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6741913 |
Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system
A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and...
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6736700 |
Process and device for the registration of the state of wear of tools employed in gear manufacture
In a process for the registration of the state of wear of a tool used in gear manufacture, where the tool has at least one abrasive tooth tip for machining a workpiece in a machining process, a...
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6736699 |
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
An electrolytic polishing apparatus for electrolytic-polishing a conductive film subject to formed on a substrate including a resistance measuring unit for measuring the resistance of the film. The...
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6736697 |
Metal part having external surface with particular profile, polishing method for its production and device for implementing the method
The invention relates to a circularly-symmetrical metal part ( 1 ) having an outer surface ( 3 ) which, in axial section, has a general profile made up of a uniform succession of flattened convex...
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6733369 |
Method and apparatus for polishing or lapping an aspherical surface of a work piece
An apparatus for polishing or lapping an aspherical surface of a work piece comprises a tool rotatable about an axis, the working surface area of the tool being smaller than the work piece, and an...
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6733364 |
Computer controlled grinding machine
A computer controlled grinding machine programmed so as to control the machine by calculating the wellhead demand positions which takes into account the difference in height between the workpiece...
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6726527 |
Automatic disc repair system
An automatic system for repairing scratches on optically-read discs, (e.g., compact discs often called “CD's” or DVD's). More specifically, an automatic system for refurbishing a plurality of...
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6726526 |
Cutting machine
A cutting machine includes two cutting means. In a front half of a housing, a chucking zone is located in a widthwise center. A cassette placing zone is located on one side of the chucking zone,...
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6726525 |
Method and device for grinding double sides of thin disk work
A double side grinding apparatus comprises a pair of grinding wheels ( 4 ), work rotating device ( 1 ) and moving device ( 2 ). The apparatus operates to bring the grinding faces ( 4 a ) into...
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6722946 |
Advanced chemical mechanical polishing system with smart endpoint detection
The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred...
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6722956 |
Working apparatus
A finishing grindstone member ( 20 ) is fixed to a spindle ( 10 ) by a bolt. In the spindle ( 10 ), there is formed a tool mounting portion ( 25 ) into which a rough grindstone member can be...
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6722944 |
Apparatus for and method of attaching a lens holder to a spectacle lens, and a method for producing a lens
An apparatus for and process of attaching a lens holder to an uncut lens for a spectacle lens which enables efficient attachment of the lens holder at a position without the processing interference...
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6722942 |
Chemical mechanical polishing with electrochemical control
Various embodiments of a planarization device and methods of using the same are provided. In one aspect, a device for planarizing a surface of a semiconductor workpiece is provided that includes a...
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6722945 |
Endface polishing method and endface polishing apparatus
The invention is an endface polishing method and an endface polishing apparatus improving polishing accuracy of an optical fiber and making polishing time and polishing work shorten. Polishing is...
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6711829 |
Method for measuring work portion and machining method
A method for measuring the diameter and eccentricity of a crankpin of a crankshaft which is ground on a grinding machine. A reference plate is provided on a headstock, which is disposed on a table...
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6712669 |
BPSG chemical mechanical planarization process control for production control and cost savings
The polishing of a layer of boro-phosphate-silicate-glass (BPSG) is not easy to control as a result of CMP slurry chemistry effects, the doping concentration of the layer of BPSG and the heat...
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6712675 |
Method for grinding at least one surface on a cutting knife used in machining, use of said method and grinding wheel used to carry out said method
A grinding wheel ( 28 ) that rotates around an axis and that has a working area consisting of an annular surface with a circular arc profile in axial cross section is used to first generate a...
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6708547 |
Rolling mill and rolling method
There are disclosed a rolling mill capable of keeping a uniform plate of thickness distribution and manufacturing a good-quality plate, and a rolling method. The rolling mill comprises working...
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6709321 |
Processing jig
A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer...
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6709311 |
Spectroscopic measurement of the chemical constituents of a CMP slurry
An apparatus and method for determining the chemical content of a chemical mechanical planarization (CMP) slurry. A CMP sample cell has windows for passing electromagnetic radiation. Three...
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6709312 |
Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process
A method for monitoring a polishing condition of a surface of a wafer in a polishing process is provided, the method comprising providing a wafer ( 16 ) to be polished, the wafer ( 16 ) having at...
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6705921 |
Method and apparatus for controlling cutting tool edge cut taper
A tilt control assembly for controlling the tilt of a cutting tool head has a first eccentric support and a second support, with both of the first and second supports connected to the head along an...
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6702648 |
Use of scatterometry/reflectometry to measure thin film delamination during CMP
One aspect of the present invention relates to a system and method for examining a wafer for delamination in real time while polishing the wafer. The system comprises a polishing system programmed...
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6702646 |
Method and apparatus for monitoring polishing plate condition
An apparatus for monitoring a condition of a polishing plate, in particular for detecting the time for the polishing plate to be reconditioned or replaced, comprising a measuring unit containing at...
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6699101 |
Method for removing a damaged substrate region beneath a coating
A method of removing the damaged surface layer beneath a coating on a component. The method includes evaluating the component to assess the depth of the damaged substrate layer, followed by sensing...
