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6656014 |
Mobile bridge cutting arrangement
A mobile articulable cutter apparatus for the cutting and dismemberment of a building structure to permit the environmentally safe removal of such structure from a building site. The apparatus...
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RE38340 |
Multi-point bending of bars during fabrication of magnetic recording heads
A device for lapping a bar of the type which carries a plurality of sliders used in magnetic storage systems includes first, second and third actuators adapted to couple to the bar, and impart a...
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6652354 |
Polishing apparatus and method with constant polishing pressure
In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a...
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6648729 |
Wafer pressure regulation system for polishing machine
A controlled pressure regulation system generates the wafer-pressing pressures during a polishing operation. A wafer carrier head holds a wafer to be polished against a platen. A first and second...
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6648728 |
Polishing system
The present invention aims at make automatic real-time measurement of the removal rate in during polishing. For achieving the aim, a polishing system is provided with a sensor 1 for measuring a...
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6648727 |
CNC dual workhead chucker grinder
A grinding machine has an abrasive wheel mounted on a spindle carried by a wheelhead which provides for movement in a direction perpendicular to the spindle. A pair of workheads are separately...
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6645043 |
Method and apparatus for cold-end processing full lead crystal
An apparatus for grinding and polishing without visible flaws a variety of different size and shape full-lead crystal workpieces. A conveyor supports the workpieces and runs through the apparatus...
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6645044 |
Method of chemical mechanical polishing with controllable pressure and loading area
A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in...
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6641470 |
Apparatus for accurate endpoint detection in supported polishing pads
An optical window structure is disclosed. The optical window structure includes a support layer that has a reinforcement layer and a cushioning layer. In addition, the optical windows structure has...
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6641459 |
Method for conserving a resource by flow interruption
A method of conserving a facility delivered to a machine during the machine's idle mode is herein described. In one embodiment, the method is directed to a method for conserving coolant water...
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6641460 |
Lens grinding apparatus
In a lens grinding apparatus, an edge corner-portion processing unit has a cutting tool for effecting a facet processing on an edge corner portion of a lens subjected to the finishing process. A...
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6638140 |
Method and apparatus for polishing
In a Chemical Mechanical Polishing flattening processing against a surface with minute bumps and dips in a semiconductor process, this invention provides a method of polishing to be able to perform...
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6638137 |
Removing investment casting gates
An improvement in the after-cast operation of removing the casting gate from an investment casting comprising a formed locator on the gate, the formed locator being capable of locating the casting...
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6638138 |
Arrangement of grinding modules with grinding tools in track grinders
An arrangement of grinding modules in a track grinder wherein a radial mismatch in narrow track bend radii can be considered in an exact manner without occurrence of constraining forces, enabling...
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6638139 |
Multi-spindle end effector
A multi-spindle end effector is provided for a multiple axis robot. The multi-spindle end effector includes a plate housing having at least a pair of spaced-apart spindles mounted thereon. A...
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6638141 |
Method and apparatus for chemical-mechanical polishing
A polishing apparatus for CMP is provided. Heating means heats the substrate held by the holder. Temperature detecting means detects temperature of the heating means. Temperature compensating means...
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6634926 |
Width utilization prompter/monitor system for wide-belt abrasive machines
A prompter/monitor system for use in combination with wide-belt abrasive surface treating apparatus and including an array of individual axially spaced apart signal generating workpiece sensors...
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6632124 |
Optical monitoring in a two-step chemical mechanical polishing process
An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry...
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6633379 |
Apparatus and method for measuring the degradation of a tool
A machining apparatus ( 10 ) comprises a material removing tool ( 12 ) movably mounted for removing material from a workpiece ( 14 ); means for illuminating ( 42, 54 ) a sample area upon a tool...
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6632123 |
Grinding of cutting tools with wavy cutting edges
A CNC tool grinding machine has at least one rotatable grinding wheel ( 1 ) movable relative to a workpiece ( 2 ) for grinding a flute surface ( 3 ) of a blade in the workpiece ( 2 ). The machine...
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6629881 |
Method and apparatus for controlling slurry delivery during polishing
A fluid delivery apparatus and method for use in a chemical mechanical polishing system is provided. The delivery rate of a fluid onto a pad is controlled to reduce the consumption of the fluid. In...
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6626735 |
Method of stopping machining operation in machine tool and machining controlling apparatus for implementing the same
A machining controlling apparatus numerically controls a wheel spindle stock and a spindle apparatus, and performs the machining operation of a workpiece by a grinding wheel. When a power failure...
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6623330 |
Lapping sensor used in fabrication of magnetic head with magnetoresistive effect element and lapping control method using the sensor
A lapping sensor used in fabrication of a magnetic head with an MR element includes a resistor film with a resistance that varies depending upon a lapping amount, and a pair of connection pads...
