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7234998 |
Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device
Setting a polishing rate and a polishing time in chemical mechanical polishing can be performed with high accuracy by considering a product wafer of an object to be polished, and an instrumental...
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7232363 |
Polishing solution retainer
A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the...
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7229341 |
Method and apparatus for chemical mechanical polishing
A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly...
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7229336 |
Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having...
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7229339 |
CMP apparatus and method
Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a...
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7229340 |
Monitoring a metal layer during chemical mechanical polishing
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor...
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7226337 |
Platen and head rotation rates for monitoring chemical mechanical polishing
Methods system and apparatus, including computer program products, for monitoring polishing a substrate. A polishing pad mounted on a platen is rotated at a first rotation rate, and a carrier head...
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7225524 |
Method for fabricating a gyroscope
Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge...
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7226336 |
Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an...
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7226341 |
Method of manufacturing laminated mold and laminated mold
For manufacturing the laminated mold comprising the laminate ( 11 ) being formed of a plurality of thin sheets ( 11 a ) laminated on each other, laminate the thin sheets with the excess portions of...
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7226345 |
CMP pad with designed surface features
A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality...
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7223158 |
Method for polishing a semiconductor wafer
An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a...
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7223156 |
Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces
Compositions and methods for planarizing or polishing a corundum, GaAs, GaP or GaAs/GaP alloy surface, particularly a semiconductor wafer surface. The polishing compositions described herein...
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7223154 |
Method for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a...
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7223157 |
Chemical-mechanical polishing apparatus and method of conditioning polishing pad
A chemical-mechanical polishing apparatus comprising at least a polishing platen, a polishing pad, a slurry supplying piping, a polishing pad conditioner, a chemical reagent supplying piping and a...
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7219415 |
Method of manufacturing thin film magnetic head
The method of manufacturing a thin film magnetic head is capable of precisely forming a core section with preventing the variation of the write-core head caused by ion milling for removing an...
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7220164 |
Advanced finishing control
An apparatus and method of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. The method uses operative sensors such as friction sensors for...
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7220166 |
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment...
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7220167 |
Gentle chemical mechanical polishing (CMP) liftoff process
A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution...
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7217305 |
Polishing body
An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the...
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7217174 |
Portable optical fiber polisher
A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable...
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7214125 |
Method for controlling pH during planarization and cleaning of microelectronic substrates
A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the...
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7214123 |
Retainer ring, Polishing head, and chemical mechanical polishing apparatus
A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head...
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7210991 |
Detachable retaining ring
The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput. Embodiments of the present invention eliminate load cups from a polishing...
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7210982 |
Method and apparatus for polishing a substrate
The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so...
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7207862 |
Polishing apparatus and method for detecting foreign matter on polishing surface
A polishing apparatus comprises a polishing tool having a polishing surface, and a holder device (top ring) for holding a semiconductor wafer (a substrate). The polishing apparatus further...
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7207100 |
Method of manufacturing a magnetic head
A method of manufacturing a magnetic head manufactures a magnetic head having a base, and a laminate stacked on the base and including a magneto-resistive device. The method mechanically polishes a...
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7204664 |
Glass drill bit
A method and apparatus for drilling glass using a drill and drill bit. The method utilizes a drill bit having a plurality of shaft diameters, and being provided with a plurality of types of...
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7204742 |
Polishing pad comprising hydrophobic region and endpoint detection port
The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region...
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7201636 |
Chemical mechanical polishing a substrate having a filler layer and a stop layer
A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until...
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7201639 |
Powder for disks
A plurality of disks include a first disk and a second disk stacked upon the first disk. The first disk and the second disk are each formed from glass or glass-ceramic. A powder is disposed between...
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7201640 |
Method of sucking water and water sucking device
The method of sucking water is capable of easily removing excess water included in a backing member adhered on a plate of a polishing apparatus. In the method, the excess water is removed from the...
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7200918 |
Method for forming an air bearing surface on a slider
Embodiments include a slider having a silicon body and at least one carbide pad structure embedded therein. At least one head structure for reading and/or writing data is located on the silicon...
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7201645 |
Contoured CMP pad dresser and associated methods
CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The...
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7198542 |
Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or...
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7198551 |
Substrate polishing apparatus
A chemical mechanical polishing apparatus includes a rotating plate on which a substrate received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the...
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7198550 |
Process for finish-abrading optical-fiber-connector end-surface
To provide a process for finish-abrading an optical-fiber-connector end-surface without generating abrasion scratch on an abraded surface of optical fiber, nor generating an adherent substance. A...
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7198545 |
Method of calibration and data evaluation for eddy current metrology systems
Methods are provided for calibrating a tool using an eddy current probe and calibration wafers that each have a measurable predetermined property and a measurement of the measurable predetermined...
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RE39547 |
Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates
An apparatus and method for stopping mechanical and chemical-mechanical polishing of a substrate at a desired endpoint. In one embodiment, a polishing machine has a platen, a polishing pad...
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7198552 |
Polishing apparatus
A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a...
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7195536 |
Integrated endpoint detection system with optical and eddy current monitoring
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output...
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7195540 |
Method and system for endpoint detection
A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the...
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7195546 |
Polishing apparatus and method of polishing work piece
The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a...
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7194802 |
Tool for certifying a head-gimbal assembly
A device and method for testing a slider of a head-gimbal assembly during disc drive manufacturing. The device includes a test disc, an actuator arm and a control module. The test disc has a first...
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7195544 |
CMP porous pad with component-filled pores
The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the...
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7195541 |
Endpoint detection system for wafer polishing
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from...
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7191508 |
Method for manufacturing thin-film magnetic head sliders
A method for manufacturing thin-film magnetic head sliders is disclosed. Initially, an elastic layer, which may be made of poly-dimethyl siloxane (PDMS), is spun on a wafer and is thermally cured....
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7192337 |
Method for cutting diamond
To provide a diamond rendering reflective light off a table goldenly brilliant by making a proportion thereof symmetrical at any place viewed from an upper face, a side face or a bottom face, a...
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7192336 |
Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a...
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7192335 |
Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
Method and apparatus for chemically, mechanically and/or electrolytically removing material from microelectronic substrates. A polishing medium for removing material can include a liquid carrier,...
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