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7186168 |
Chemical mechanical polishing apparatus and methods for chemical mechanical polishing
The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for...
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7186165 |
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to...
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7182672 |
Method of probe tip shaping and cleaning
Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be...
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7182668 |
Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or...
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7182669 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator that is adapted to change an optical property in response to a planarizing condition. This process indicator...
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7179155 |
Device for grinding liquid crystal display panel
Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid...
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7179152 |
Composition suitable for application to human skin
An apparatus including an applicator having a first end for mating with a device capable of manipulation by a human hand and a second end having an abrasive surface suitable for contacting areas of...
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7175511 |
Method of manufacturing substrate for magnetic disk, apparatus for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk
A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole ( 1 ) at the center part of a disk substrate ( 2 ) even if the diameter...
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7174620 |
Method of manufacturing thin quartz crystal wafer
A method of manufacturing a thin quartz crystal wafer from a quartz crystal block which is cut from a crystal body of synthetic quartz crystal and has a flat principal surface, comprises the steps...
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7174623 |
Method of providing protection to the pole piece of a magnetic head during its manufacture with use of a selectively etchable material
A method of making a magnetic head involves providing a partially constructed magnetic head which has a top surface formed by a front P 2 pole tip, a back gap P 2 pedestal, and insulator...
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7175507 |
Method of providing a dual use gravesite marker
A temporary gravesite marker for use in identifying a gravesite until a permanent gravestone is available includes a marker tablet which has a generally rectangular solid form with an upper surface...
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7175503 |
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
Systems and methods for characterizing polishing of a specimen are provided. One method includes scanning a specimen with an eddy current device during polishing to generate output signals at...
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7175508 |
Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method
The present invention provides a polishing apparatus for a semiconductor wafer in which a slide member and a swing holding member are provided in a polishing member that is provided so as to block...
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7175504 |
Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus
The vacuum suction holding apparatus of the present invention has a vacuum duct which is disposed inside a polishing head, with one end of this vacuum duct being opened in the attachment surface...
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7172493 |
Fine force actuator assembly for chemical mechanical polishing apparatuses
A polishing apparatus ( 10 ) for polishing a device ( 12 ) with a polishing pad ( 48 ) includes a pad holder ( 50 ) and an actuator assembly ( 432 ). The pad holder ( 50 ) retains the polishing pad...
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7172496 |
Method and apparatus for cleaning slurry depositions from a water carrier
Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated...
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7169021 |
Arrangement for treating pulpstone surface
A method for controlling the water jet sharpening sequence of a pulp grinder is provided, wherein a high-pressure sharpening water jet is directed toward a surface of a pulpstone with a water...
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7169015 |
Apparatus for optical inspection of wafers during processing
The present invention is aimed to provide a measurement system installable within a processing equipment and more specifically within the exit station of a polishing machine. The optical scheme of...
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7166015 |
Apparatus and method for controlling fluid material composition on a polishing pad
An apparatus for use in a chemical mechanical planarization system is provided. The apparatus includes a fluid displacing device and a fluid delivery device. The fluid displacing device is capable...
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7166019 |
Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate...
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7165317 |
Electrode extension sheet for use in a lapping apparatus
The present invention is an object to provide an apparatus or a method making it possible to easily effect connection between additional electrodes, etc. and lead electrodes when performing a...
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7166014 |
Chemical mechanical planarization process control utilizing in-situ conditioning process
A system and method for providing process control in a CMP system utilizes a vacuum-assisted arrangement for conditioning a wafer polishing pad so that the effluent (i.e., wafer debris, polishing...
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7163446 |
Vehicle headlight restoration
A method of restoring a discolored automobile headlight lens without removal of the lens from the automobile consistent with certain embodiments involves wet abrading an outer surface of the lens...
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7163435 |
Real time monitoring of CMP pad conditioning process
CMP pad conditioning processes have been monitored and controlled by detecting the vibrational spectrum of a sensor mounted on the conditioner support arm. An accelerometer is used as the detector...
