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7104342 |
Active rotational balancing system for orbital sanders
A system for active dynamic balancing of a rotating tool driven by a motor having a shaft supported by a first and second bearing on opposing sides of the motor includes an acceleration sensing...
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7103960 |
Method for providing a backing member for an acoustic transducer array
A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of...
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7104867 |
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to...
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7104870 |
Modified radial motion (MRM) method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears
The present invention relates to a modified radial motion method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears, which is capable of modifying a locus of a cutter...
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7101253 |
Load cup for chemical mechanical polishing
A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system...
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7101256 |
Machining apparatus using a rotary machine tool to machine a workpiece
A machining apparatus includes a rotary machine tool for machining a workpiece. A nozzle jets a coolant for the rotary machine tool. Information which changes based on a position of the nozzle is...
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7101254 |
System and method for in-line metal profile measurement
A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce...
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7101252 |
Polishing method and apparatus
A chemical mechanical polishing method for polishing an oxide film and a protective film formed on a substrate having recesses comprises four steps. The first step planarizes the oxide film using a...
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7101255 |
Polishing apparatus
This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a...
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7101799 |
Feedforward and feedback control for conditioning of chemical mechanical polishing pad
A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a...
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7103441 |
Calibration procedures and such using an erosion and grinding machine
A method for calibration of grinding and/or erosion machines assumes an initial calibration process and corresponding re-calibration processes. Calibration of the machine is performed with a...
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7100266 |
Method of forming a beveled writing pole of a perpendicular writing element
A beveled writing pole includes a top portion, a beveled portion, and a throat portion. The top portion has an end that defines a writing pole tip. The beveled portion adjoins the top portion and...
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7097536 |
Electrically enhanced surface planarization
A substrate processing apparatus equipped to employ electrical potential to assist in planarization and/or conditioning is provided.
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7097535 |
Method and configuration for conditioning a polishing pad surface
A method and a configuration for conditioning a polishing pad surface are described. The method includes measuring a rotation table current or voltage as an input for a motor driving the rotation...
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7097534 |
Closed-loop control of a chemical mechanical polisher
A method of controlling a chemical mechanical polishing system in which an inner tolerance, an outer tolerance and a specification tolerance limit are received by a control system. The user selects...
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7097540 |
Methods and apparatus for machining formed parts to obtain a desired profile
A multiple pass machining method for removing excess flash from a formed part to approximate a desired, curved profile on the formed part includes moving the part relative to a grinder in p...
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7097537 |
Determination of position of sensor measurements during polishing
A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a...
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7096567 |
Method for measuring amount of grinding in magnetic head producing process
The present invention is an object to provide an apparatus or a method making it possible to easily effect connection between additional electrodes, etc. and lead electrodes when performing a...
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7094128 |
Automatic machine for grinding the borders of glass panes
An automatic machine for grinding the borders of glass panes, particularly the edges, arranged preferably vertically but applicable to any other arrangement, comprising devices which allow the...
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7090561 |
Method and apparatus for pivot point determination and machine tool adjustment
A CNC apparatus has a memory configured to compensate for offsets in a pivot point. The machine tool has a head, a pivot point, a spindle, a table, and at least four axes including an X-axis, a...
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7090559 |
Ophthalmic lens manufacturing system
A tool for gripping ophthalmic lenses including a vacuum gripper, a shaft associated with said vacuum gripper, the shaft having two ends and being slidably attached at one end thereof to a support...
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7090560 |
System and method for detecting abrasive article orientation
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing...
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7086927 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is...
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7086928 |
System and method for ophthalmic lens manufacture
A method and system for the manufacture of ophthalmic lenses comprising a computer ( 102 ) and a CNC machining platform ( 104 ) in operative connection with the computer. The CNC machining platform...
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7083495 |
Advanced process control approach for Cu interconnect wiring sheet resistance control
A wafer based APC method for controlling an oxide (Cu, or TaN) polish step is described and combines a feed forward model that compensates for incoming wafer variations with a feed backward model...
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7081039 |
Grinder system and method for creating a contoured cutting face with a variable axial rake angle
Both a grinder system and a corresponding grinding method are based on a module, embodied preferably as a program or program segment, which, preferably automatically, defines the geometry of the...
