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7621799 |
Polishing method and polishing device
Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid...
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7614936 |
Spectrum based endpointing for chemical mechanical polishing
Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery...
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7572172 |
Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer...
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7534162 |
Grooved platen with channels or pathway to ambient air
A polish pad ( 120 ) and platen ( 130 ) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen ( 130 ) having a grooved or channeled surface ( 136 ) which is...
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7527546 |
Viscoelastic polisher and polishing method using the same
A viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius...
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7520797 |
Platen endpoint window with pressure relief
A polish pad ( 40, 42 ) and platen ( 50 ) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen ( 50 ) having a vented endpoint window ( 62, 72, 82 ) with one...
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7513820 |
Method and apparatus for producing micro-texture on a slider substrate using chemical and mechanical polishing techniques
A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is...
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7500906 |
Sanding tool with rotatable handle
A hand-held, manually-operated sanding tool including a base member, a clamping mechanism, a handle and a mounting assembly. The clamping mechanism is adapted to secure a sheet-like abrasive...
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7500905 |
Grinding apparatus and grinding system
A grinding apparatus and a grinding system capable of efficient and superior grinding performance prevent the falling of a belt during the grinding of an edge surface thereof. The apparatus...
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7494399 |
Single-step fiber grinding process and apparatus
A fiber grinding process includes: contacting an end of the optical fiber with a grinding surface in such a manner that a central axis of the optical fiber at the end is inclined to the grinding...
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7476145 |
Method for producing a mirror from a titanium-based material, and a mirror made from such a material
A method for producing a mirror ( 10 ) from a titanium-based material by using the technique of ultraprecision machining. The mirror produced using this method has both a shape accuracy and a...
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7470170 |
Polishing pad and method for manufacture of semiconductor device using the same
The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The...
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7465218 |
Probe polishing method and probe polishing member
In a probe polishing method, a plurality of probes, which are arranged on a probe card for performing an inspection of electrical characteristics of a target object, are polished by using a...
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7455571 |
Window polishing pad
A window polishing pad having a reduced stress pad window formed therein for performing optical end point detection are provided, wherein the window polishing pad comprises a pad window and a...
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7438631 |
Surface-protecting sheet and semiconductor wafer lapping method
It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and...
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7435163 |
Grinding sheet and grinding method
The present invention provides a grinding sheet wherein the width of the ridge in the pattern of abrasive layer is larger than the width of the recess formed between the adjacent portions of the...
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7429209 |
Method of polishing a glass substrate for use as an information recording medium
An information recording medium glass substrate manufactured by polishing the surface of a raw material glass plate. The polishing is divided into two steps, a step for performing a first polishing...
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7422512 |
Method and apparatus for surface treatment of a long piece of material
An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from...
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7419421 |
Slider having rounded corners and edges, and method for producing the same
A slider body characterized by rounded corners and edges and smooth surfaces, formed by polishing with a polymeric fiber and a free abrasive slurry of submicron particles.
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7413498 |
Lapping apparatus and lapping method
A film feeder (FF 1 ) feeds a film ( 1 ), a first drive ( 20 ) rotates a work (W), a second drive ( 30 ) moves the work (W) relative to the film ( 1 ), a shoe set handler ( 40 ) handles the shoe...
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7410409 |
Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl...
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7396497 |
Method of forming a polishing pad having reduced striations
The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having...
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7341503 |
Surface treating method for golf club head
A surface treating method for a golf club head includes applying polishing pretreatment on a golf club head and grinding at least one surface of the golf club head with a resilient grinding rod....
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7329171 |
Fixed abrasive article for use in modifying a semiconductor wafer
An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive...
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7291055 |
Wafer polishing method and apparatus
The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer,...
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7288019 |
Method of changing the surface wettability of polymer materials
The present invention belongs to the field of surface modification of solid materials, specifically relates to a method of changing the surface wettability of polymer materials. The method of the...
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7278904 |
Method of abrading a workpiece
A method of abrading a surface of a workpiece with a structured abrasive article in the presence of a liquid comprising water and at least one of a sulfonate or sulfate anionic surfactant.
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7270595 |
Polishing pad with oscillating path groove network
A polishing pad ( 20 ) for polishing a wafer ( 32 ) or other article, the pad having a groove network ( 60 ) configured to increase the residence time polishing medium ( 46 ) on the pad. The groove...
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7270596 |
Chemical mechanical polishing process
A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided...
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7264539 |
Systems and methods for removing microfeature workpiece surface defects
Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface...
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7261618 |
Device and method for abrading a wooden barrel
A device for abrading a wooden barrel ( 13 ) includes a robot having elements ( 11, 17, 23 ) for loading a barrel ( 13 ), elements ( 29 a , 29 b , 33 a , 33 b ) for gripping and rotating the barrel...
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7255632 |
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two...
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7254861 |
Device for cleaning tip and side surfaces of a probe
A device for cleaning the tip portion and the side surfaces of a probe has two or more different kinds of intermediate sheets affixed to a substrate in a side-by-side relationship with respect to...
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7252736 |
Compliant grinding wheel
A pre-planarization module configured to perform a long range planarization operation is provided. The pre-planarization module includes a semiconductor substrate support configured to rotate about...
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7241207 |
Grinding machine and method for grinding a workpiece
Disclosed is a grinding machine comprising oscillating driving means ( 3, 4 ) for setting grinding means ( 1 ) into an oscillating grinding motion and an actuation device ( 7 ) that is provided...
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7220172 |
Detail sanding block
A hand-held, manually-operated, sanding tool that can be used with conventional rectangular or square shaped sheet-like abrasive media to sand corners or other confined areas includes a base member...
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7220167 |
Gentle chemical mechanical polishing (CMP) liftoff process
A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution...
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7214124 |
Equipment and method for polishing both sides of a rectangular substrate
Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving...
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7207862 |
Polishing apparatus and method for detecting foreign matter on polishing surface
A polishing apparatus comprises a polishing tool having a polishing surface, and a holder device (top ring) for holding a semiconductor wafer (a substrate). The polishing apparatus further...
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7198550 |
Process for finish-abrading optical-fiber-connector end-surface
To provide a process for finish-abrading an optical-fiber-connector end-surface without generating abrasion scratch on an abraded surface of optical fiber, nor generating an adherent substance. A...
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7189150 |
System and method for edge blending hard drive head sliders
A system and method are disclosed for edge blending hard drive head sliders by oscillating abrasive lapping tape across the edges of multiple sliders simultaneously. Lapping tape is inserted...
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7182668 |
Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or...
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7179154 |
Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated...
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7172497 |
Fabrication of semiconductor interconnect structures
A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical...
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7160176 |
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal...
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7144304 |
Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the...
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7108587 |
Backup shoe for microfinishing and methods
A shoe for supporting an abrasive tape having an abrasive face and an opposed back face, wherein the shoe comprises a support surface including a frictional engagement material for frictionally...
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7104871 |
Method and apparatus for reconditioning compact discs
An apparatus and method for re-surfacing compact discs. One method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium...
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7094476 |
Surface-treated product, surface-treatment method, and surface-treatment apparatus
There is provided a surface treated product that moves relatively in a fluid, wherein a surface of the surface treated product has continuous dimples, each dimple having a diameter of 10 to 2500...
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7090566 |
Grinding apparatus and method for manufacturing magnetic recording medium using the same
A grindstone of a diamond wheel is cleaned by a rotating brush additionally provided in close proximity of the diamond wheel during a grinding operation in which a magnetic layer of a magnetic tape...
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