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Match Document Document Title
7628829 Abrasive article and method of making and using the same  
An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven...
7614933 Polishing pad assembly with glass or crystalline window  
Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first...
7604527 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces  
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process...
7591708 Method and apparatus of eddy current monitoring for chemical mechanical polishing  
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including...
7585340 Polishing composition containing polyether amine  
The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a...
7578728 Lapping system having a polymeric lapping tool  
A lapping system including: (a) a workpiece having a metal working surface; (b) a lapping tool having a contact surface for disposing generally opposite the working surface, the contact surface...
7569268 Chemical mechanical polishing pad  
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20.7 MPa) and...
7553346 Abrasive product  
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
7537511 Embedded fiber acoustic sensor for CMP process endpoint  
Devices, systems and methods for monitoring characteristics of semiconductor substrates and workpieces during planarization and for endpointing planarization processes are provided. The invention...
7503834 Apparatus and a method of polishing an optical surface; an optical component; and a method of manufacturing a polishing tool  
An apparatus for polishing an optical surface, in particular an optical surface of a spectacle lens, is disclosed. The apparatus comprises a polishing head having a polishing tool, the polishing...
7497765 Drywall sander  
A drywall sander includes a replaceable sanding pad having a layer of resilient material, and an abrasive surface. The sanding pad includes one or more edge portions that project beyond the edges...
7445847 Chemical mechanical polishing pad  
The invention provides a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix having a top polishing...
7442116 Chemical mechanical polishing pad  
A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the...
7438631 Surface-protecting sheet and semiconductor wafer lapping method  
It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and...
7422513 Porous abrasive articles with agglomerated abrasives  
A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being...
7414080 Polyurethane polishing pad  
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an...
7399330 Agglomerate abrasive grains and methods of making the same  
An abrasive agglomerate includes a plurality of abrasive grains bonded together in a three-dimensional structure by a substantially continuous, non-porous inorganic binder, wherein the abrasive...
7396497 Method of forming a polishing pad having reduced striations  
The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having...
7381121 Base pad polishing pad and multi-layer pad comprising the same  
Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same....
7374476 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates  
A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas...
7371160 Elastomer-modified chemical mechanical polishing pad  
The chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix with an elastomeric...
7357703 Chemical mechanical polishing pad and chemical mechanical polishing method  
A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line...
7354334 Reducing polishing pad deformation  
A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring...
7329170 Method of producing polishing pad  
A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a...
7329174 Method of manufacturing chemical mechanical polishing pad  
The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch...
7311590 Polishing pad with grooves to retain slurry on the pad texture  
A rotational chemical mechanical polishing pad designed for use with a polishing medium. The polishing pad includes a polishing layer having a polishing surface containing a plurality of grooves....
7306507 Polishing pad assembly with glass or crystalline window  
Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first...
7303662 Contacts for electrochemical processing  
Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact...
7297170 Method of using abrasive product  
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
7294158 Abrasive product, method of making and using the same, and apparatus for making the same  
The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least...
7294038 Process control in electrochemically assisted planarization  
In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing...
7294048 Abrasive article  
An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the...
7294049 Method and apparatus for removing material from microfeature workpieces  
Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to...
7291188 Polishing cloth and method of manufacturing semiconductor device  
A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50...
7273412 Abrasive wheel with improved composing structure  
An abrasive wheel with improved structure comprises: an abrasive component, an adapting ring received by the combining hole in the central region of the abrasive component, two covers which are...
7267608 Method and apparatus for conditioning a chemical-mechanical polishing pad  
A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or...
7267607 Transparent microporous materials for CMP  
The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01...
7264641 Polishing pad comprising biodegradable polymer  
The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group...
7261625 Polishing pad  
A single-layered polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafers, etc., which attains excellent step height reduction and in-plane uniformity and is...
7258708 Chemical mechanical polishing pad dresser  
CMP pad dressers and their methods of manufacture are disclosed. One aspect of the present invention provides a CMP pad dresser having improved superabrasive grit retention in a resin layer. The...
7235296 Formulations for coated diamond abrasive slurries  
The present invention is directed to an abrasive article and methods of making the abrasive article. An abrasive coating on the abrasive article comprises at least 20% by weight of a superabrasive...
7232364 Abrasive cleaning article and method of making  
The present invention provides an abrasive cleaning article, a method of making an abrasive cleaning article, and a method of cleaning a surface with an abrasive cleaning article. In one aspect,...
7229346 Finger-mounted tool device  
A finger-mounted tool device includes a finger-gripping sleeve formed of a hollow body tube and an abrading member. The hollow body tube is formed of a spirally wrapped progression of a spring...
7217305 Polishing body  
An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the...
7217179 Polishing pad  
A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the...
7214126 Abrasive material  
A flexible layer is formed on a surface of a core, and a polishing layer mixed with abrasive particles is formed on a top of the flexible layer. The flexible layer is produced by applying an...
7210980 Sealed polishing pad, system and methods  
A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer...
7207878 Conductive polishing article for electrochemical mechanical polishing  
Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer...
7204745 Device in a circular, disk-shaped element intended for cleaning purposes  
The invention relates to a device in a circular disk-shaped cleaning element intended for cleaning by means of a cleaning machine. The element is designed with a number of recesses ( 3 )...
7201647 Subpad having robust, sealed edges  
Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other...
Matches 1 - 50 out of 331 1 2 3 4 5 6 7 >