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7081038 |
Polishing method and apparatus
Provided is a polishing method of polishing a substrate by rotating the substrate and a pad while keeping the pad in contact with the substrate, the method including: a first polishing step of...
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7081037 |
Pad conditioner setup
A method for inspecting the uniformity of the pressure applied between a conditioner and a polishing pad on a chemical mechanical polisher. A sheet of pressure sensitive material is placed between...
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7081040 |
Tool sharpener with web thickness determination capability
Method and apparatus for sharpening a tool, such as a drill bit. A tool sharpener includes a tool holder subassembly which retains and presents the tool against a grinding wheel subassembly. A...
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7077729 |
Aspherical surface processing method, aspherical surface forming method and aspherical surface processing apparatus
An aspherical surface processing method involves a workpiece to be processed by rotating around a rotation axis, and a rotational tool movable relative to the workpiece in the same direction as the...
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7077721 |
Pad assembly for electrochemical mechanical processing
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side...
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7074109 |
Chemical mechanical polishing control system and method
A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the...
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7073250 |
Method of manufacturing thin film magnetic head having partial insulating layer formed on bottom pole layer through gap layer
A thin film magnetic head wherein a partial insulating layer is formed on a bottom pole layer with a gap layer provided therebetween, the gap depth Gd being regulated by the distance from a surface...
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7070476 |
In-situ metalization monitoring using eddy current measurements during the process for removing the film
A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and...
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7070477 |
Method of polishing semiconductor wafer
In a wafer polishing method, a within-wafer distribution model of a removal rate and a within-wafer distribution model of a polishing process are selected, and a within-wafer distribution of a...
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7070474 |
Aspheric-surface processing method and aspheric-surface forming method
An aspheric-surface processing method according to the present invention, uses a cutting apparatus including at least one turning tool movable in the same direction as the rotating axis of the work...
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7070475 |
Process control in electrochemically assisted planarization
Aspects of the invention generally provide a method for polishing a material layer using electrochemical deposition techniques, electrochemical dissolution techniques, polishing techniques, and/or...
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7066786 |
Method of dressing polishing pad and polishing apparatus
A method to quantitatively detect an optimum endpoint of dressing of a polishing pad with a non-destructive monitoring of a surface of the polishing pad is offered. The polishing pad is dressed for...
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7065856 |
Machine tool method
A machine tool apparatus is provided employing a plurality of tool heads which may be sequentially or simultaneously automatically controlled to perform preprogrammed operations on either the same...
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7066791 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or...
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7062941 |
Manufacturing method of optical fiber preform
A method for manufacturing an optical fiber preform that can produce an optical fiber having desired characteristics over the longer length thereof. A crude preform provided with a core region and...
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7059939 |
Polishing pad conditioner and monitoring method therefor
A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A...
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7059948 |
Articles for polishing semiconductor substrates
Methods, articles of manufacture, and apparatus are provided for depositing a layer, planarizing a layer, or combinations thereof, a material layer on a substrate. In one embodiment, an article of...
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7059005 |
Polish cleaning apparatus and method in manufacture of HGA
A method and apparatus for cleaning the slider air bearing surface of a head gimbal assembly is disclosed. A plurality of carriers may position and hold a plurality of head gimbal assemblies to be...
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7056188 |
Rock saw
The present invention discloses an automated rock saw having a saw motor load sensor to control the speed of the conveyors bringing the rock to the saw blade. As the saw motor works harder to cut a...
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7056189 |
Grinding method of a workpiece and grinding apparatus
An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece...
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7056190 |
Pad conditioner test apparatus and method
A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that...
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7052364 |
Real time polishing process monitoring
A technique for in situ monitoring of polishing processes and other material removal processes employs a quartz crystal nanobalance embedded in a wafer carrier. Material removed from the wafer is...
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7052363 |
Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing
A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed....
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7052365 |
Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
The chemical-mechanical polishing (CMP) of products in general and semiconductor wafers in particular is controlled by monitoring the acoustic emissions generated during CMP. A signal is generated...
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