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7635291 Interpenetrating network for chemical mechanical polishing  
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive...
7635290 Interpenetrating network for chemical mechanical polishing  
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive...
7632170 CMP apparatuses with polishing assemblies that provide for the passive removal of slurry  
Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing...
7628829 Abrasive article and method of making and using the same  
An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven...
7621798 Reducing polishing pad deformation  
A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom...
7604529 Three-dimensional network for chemical mechanical polishing  
The polishing pad ( 104 ) is useful for polishing at least one of magnetic, optical and semiconductor substrates ( 112 ) in the presence of a polishing medium ( 120 ). The polishing pad ( 104 )...
7604530 Inlaid polishing pad  
A surface treatment or a two-step injection molding is used to make an inlaid polishing pad. A surface of the inlaid polishing pad has areas of different rigidity to control the rigidity and...
7594845 Abrasive article and method of modifying the surface of a workpiece  
Provided is an abrasive article for lapping or polishing a workpiece comprising a three-dimensional, textured, flexible, fixed abrasive construction having a first surface and a working surface,...
7591713 Polishing pad, method for processing polishing pad, and method for producing substrate using it  
The present invention is a polishing pad used for polishing a semiconductor substrate, wherein, at least, grooves having a radial pattern are formed on a surface of the polishing pad, and (an...
7579071 Polishing pad containing embedded liquid microelements and method of manufacturing the same  
A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the...
7569268 Chemical mechanical polishing pad  
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20.7 MPa) and...
7553346 Abrasive product  
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
7544114 Abrasive articles with novel structures and methods for grinding  
Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade,...
7530887 Chemical mechanical polishing pad with controlled wetting  
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is...
7530880 Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor  
A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring...
7520800 Raised island abrasive, lapping apparatus and method of use  
Flexible abrasive sheet materials having annular bands of precise height flat-topped raised island structures that are coated with a mono layer of abrasive particles or abrasive agglomerates,...
7517277 Layered-filament lattice for chemical mechanical polishing  
The polishing pad ( 104 ) is useful for polishing at least one of a magnetic, optical and semiconductor substrate ( 112 ) in the presence of a polishing medium ( 120 ). The polishing pad 104 ...
7503833 Three-dimensional network for chemical mechanical polishing  
The polishing pad ( 104 ) is useful for polishing at least one of magnetic, optical and semiconductor substrates ( 112 ) in the presence of a polishing medium ( 120 ). The polishing pad ( 104 )...
7497768 Flexible abrasive article and method of making  
A flexible hand-held abrasive article includes a conformable backup pad having opposed major surfaces, a backing layer affixed to one surface of the backup pad, the backing layer containing a...
7458885 Chemical mechanical polishing pad and methods of making and using same  
Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods...
7445847 Chemical mechanical polishing pad  
The invention provides a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix having a top polishing...
7438635 Abrasive product having parallel base and abrasive threads  
The invention relates to an abrasive product intended to be driven in a particular grinding direction over the object to be abraded. The abrasive product is composed of parallel threads placed at a...
7435161 Multi-layer polishing pad material for CMP  
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially...
7429210 Materials for chemical mechanical polishing  
A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material...
7422516 Conductive polishing article for electrochemical mechanical polishing  
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an...
7410413 Structured abrasive article and method of making and using the same  
A structured abrasive article comprises a backing, a structured abrasive layer affixed to the backing, the structured abrasive layer comprising: a plurality of raised abrasive regions, each raised...
7399516 Long-life workpiece surface influencing device structure and manufacturing method  
A top layer comprises a flexible support and a plurality of hard elements anchored in a binder over the flexible support, and a method of forming the same is provided. In one embodiment, certain...
7377840 Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs  
Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining...
7378004 Pad designs and structures for a versatile materials processing apparatus  
An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface...
7374477 Polishing pads useful for endpoint detection in chemical mechanical polishing  
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including...
7367872 Conditioner disk for use in chemical mechanical polishing  
A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate...
7364497 Polish pad and chemical mechanical polishing apparatus comprising the same  
A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor...
7364500 Sanding apparatus and method of manufacture  
An improved resilient sanding block of the type comprising a core having a plurality of exterior surfaces, including a first major surface and a second major surface and side surfaces, and having a...
7357698 Polishing pad and chemical mechanical polishing apparatus using the same  
A polishing pad for chemically mechanically polishing a semiconductor wafer comprises a first groove pattern circularly formed on the surface of the polishing pad, and a second groove pattern...
7357703 Chemical mechanical polishing pad and chemical mechanical polishing method  
A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line...
7354337 Pad conditioner, pad conditioning method, and polishing apparatus  
The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic...
7354527 Chemical mechanical polishing pad and chemical mechanical polishing process  
A chemical mechanical polishing pad which has a storage elastic modulus E′(30° C.) at 30° C. of 120 MPa or less and an (E′(30° C.)/E′(60° C.)) ratio of the storage elastic modulus...
7344431 Pad assembly for electrochemical mechanical processing  
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side...
7338355 Abrasive article and methods of making and using the same  
An abrasive article having an apertured coated abrasive member, filter media, and an attachment interface member is formed by an ultrasonic welding process. The abrasive article is useful for...
7335094 Single-layer polishing pad and method of producing the same  
A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of...
7329174 Method of manufacturing chemical mechanical polishing pad  
The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch...
7323049 High pressure superabrasive particle synthesis  
An improved method for controlling nucleation sites during superabrasive particle synthesis can provide high quality industrial superabrasive particles with high yield and a narrow size...
7311590 Polishing pad with grooves to retain slurry on the pad texture  
A rotational chemical mechanical polishing pad designed for use with a polishing medium. The polishing pad includes a polishing layer having a polishing surface containing a plurality of grooves....
7306849 Method and device to clean probes  
A probe cleaning system automatically detects a surface of a probe cleaning device during a cleaning process by providing a predetermined finish on the surface of the probe cleaning device. The...
7300340 CMP pad having overlaid constant area spiral grooves  
A circular chemical mechanical polishing pad that includes a polishing surface having a concentrically located origin. The polishing surface includes groove sets each containing grooves arranged in...
7275980 Abrasive articles with novel structures and methods for grinding  
Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade,...
7275311 Apparatus and system for precise lapping of recessed and protruding elements in a workpiece  
An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with...
7273412 Abrasive wheel with improved composing structure  
An abrasive wheel with improved structure comprises: an abrasive component, an adapting ring received by the combining hole in the central region of the abrasive component, two covers which are...
7270595 Polishing pad with oscillating path groove network  
A polishing pad ( 20 ) for polishing a wafer ( 32 ) or other article, the pad having a groove network ( 60 ) configured to increase the residence time polishing medium ( 46 ) on the pad. The groove...
7267609 Dual purpose sanding and collecting abrading device  
A dual purpose abrading device for smoothing, sanding or finishing a surface of an object while simultaneously surrounding, collecting and containing the particles or debris as they are being...
Matches 1 - 50 out of 323 1 2 3 4 5 6 7 >