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6741913 Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system  
A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and...
6736700 Process and device for the registration of the state of wear of tools employed in gear manufacture  
In a process for the registration of the state of wear of a tool used in gear manufacture, where the tool has at least one abrasive tooth tip for machining a workpiece in a machining process, a...
6736699 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing  
An electrolytic polishing apparatus for electrolytic-polishing a conductive film subject to formed on a substrate including a resistance measuring unit for measuring the resistance of the film. The...
6736697 Metal part having external surface with particular profile, polishing method for its production and device for implementing the method  
The invention relates to a circularly-symmetrical metal part ( 1 ) having an outer surface ( 3 ) which, in axial section, has a general profile made up of a uniform succession of flattened convex...
6733369 Method and apparatus for polishing or lapping an aspherical surface of a work piece  
An apparatus for polishing or lapping an aspherical surface of a work piece comprises a tool rotatable about an axis, the working surface area of the tool being smaller than the work piece, and an...
6733364 Computer controlled grinding machine  
A computer controlled grinding machine programmed so as to control the machine by calculating the wellhead demand positions which takes into account the difference in height between the workpiece...
6726527 Automatic disc repair system  
An automatic system for repairing scratches on optically-read discs, (e.g., compact discs often called “CD's” or DVD's). More specifically, an automatic system for refurbishing a plurality of...
6726526 Cutting machine  
A cutting machine includes two cutting means. In a front half of a housing, a chucking zone is located in a widthwise center. A cassette placing zone is located on one side of the chucking zone,...
6726525 Method and device for grinding double sides of thin disk work  
A double side grinding apparatus comprises a pair of grinding wheels ( 4 ), work rotating device ( 1 ) and moving device ( 2 ). The apparatus operates to bring the grinding faces ( 4 a ) into...
6722946 Advanced chemical mechanical polishing system with smart endpoint detection  
The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred...
6722956 Working apparatus  
A finishing grindstone member ( 20 ) is fixed to a spindle ( 10 ) by a bolt. In the spindle ( 10 ), there is formed a tool mounting portion ( 25 ) into which a rough grindstone member can be...
6722944 Apparatus for and method of attaching a lens holder to a spectacle lens, and a method for producing a lens  
An apparatus for and process of attaching a lens holder to an uncut lens for a spectacle lens which enables efficient attachment of the lens holder at a position without the processing interference...
6722942 Chemical mechanical polishing with electrochemical control  
Various embodiments of a planarization device and methods of using the same are provided. In one aspect, a device for planarizing a surface of a semiconductor workpiece is provided that includes a...
6722945 Endface polishing method and endface polishing apparatus  
The invention is an endface polishing method and an endface polishing apparatus improving polishing accuracy of an optical fiber and making polishing time and polishing work shorten. Polishing is...
6711829 Method for measuring work portion and machining method  
A method for measuring the diameter and eccentricity of a crankpin of a crankshaft which is ground on a grinding machine. A reference plate is provided on a headstock, which is disposed on a table...
6712669 BPSG chemical mechanical planarization process control for production control and cost savings  
The polishing of a layer of boro-phosphate-silicate-glass (BPSG) is not easy to control as a result of CMP slurry chemistry effects, the doping concentration of the layer of BPSG and the heat...
6712675 Method for grinding at least one surface on a cutting knife used in machining, use of said method and grinding wheel used to carry out said method  
A grinding wheel ( 28 ) that rotates around an axis and that has a working area consisting of an annular surface with a circular arc profile in axial cross section is used to first generate a...
6708547 Rolling mill and rolling method  
There are disclosed a rolling mill capable of keeping a uniform plate of thickness distribution and manufacturing a good-quality plate, and a rolling method. The rolling mill comprises working...
6709321 Processing jig  
A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer...
6709311 Spectroscopic measurement of the chemical constituents of a CMP slurry  
An apparatus and method for determining the chemical content of a chemical mechanical planarization (CMP) slurry. A CMP sample cell has windows for passing electromagnetic radiation. Three...
6709312 Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process  
A method for monitoring a polishing condition of a surface of a wafer in a polishing process is provided, the method comprising providing a wafer ( 16 ) to be polished, the wafer ( 16 ) having at...
6705921 Method and apparatus for controlling cutting tool edge cut taper  
A tilt control assembly for controlling the tilt of a cutting tool head has a first eccentric support and a second support, with both of the first and second supports connected to the head along an...
6702648 Use of scatterometry/reflectometry to measure thin film delamination during CMP  
One aspect of the present invention relates to a system and method for examining a wafer for delamination in real time while polishing the wafer. The system comprises a polishing system programmed...
6702646 Method and apparatus for monitoring polishing plate condition  
An apparatus for monitoring a condition of a polishing plate, in particular for detecting the time for the polishing plate to be reconditioned or replaced, comprising a measuring unit containing at...
6699101 Method for removing a damaged substrate region beneath a coating  
A method of removing the damaged surface layer beneath a coating on a component. The method includes evaluating the component to assess the depth of the damaged substrate layer, followed by sensing...
