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8172642 |
Multi-sander
A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool...
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8167687 |
Method of thinning wafer and support plate
A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by...
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8162724 |
Surface treating method and apparatus
A surface treating apparatus treats a substrate surface by rotating a cylindrical polishing member in a state where the polishing member makes contact with the substrate surface. A polishing liquid...
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8157620 |
System and method for cleaning stator slots
A system and method for cleaning receiver slots with hook-fits for stator blade ring segments. A first cleaning tool with an abrasive coating and sideward projection in the shape of the hook is...
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8157621 |
Wafer back side grinding process
A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back...
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8137747 |
Components, turbochargers, and methods of forming the components
Components, turbochargers, and methods of forming components are provided. In an embodiment, by way of example only, a method of forming a component is provided. The method includes applying a...
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8133096 |
Multi-phase polishing pad
An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate...
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8133095 |
Method of shaping an ophthalmic lens
A method of shaping an ophthalmic lens includes machining the edge face of the lens by at least one rotary tool having an axis of rotation movable relative to the lens axis, both in rotation and...
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8123593 |
Configuring of lapping and polishing machines
A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a...
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8113921 |
Tool set for an eccentric grinder
The invention relates to a grinding disk for an eccentric grinding machine. In order to operate the grinding disk (22) having different disks diameters on one and the same eccentric grinding...
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8113915 |
Grinding worm, profiling gear and process for the profiling of the grinding worm
A grinding worm for the continuous generation grinding of a work piece is provided with mutually overlapping rough grinding and finish grinding zones arranged along the worm's axis, the finished...
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8100742 |
Grinding method for wafer having crystal orientation
A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck...
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8092277 |
Method of grinding semiconductor wafers, grinding surface plate, and grinding device
A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface...
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8092278 |
Reclamation method of semiconductor wafer
Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of...
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8070558 |
Porcelain epoxy flooring and method for producing the same
An epoxy porcelain tile surface including a plurality of spaced, substantially flat substantially smooth porcelain tiles and epoxy grouting substantially filling the spaces between the porcelain...
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8070559 |
Zr-rich bulk amorphous alloy article and method of surface grinding thereof
A method of surface grinding a Zr-rich bulk amorphous alloy article includes providing a substrate; providing a first surface grinder for rough surface grinding; and providing a second surface...
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8070557 |
Method of polishing glass substrate
An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a...
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8070554 |
Distributed shunt structure for lapping of current perpendicular plane (CPP) heads
An apparatus and method for lapping and fabricating a read/write head is described. The lapping method includes performing a first lapping process on a structure having the read/write head...
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8066551 |
Retaining ring with shaped surface
A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat,...
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8062097 |
Grinding surfaces of workpieces
A method of grinding a workpiece with a grinding wheel is provided wherein the shape of the wheel is distorted in a predetermined manner during grinding by changing the speed of rotation of the...
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8062094 |
Process of durability improvement of gear tooth flank surface
Pinion gears for planetary gear transmissions are hobbed, heat treated, and then ground to get better control of the leads/profiles on all the gear teeth. Then a light shot peening is applied to...
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8062096 |
Use of CMP for aluminum mirror and solar cell fabrication
The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition...
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8057283 |
Method of fabricating a whispering gallery mode resonator
A method of fabricating a whispering gallery mode resonator (WGMR) is provided. The WGMR can be fabricated from a particular material, annealed, and then polished. The WGMR can be repeatedly...
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8057281 |
Methods of removing defects in surfaces
Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing...
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8029335 |
Wafer processing method
In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer...
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8029336 |
Glass grinding system and method
A glass grinding method starts with an assessment of the scratch or surface defect to be removed. A series of abrasive pads with different diameters and different grits from 60, 120, 180, 220, and...
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8025556 |
Method of grinding wafer
A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing...
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7959493 |
Method for polishing glass substrate and process for producing glass substrate
Spots generated on a glass substrate after a polishing step are reduced. The present invention relates to a method for polishing a glass substrate including injecting a silica abrasive and a...
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7959495 |
Method and apparatus for finishing the surface of rubber covered rollers
A method and apparatus for finishing the surface of rubber or synthetic covered rollers (10) is disclosed. As seen in FIG. 3, a rotating hub (16) having a circumferential abrasion band (47) and an...
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7955159 |
Machining of ceramic materials
Milling strategies for machining dental ceramic materials are provided that reduce milling time while maintaining strength, accuracy and marginal integrity.
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7922564 |
Sanding element
The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) comprising sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of...
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7918713 |
Tribological surface and lapping method and system therefor
A conditioning process including the steps of: (a) providing a system including: (i) a workpiece having a metal working surface; (ii) a contact surface, disposed generally opposite the working...
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7909678 |
Method for manufacturing silicone wafers
A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon...
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7892071 |
Orthopaedic component manufacturing method and equipment
A method of reducing the surface roughness of articulating surfaces of orthopaedic implants is provided. The method includes the steps of providing an abrasive particle providing a chemical...
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7867059 |
Semiconductor wafer, apparatus and process for producing the semiconductor wafer
The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides,...
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7838067 |
Method for producing single-sided sputtered magnetic recording disks
An information-storage media is provided that includes: (a) a substrate disk 312 having first and second opposing surfaces;(b) a first selected layer 304 on the first surface, the first selected...
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7815492 |
Surface treatment method
A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a...
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7815489 |
Method for the simultaneous double-side grinding of a plurality of semiconductor wafers
A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of...
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7806601 |
Multifiber ferrule with precision bumpers and methods for making the same
A multifiber (MF) ferrule produced using a ferrule molding insert that is jig ground in order to improve the tolerance on the bumper height of a molded ferrule and the surface finish on the region...
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7806751 |
Method of manufacturing disk substrate
A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The...
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7785173 |
Superfinishing machine and method
A superfinishing system and method, wherein an abrasive is employed to process a workpiece, and wherein the system simultaneously mounts a plurality of workpieces in a diagonal turret, or mounts a...
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7776793 |
System and method for polishing surface of tape-like metallic base material
A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing...
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7775856 |
Method for removal of surface films from reclaim substrates
Embodiments of the invention describe a method for reclaiming a substrate by removing surface films with media blasting. A substrate is provided having a surface film. Media blasting is performed...
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7758402 |
Wafer grinding method
A recessed portion is formed in an area, of a rear surface of a wafer, corresponding to a device formation area is formed by a rough grinding wheel of a rough grinding unit and an annular...
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7748373 |
Combined apparatus for machining of articles, in particular in form of slabs
An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high pre...
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7741701 |
Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment
A method for treating an area of a semiconductor wafer surface with a laser for reducing stress concentrations is disclosed. The wafer treatment method discloses treating an area of a wafer surface...
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7727051 |
Servo stroking apparatus and system
A servo stroking apparatus and system (10) for honing wherein the cam stroking motion follows a cam profile which produces a finite jerk profile for reducing machine vibration and optimizing one or...
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7717768 |
Wafer polishing apparatus and method for polishing wafers
This wafer polishing apparatus includes: a polishing plate having a polishing pad; a carrier plate which is placed facing the polishing pad and which slides and presses wafers against the polishing...
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7712204 |
Manufacturing method of a thin-film magnetic head
A manufacturing method of a thin-film head includes the steps of, laminating and patterning a soft magnetic layer with iron alloy that contains silicon and aluminum through a base layer on a...
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7708619 |
Method for grinding complex shapes
A method of producing a complex shape in a workpiece includes the steps of: i) grinding a workpiece at a maximum specific cutting energy of about 10 Hp/in3·min with at least one bonded abrasive ...
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