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6699102 |
Lapping monitor for monitoring the lapping of transducers
A lapping monitor for monitoring the lapping of a lapping surface of a body having at least one transducer which has a height that has to be lapped. The lapping monitor has a lap unit for lapping...
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6695680 |
Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same
The operation of a polishing pad conditioner for a CMP apparatus is monitored. The polishing pad conditioner includes a housing, a first drive pulley disposed in the housing and connected to a...
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6688944 |
Spectacle lens chamfering data preparing method, spectacle lens chamfering method, spectacle lens chamfering data preparing apparatus, and spectacle lens chamfering apparatus
Methods and apparatuses for spectacle lens chamfering, wherein a predetermined chamfer width is inputted from a peripheral edge of a lens shape of a spectacle frame and a chamfer locus on a...
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6688945 |
CMP endpoint detection system
An endpoint detection system in a CMP apparatus has a polishing platen, a polishing pad covering the polishing platen, a chamber located in the polishing platen, and a gas flow system arranged in a...
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6690991 |
Machine control gage system performing roundness measuring function
A machine control gage system has a control unit, which analyzes roundness of a workpiece. The control unit controls a grinding machine controller in such a manner as to machine the workpiece to a...
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6685536 |
Method for grinding convex running faces and outside diameters on shaft-like workpieces in one set-up and grinding machine for carrying out the method
The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid...
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6682397 |
Machining device for processing metal hanging rod of blinds
A machining device for processing metal hanging rod of blinds having a machine platform, two fixing bases, and a retaining unit. A top of the machine platform has a holding groove for the two...
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6682398 |
Method for characterizing the planarizing properties of an expendable material combination in a chemical-mechanical polishing process; simulation technique; and polishing technique
A method for characterizing planarizing properties of a selected expendable material combination in a chemical-mechanical polishing process includes steps of: providing a combination of expendable...
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6682628 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
Methods and apparatuses for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of...
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6682396 |
Apparatus and method for linear polishing
A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length...
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6684171 |
In-situ stripe height calibration of magneto resistive sensors
An in-situ (result-directed/predictive) MR stripe height calibration method capable of operating on the fly during lapping operation. The method involves utilization of an interval sampling...
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6682407 |
Work-piece processing machine
The work-piece-processing machine of the present invention is compact and has two tools for precisely processing a work-piece. In the work-piece-processing machine, the work-piece is processed by a...
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6679755 |
Chemical mechanical planarization system
A processing system and method for processing a workpiece is generally provided. In one embodiment, the system includes a processing module and a substrate transfer shuttle. The processing module...
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6676493 |
Integrated planarization and clean wafer processing system
A wafer processing module is provided. In one example, the wafer processing module includes a sub-aperture CMP processing system and a pad exchange system including a pad magazine for storing CMP...
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6675464 |
Method of manufacturing a magnetic head
A method of manufacturing magnetic heads is provided in which a slider and a back yoke are joined to form a magnetic head main body. The main body is then fixedly bonded to a holding member that...
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6675058 |
Method and apparatus for controlling the flow of wafers through a process flow
A method for controlling the flow of wafers through a process flow includes monitoring operating states of a plurality of processing tools adapted to process wafers; measuring a characteristic of a...
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6672939 |
Cost-effective side-coupling polymer fiber optics for optical interconnections
A unidirectional and bidirectional optical fiber couplers using polymer optical fibers having mirrors formed within the polymer optical fibers for reflecting optical signals. The mirrors comprise a...
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6672944 |
Initial position setting method for grinding device
An initial position setting method for grinding work apparatus includes: a grind stone 11; a pair of lens rotating shafts 14, 14 which are capable of approaching and drawing apart each other...
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6669531 |
Apparatus for high tolerance brush honing
The present invention relates to a honing method and apparatus which provides greater control over the edge shape, as well as reductions in the effort required to hone multiple edges on workpieces....
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6666748 |
Machining center and method of changing tools thereof
The invention provides a machining center for machining a workpiece by moving a grinding wheel and the workpiece relative to each other in the X, Y and Z directions. The machining center has a main...
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6666749 |
Apparatus and method for enhanced processing of microelectronic workpieces
Chemical-mechanical planarizing machines and methods to maintain processing pads and other planarizing media used in planarizing microelectronic workpieces. In one embodiment, a planarizing machine...
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6666754 |
Method and apparatus for determining CMP pad conditioner effectiveness
A method includes supplying a signal to rotationally drive a conditioning wheel of a conditioning tool. A polishing pad of a polishing tool is conditioned using the rotationally driven conditioning...
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6663465 |
Grinding machine and method of sharpening blades
The invention relates to a grinding machine for sharpening (honing) blades ( 4 ) of knives, scissors, hand tools or the like, with a magazine, a feed station ( 1 ) or similar, and with a honing...
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6662433 |
Method of fabricating the thin film magnetic head
A thin film magnetic head includes a lower shielding layer composed of a magnetic material; a nonmagnetic MR gap layer on the lower shielding layer; a magnetoresistive element layer in the MR gap...
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6659848 |
Slurry dispenser that outputs a filtered slurry to a chemical-mechanical polisher at a constant flow rate over the lifetime of the filter
The slurry used in a chemical-mechanical polisher is passed through a filter, and output at a constant flow rate throughout the lifetime of the filter by measuring the flow rate of the slurry,...
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