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6623336 |
Magnetic head polishing device and method thereof
When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the...
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6623332 |
Grinding machine and method for real-time dimension control
A method for controlling the process during rough grinding of a workpiece provides that the workpiece is measured during grinding by a sensor to ascertain an actual size, and the measured actual...
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6620028 |
Apparatus for cutting a wafer
The present invention relates to an apparatus for cutting a wafer, wherein the wafer cutting process is performed along a back side of a wafer, a semiconductor chip being formed on the front side...
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6620336 |
Polishing pad, polishing apparatus and polishing method
A polishing pad for use in polishing a surface of a substrate comprises a pad main body having a polishing surface and a plurality of electrode portions formed within the pad main body and mutually...
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6620027 |
Method and apparatus for hard pad polishing
Methods and apparatus for planarizing a substrate surface having copper containing materials thereon is provided. In one aspect, the invention provides a system for processing substrates comprising...
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6616511 |
Rolling mill equipped with on-line roll grinding system and grinding wheel
A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is...
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6609949 |
Interface assembly for lapping control feedback
An interfaced carrier assembly including an interface circuit having printed contacts to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on...
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6609948 |
Method of making an electronic lapping guide (ELG) for lapping a read sensor
An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a...
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6609946 |
Method and system for polishing a semiconductor wafer
The present invention provides a method and system for polishing a wafer surface. The method and system comprises determining whether a thickness of the wafer surface is uniform while the wafer...
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6609950 |
Method for polishing a substrate
A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table...
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6606985 |
Dual-cutting method devoid of useless strokes
Disclosed is a dual-cutting method devoid of useless strokes of cutting blades across a workpiece. The work piece has cross lines drawn in the form of lattice, and it is divided into the...
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6604984 |
Grinding machine for machining sheets of glass
Grinding machine for machining sheets of glass; in the machine, a sheet which has one of its own perimeter edges which is at least partially to be ground, is advanced on a horizontal plane, through...
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RE38215 |
Polishing apparatus
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a...
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6602108 |
Modular controlled platen preparation system and method
A system and method are disclosed for preparing platens to perform lapping operations. The system includes a platter that is rotatably mounted on a base and designed to receive the platen thereon....
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6602110 |
Automated polishing apparatus and method of polishing
A polishing system for polishing a surface of a substrate, such as the surface of an optical pin mold, to a desired surface finish and profile under the automated control of a computer during a...
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6599174 |
Eliminating dishing non-uniformity of a process layer
A method includes providing at least one wafer having a process layer formed thereon. A surface of the process layer is polished using a first polishing process that is comprised of a slurry and a...
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6595830 |
Method of controlling chemical mechanical polishing operations to control erosion of insulating materials
The present invention is directed to a method of polishing wafers on a polishing tool comprised of first, second and third platens. The method comprises providing a wafer having a patterned layer...
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6594542 |
Method and system for controlling chemical mechanical polishing thickness removal
An improved method and apparatus for controlling the depth of removal by chemical mechanical polishing of a selected material on a supporting semiconductor underlayer where it is desired to...
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6585561 |
Method of teaching position
An object of the present invention is to provide a method of teaching a position, in which greater loads are not applied to a workpiece, a machining tool and a mechanism for moving the workpiece....
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6585562 |
Method and apparatus for polishing control with signal peak analysis
The apparatus for polishing control with signal peak analysis consists of two major units: a polishing machine and a polishing process control and monitoring system which has sensors for sensing...
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6582277 |
Method for controlling a process in a multi-zonal apparatus
A method for controlling a process in a multi-zonal processing apparatus and specifically for determining the optimum values to set for processing parameters J(Z i ) in each of the zones of that...
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6579155 |
Method and apparatus for form machining the peripheral edge of spectacle lenses
The invention relates to a method and a device for machining the peripheral edge of spectacle lenses and for optionally applying a subsequent facet thereto. The device comprises a driven...
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6578567 |
Wafer sawing apparatus
A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of...
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6579148 |
Polishing apparatus
A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing...
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6575812 |
Setting up process for a tool or workpiece on a gear making machine
Determining of the starting and end positions of the machining programme of a gear making machine with respect to the axial position of the workpiece ( 11, 18 ) by means of a laser light line ( 14...
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6575815 |
Process for calibrating throttle bores, in particular in injection valves for internal combustion engines, and device for executing the process
In a process and device for calibrating throttle bores, in particular in injection valves for internal combustion engines, by means of hydroerosive machining of the throttle bore with a suspension,...
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6572441 |
Method of and apparatus for chemical-mechanical polishing
During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation...
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