6699102 Lapping monitor for monitoring the lapping of transducers  
A lapping monitor for monitoring the lapping of a lapping surface of a body having at least one transducer which has a height that has to be lapped. The lapping monitor has a lap unit for lapping...
6695680 Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same  
The operation of a polishing pad conditioner for a CMP apparatus is monitored. The polishing pad conditioner includes a housing, a first drive pulley disposed in the housing and connected to a...
6688944 Spectacle lens chamfering data preparing method, spectacle lens chamfering method, spectacle lens chamfering data preparing apparatus, and spectacle lens chamfering apparatus  
Methods and apparatuses for spectacle lens chamfering, wherein a predetermined chamfer width is inputted from a peripheral edge of a lens shape of a spectacle frame and a chamfer locus on a...
6688945 CMP endpoint detection system  
An endpoint detection system in a CMP apparatus has a polishing platen, a polishing pad covering the polishing platen, a chamber located in the polishing platen, and a gas flow system arranged in a...
6690991 Machine control gage system performing roundness measuring function  
A machine control gage system has a control unit, which analyzes roundness of a workpiece. The control unit controls a grinding machine controller in such a manner as to machine the workpiece to a...
6685536 Method for grinding convex running faces and outside diameters on shaft-like workpieces in one set-up and grinding machine for carrying out the method  
The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid...
6682397 Machining device for processing metal hanging rod of blinds  
A machining device for processing metal hanging rod of blinds having a machine platform, two fixing bases, and a retaining unit. A top of the machine platform has a holding groove for the two...
6682398 Method for characterizing the planarizing properties of an expendable material combination in a chemical-mechanical polishing process; simulation technique; and polishing technique  
A method for characterizing planarizing properties of a selected expendable material combination in a chemical-mechanical polishing process includes steps of: providing a combination of expendable...
6682628 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies  
Methods and apparatuses for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of...
6682396 Apparatus and method for linear polishing  
A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length...
6684171 In-situ stripe height calibration of magneto resistive sensors  
An in-situ (result-directed/predictive) MR stripe height calibration method capable of operating on the fly during lapping operation. The method involves utilization of an interval sampling...
6682407 Work-piece processing machine  
The work-piece-processing machine of the present invention is compact and has two tools for precisely processing a work-piece. In the work-piece-processing machine, the work-piece is processed by a...
6679755 Chemical mechanical planarization system  
A processing system and method for processing a workpiece is generally provided. In one embodiment, the system includes a processing module and a substrate transfer shuttle. The processing module...
6676493 Integrated planarization and clean wafer processing system  
A wafer processing module is provided. In one example, the wafer processing module includes a sub-aperture CMP processing system and a pad exchange system including a pad magazine for storing CMP...
6675464 Method of manufacturing a magnetic head  
A method of manufacturing magnetic heads is provided in which a slider and a back yoke are joined to form a magnetic head main body. The main body is then fixedly bonded to a holding member that...
6675058 Method and apparatus for controlling the flow of wafers through a process flow  
A method for controlling the flow of wafers through a process flow includes monitoring operating states of a plurality of processing tools adapted to process wafers; measuring a characteristic of a...
6672939 Cost-effective side-coupling polymer fiber optics for optical interconnections  
A unidirectional and bidirectional optical fiber couplers using polymer optical fibers having mirrors formed within the polymer optical fibers for reflecting optical signals. The mirrors comprise a...
6672944 Initial position setting method for grinding device  
An initial position setting method for grinding work apparatus includes: a grind stone 11; a pair of lens rotating shafts 14, 14 which are capable of approaching and drawing apart each other...
6669531 Apparatus for high tolerance brush honing  
The present invention relates to a honing method and apparatus which provides greater control over the edge shape, as well as reductions in the effort required to hone multiple edges on workpieces....
6666748 Machining center and method of changing tools thereof  
The invention provides a machining center for machining a workpiece by moving a grinding wheel and the workpiece relative to each other in the X, Y and Z directions. The machining center has a main...
6666749 Apparatus and method for enhanced processing of microelectronic workpieces  
Chemical-mechanical planarizing machines and methods to maintain processing pads and other planarizing media used in planarizing microelectronic workpieces. In one embodiment, a planarizing machine...
6666754 Method and apparatus for determining CMP pad conditioner effectiveness  
A method includes supplying a signal to rotationally drive a conditioning wheel of a conditioning tool. A polishing pad of a polishing tool is conditioned using the rotationally driven conditioning...
6663465 Grinding machine and method of sharpening blades  
The invention relates to a grinding machine for sharpening (honing) blades ( 4 ) of knives, scissors, hand tools or the like, with a magazine, a feed station ( 1 ) or similar, and with a honing...
6662433 Method of fabricating the thin film magnetic head  
A thin film magnetic head includes a lower shielding layer composed of a magnetic material; a nonmagnetic MR gap layer on the lower shielding layer; a magnetoresistive element layer in the MR gap...
6659848 Slurry dispenser that outputs a filtered slurry to a chemical-mechanical polisher at a constant flow rate over the lifetime of the filter  
The slurry used in a chemical-mechanical polisher is passed through a filter, and output at a constant flow rate throughout the lifetime of the filter by measuring the flow rate of the slurry,...