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RE39471 |
Apparatus for and method for polishing workpiece
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the...
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7163444 |
Pad constructions for chemical mechanical planarization applications
The present invention is directed to an abrasive article comprising a fixed abrasive layer and a subpad. The fixed abrasive element is co-extensive with the subpad. The subpad comprises a resilient...
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7160177 |
Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
A device for high-precision machining of the surface of an object, such as for polishing and lapping semiconductor substrates, in which the object is held on an accommodation surface for its...
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7160174 |
Method for processing and measuring rotationally symmetric workpieces as well as grinding and polishing tool
A method for processing a rotationally symmetric workpiece, preferably having optically effective surfaces, whose symmetry axis is aligned parallel with the z-axis and which is moveable parallel...
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7160179 |
Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In...
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7160176 |
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal...
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7160178 |
In situ activation of a three-dimensional fixed abrasive article
An apparatus including a fixed abrasive article interposed between a substrate and a support assembly. The support assembly creates regions of high and low erosion force at the interface between...
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7160172 |
Multi-station disk finishing apparatus and method
Multi-disk processing system and method of continuous finishing of memory media disks for digital data storage systems in preparation for magnetic memory coating, comprising four main sub-systems:...
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7160180 |
Substrate delivery mechanism
A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher...
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7156725 |
Substrate polishing machine
There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The...
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7156722 |
Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same
A platen structure of a polishing apparatus for semiconductor wafer and a method for exchanging a polishing pad affixed to the same are provided in which the polishing pad supported by the platen...
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7156717 |
situ finishing aid control
A method of using finishing aids for advanced finishing control is described. A finishing surface is used generally to induce frictional wear. The finishing aids with preferred in situ control can...
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7153198 |
Fixture for slider lapping, lapping device and lapping method
A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping...
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7153197 |
Method for achieving uniform CU CMP polishing
A method for removing a metal oxide overlayer over a target polishing surface in conjunction with a chemical mechanical polishing (CMP) process to improve polishing uniformity including providing a...
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7153192 |
Method for selectively sensing and removing asperities from hard disk drive media utilizing active thermally controlled flying heights
A method for selectively sensing and removing asperities from the surface of hard disk drive media is disclosed. A thermally controlled flying height burnish slider is flown on a test stand with...
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7153196 |
Method of polishing using a polishing agent
A polishing agent for polishing a surface of a target object without unduly scratching it includes mother particles and very fine abrading particles which are supported on the surfaces of the...
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7153191 |
Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention...
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7153193 |
System and apparatus for selectively sensing and removing asperities from hard disk drive media utilizing active thermally controlled flying heights
A system for selectively sensing and removing asperities from hard disk drive disk is disclosed. The system includes a test stand supporting the disk, the test stand having at least one suspension...
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7153185 |
Substrate edge detection
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output...
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7147541 |
Thickness control method and double side polisher
The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in...
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7146713 |
Method of manufacturing a base plate
A method for forming a base plate in which the base plate is stamped out of a sheet of metal. One of a relief surface and a boss are formed in the base plate by press working the base plate.
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7147543 |
Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one...
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7143760 |
Method for removing trip hazards in concrete sidewalks
A method for cutting a chamfer on an edge of a concrete slab, comprising the steps of: providing a generally circular, rotatable concrete saw blade that is coupled to a right-angle grinder motor...
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7144304 |
Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the...
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7143505 |
Manufacturing method for a thin film magnetic head
A thin film magnetic head is capable of reducing inductance by shortening a magnetic path, and also preventing a cavity from being formed in a coil insulating layer. The coil insulating layer is...
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7144301 |
Method and system for planarizing integrated circuit material
For planarizing an IC (integrate circuit) material, a first slurry is dispensed for a first planarization of the IC material using the first slurry, and a second slurry is dispensed for a second...
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