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Match Document Document Title
8172643 Polishing system having a track  
Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system....
8157614 Method of making and apparatus having windowless polishing pad and protected fiber  
A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or...
8157616 Polishing end point detection method  
A method for detecting an end point of a polishing operation (e.g., a polishing stop point or a changing point of polishing conditions) of a film of a substrate is described. The method includes...
8152596 Apparatus for deburring boards  
An apparatus for deburring boards includes a platform, on which first and second guiding rail units perpendicular to each other are fixed, a deburring unit mounted on the first guiding rail unit, a...
8152595 System and method for optical endpoint detection during CMP by using an across-substrate signal  
In a polishing process, the characteristics of the removal process may be monitored at different lateral positions to identify the clearance of the various device regions with a high degree of...
8137160 Gear matching device and gear machining apparatus  
Provided is a gear matching device which performs gear matching to establish a rotational phase relationship between a grindstone (13) and a gear-shaped workpiece (W) in which the grindstone and...
8128458 Polishing apparatus and substrate processing method  
A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate...
8123593 Configuring of lapping and polishing machines  
A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a...
8118641 Chemical mechanical polishing pad having window with integral identification feature  
Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification...
8118640 Wafer transferring apparatus, polishing apparatus, and wafer receiving method  
A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher...
8092274 Substrate polishing metrology using interference signals  
A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen,...
8088298 Spectra based endpointing for chemical mechanical polishing  
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a...
8083570 Chemical mechanical polishing pad having sealed window  
A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer...
8070555 Visual feedback for airfoil polishing  
A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system...
8047895 Machining device comprising a measuring device for a model  
The invention relates to a machining device (5) comprising a workpiece (8) and at least one machining tool (23, 40, 41) and a measuring device (1, 22) and a seat (20) for the workpiece (8) to be...
8047896 Polishing apparatus, polishing method, and processing apparatus  
The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a...
8043870 CMP pad thickness and profile monitoring system  
In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein...
8038508 Apparatus for polishing a wafer and method for detecting a polishing end point by the same  
A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head...
7988529 Methods and tools for controlling the removal of material from microfeature workpieces  
Methods and apparatus for controlling the removal of material from microfeature workpieces in abrasive removal processes. An embodiment of such a method comprises irradiating a periodic structure...
7985121 Chemical-mechanical planarization pad having end point detection window  
A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure...
7967661 Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture  
Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system...
7946905 Bit sharpening apparatus and method of using  
Disclosed in the present application is a sharpening apparatus and method for sharpening a cutting bit. The apparatus comprises a sharpening member and a laser for accurately positioning the...
7942724 Polishing pad with window having multiple portions  
A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window...
7938714 Polishing pad assembly with glass or crystalline window  
Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first...
7931522 Removable optical monitoring system for chemical mechanical polishing  
A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a...
7927184 Method and system for endpoint detection  
A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the...
7927181 Apparatus for removing material from microfeature workpieces  
Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises...
7927182 Polishing system with in-line and in-situ metrology  
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an...
7927183 Polishing pad  
A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device...
7918712 Endpoint detection system for wafer polishing  
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from...
7899572 Method and device for measuring the geometry of a cutting edge to be chamfered  
The machining of drills (1) includes an operation for chamfering the cutting edges (8) performed in two steps. In the first step the rotating grindstone (15) is directed to various locations of the...
7892070 Process of using a polishing apparatus including a platen window and a polishing pad  
A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second...
7892069 Loading device of chemical mechanical polishing equipment for semiconductor wafers  
A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate...
7874894 Polishing pad  
A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking...
7846008 Method and apparatus for improved chemical mechanical planarization and CMP pad  
A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer...
7841925 Polishing article with integrated window stripe  
A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along...
7841926 Substrate polishing metrology using interference signals  
A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the...
7824244 Methods and apparatus for polishing a semiconductor wafer  
Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove...
7787982 Working system, method for detecting contact, and acoustic emission contact detection device  
The object is to aim at the reduction in the influence of noises in an output of an AE sensor in a working machine. In a working system comprising a working device for working a work W by causing a...
7780503 Polishing apparatus and polishing method  
A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus...
7775852 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations  
An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated....
7774086 Substrate thickness measuring during polishing  
A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra...
7764377 Spectrum based endpointing for chemical mechanical polishing  
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of...
7741701 Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment  
A method for treating an area of a semiconductor wafer surface with a laser for reducing stress concentrations is disclosed. The wafer treatment method discloses treating an area of a wafer surface...
7731566 Substrate polishing metrology using interference signals  
A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the...
7734081 Grinding method and system with non-contact real-time detection of workpiece thinkness  
A grinding method includes the steps of: enabling an image-capturing device to capture a set of consecutive images containing a workpiece being ground by a grinding device; enabling an...
7713106 Device grinding method  
A device grinding method comprising the steps of holding the undersurface of a protective member which supports a plurality of devices by affixing their front surfaces onto the top surface of the...
7699684 CMP porous pad with component-filled pores  
This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.
7686674 Cup attaching apparatus  
A cup attaching apparatus for attaching a cup to an eyeglass lens, comprises: a lens mount on which the lens is to be mounted; at least three support pins provided on the lens mount to support the...
7682221 Integrated endpoint detection system with optical and eddy current monitoring  
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output...
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