...
7271888 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures  
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint...
7270593 Light beam targeting and positioning system for a paint or coating removal blasting system  
A blasting system for the removal of coatings or paint from an underlying surface uses an optical device to position the blasting nozzle an appropriate stand-off distance from the surface. The...
7270592 Milling machine  
The improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and...
7264537 Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system  
Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system....
7264536 Polishing pad with window  
A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing...
7258602 Polishing pad having grooved window therein and method of forming the same  
A polishing pad having grooved window therein is provided. The polishing pad comprises a polishing layer and a window, wherein the polishing layer has at least one first groove therein and the...
7258596 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces  
Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of...
7255629 Polishing assembly with a window  
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is...
7252575 Polishing state monitoring apparatus and polishing apparatus and method  
A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring...
7247080 Feedback controlled polishing processes  
Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a...
7241202 Substrate polishing apparatus  
A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing...
7234997 Device for grinding of clothing in a textile machine  
A grinding device for the flats of a card comprises elastically bendable elements which enter between the clothing points, brush over the side flanks of the points and thereby grind the points....
7229338 Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies  
Planarizing machines, planarizing pads, and methods for planarizing or endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrates. One particular embodiment is a...
7229337 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting  
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a...
7226339 Spectrum based endpointing for chemical mechanical polishing  
Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery...
7226338 Milling machine  
The improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and...
7214123 Retainer ring, Polishing head, and chemical mechanical polishing apparatus  
A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head...
7214122 Substrate polishing apparatus  
A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a...
Matches 1 - 50 out of 779 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >