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8182709 |
CMP system and method using individually controlled temperature zones
By creating a temperature profile across a polishing pad, a respective temperature profile may be obtained in a substrate to be polished, which may result in a respective varying removal rate...
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8177603 |
Polishing pad composition
Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and...
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8177604 |
Surface abrading method of photosensitive layer of electrophotographic photoreceptor
A surface abrading method of an electrophotographic photoreceptor is disclosed, comprising abrading the surface of a photosensitive layer with an abrading member entrained about a backup roll with...
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8172647 |
Polish pad conditioning in mechanical polishing systems
A mechanical polishing apparatus includes a polishing pad, at least one carrier head positioned over and off center relative to the polishing pad and configured for holding at least one substrate...
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8171618 |
Tunable pole trim processes for fabricating trapezoidal perpendicular magnetic recording (PMR) write poles
A method of forming a write pole for a magnetic recording device is provided. The method comprises providing a layer of magnetic material covered with a secondary hard mask layer and a patterned...
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8172641 |
CMP by controlling polish temperature
A method for manufacturing integrated circuits on a wafer includes providing a facility-supplied room temperature solution; controlling the temperature of the facility-supplied room temperature...
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8172646 |
Magnetically actuated chuck for edge bevel removal
Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include...
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8166630 |
Magnetic head slider manufacturing method
To provide a manufacturing method which can adjust the lengths of a recording element and a reproducing element for enabling manufacture of high-quality magnetic head sliders. The manufacturing...
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8167686 |
Portable optical fiber polisher
A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable...
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8166633 |
Method for manufacturing an extraordinary magnetoresistive (EMR) device with novel lead structure
A method for manufacturing an extraordinary magnetoresistive sensor (EMR sensor) having reduced size and increased resolution is described. The sensor includes a plurality of electrically...
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8167685 |
Method of manufacturing a perpendicular magnetic recording medium, a method of manufacturing a substrate for a perpendicular magnetic recording medium, and a medium and a substrate manufactured by the methods
A method of manufacturing a perpendicular magnetic recording medium and a substrate for the medium are disclosed, in which abnormal protrusions on an underlayer made of a Ni—P alloy are a...
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8166632 |
Method for providing a perpendicular magnetic recording (PMR) transducer
A method and system for providing a PMR transducer including an intermediate layer. The method and system include providing a hard mask layer on the intermediate layer. The hard mask layer is for a...
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8162725 |
Abrasive, method of polishing target member and process for producing semiconductor device
To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a...
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8161627 |
Method of making a write head lapping guide about aligned to a non-magnetic layer surrounding a write pole
A method in one embodiment includes forming an electric lapping guide layer; forming a write pole; forming a first gap layer over the write pole; masking a portion of the first gap layer for...
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8162723 |
Method of polishing a tungsten carbide surface
The invention is directed to a method for polishing a surface comprising tungsten carbide, comprising contacting a surface comprising tungsten carbide with an oxidizing agent, a polishing...
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8162724 |
Surface treating method and apparatus
A surface treating apparatus treats a substrate surface by rotating a cylindrical polishing member in a state where the polishing member makes contact with the substrate surface. A polishing liquid...
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8157617 |
Method for polishing a semiconductor wafer
Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material...
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8157614 |
Method of making and apparatus having windowless polishing pad and protected fiber
A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or...
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8157621 |
Wafer back side grinding process
A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back...
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8152599 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact...
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8152597 |
Wafer grinding method and wafer grinding machine
A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding...
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8152595 |
System and method for optical endpoint detection during CMP by using an across-substrate signal
In a polishing process, the characteristics of the removal process may be monitored at different lateral positions to identify the clearance of the various device regions with a high degree of...
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8147295 |
Method of polishing silicon wafer
A silicon wafer is polished by applying a polishing solution substantially containing no abrasive grain onto a surface of a polishing pad having a given fixed grain bonded abrasive and then...
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8146237 |
Method of manufacturing a magnetic head
In a magnetic head manufacturing method, a floated surface of each block having plural magnetic head elements formed and arranged on a substrate is ground and lapped in a grinding/lapping step. The...
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8146236 |
Method for providing a perpendicular magnetic recording (PMR) transducer
A method and system for providing a perpendicular magnetic recording (PMR) transducer from pole layer(s) are disclosed. First and second planarization stop layers are provided on the pole layer(s)....
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8147294 |
Capillary, capillary polishing method, and capillary polishing apparatus
A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the...
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8145342 |
Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side...
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8142258 |
Method of transferring a wafer
A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a...
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8141235 |
Method for manufacturing a perpendicular magnetic recording transducers
A method for manufacturing a perpendicular magnetic recording transducer is described. A metallic underlayer, an insulator on the metallic underlayer, and a metal mask on the insulator are...
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8137574 |
Processing method of glass substrate, and highly flat and highly smooth glass substrate
The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is...
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8137157 |
Lapping carrier and method
Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending...
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8137159 |
Abrasive, method of polishing target member and process for producing semiconductor device
To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a...
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8137747 |
Components, turbochargers, and methods of forming the components
Components, turbochargers, and methods of forming components are provided. In an embodiment, by way of example only, a method of forming a component is provided. The method includes applying a...
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8137158 |
Electrical contact method
An electrical contact method. An axle having an axis of rotation is provided. Cantilever arms are provided. Each cantilever arm has a first end and a second opposing end. The first end is connected...
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8128461 |
Chemical mechanical polishing with multi-zone slurry delivery
Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced...
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8128458 |
Polishing apparatus and substrate processing method
A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate...
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8118641 |
Chemical mechanical polishing pad having window with integral identification feature
Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification...
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8118645 |
Polishing method, polishing pad, and polishing system
A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two...
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8118646 |
Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole...
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8117736 |
Method of lapping a magnetic head slider
A method of lapping a magnetic head slider includes a step of lapping a lapping surface of a row bar provided with a plurality of MR read head elements arranged along at least one line, a step of...
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8118644 |
Chemical mechanical polishing pad having integral identification feature
Chemical mechanical polishing pads having a polishing layer with a polishing surface adapted for polishing a substrate are provided, wherein the polishing layer has a unique integral identification...
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8113914 |
Treating method for brittle member
An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and...
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8113017 |
Method for cleaning a glass substrate, method for fabricating a glass substrate, and magnetic disk using same
A method for cleaning a glass substrate which ensures removal of abrasive and other foreign matter without making a cleaning step complicated involves cleaning the glass substrate by scrubbing...
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8108986 |
Method for manufacturing a perpendicular magnetic write pole having a large bevel angle
A method for manufacturing a magnetic write head for perpendicular magnetic recording, the write head having a write pole with an increased bevel (taper) angle. The write pole is constructed by...
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8104176 |
Method of manufacturing a developing agent regulating member for regulating an amount of a developing agent
A method of manufacturing a developing agent regulating member is provided. The method includes providing a non-magnetic member and a magnetic member. The non-magnetic member and the magnetic...
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8105135 |
Polishing slurries
A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the...
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8104166 |
Self-aligned method for fabricating a high density GMR read element
A method is provided for fabricating a read element with leads that overlay a top surface of a sensor of the read element. The method includes forming a mask over a sensor layer, then using the...
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8099855 |
Methods for fabricating perpendicular recording heads with controlled separation regions
Methods of recording head fabrication are provided to fabricate a region of separation material between a write pole and a shield of a write head that forms a controlled spacing between the write...
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8096148 |
Method for fabricating a glass substrate, magnetic disk, and method for fabricating the same
A method for fabricating a glass substrate containing SiO2 as a main ingredient thereof and having a uniform and minute pattern of stripes formed on the surface thereof by ultraprecision polishing...
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8095325 |
System and method for gemstone cut grading
A system for grading the cut of a diamond utilizes a number of appearance metrics to generate scores for a number of cut components that affect cut quality. These cut components include brightness,...
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