|
Match
|
Document |
Document Title |
|
|
7281809 |
Open lattice mirror structure and method of making same
A method of making a mirror structure includes assembling a supporting isogrid framework, assembling an isogrid back plane, interconnecting the supporting isogrid framework with the isogrid back...
|
|
|
7281317 |
Manufacturing method of flying magnetic head slider
A manufacturing method of a flying magnetic head slider includes a step of providing a substrate with a plurality of inductive write head elements formed thereon, each head element having a pair of...
|
|
|
7278206 |
Method of preparing terminal board
A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its...
|
|
|
7278902 |
Enabling location specific burnishing of a disk
Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to...
|
|
|
7278905 |
Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then...
|
|
|
7278906 |
Adhesive tape and edging method using same
An adhesive tape which is to be arranged between a lens and at least one of a plurality of chucks in an edge-machining apparatus comprises an adhesive face for being in contact with the lens. A...
|
|
|
7275306 |
Damascene method for forming write coils of magnetic heads
An improved damascene method of forming a write coil of a magnetic head. The method includes the steps of forming a hard mask layer over an insulator layer; forming a photoresist layer over the...
|
|
|
7275979 |
Apparatus for treating edges of panels and method
An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced...
|
|
|
7275311 |
Apparatus and system for precise lapping of recessed and protruding elements in a workpiece
An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with...
|
|
|
7273408 |
Paired pivot arm
The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one...
|
|
|
7272883 |
Methods of forming an electrical connection in a magnetic head using a damascene process
In one illustrative example disclosed, a method for use in making a magnetic head involves forming a thermal-assist heater for the magnetic head; forming a plurality of coil layers of a write coil...
|
|
|
7270597 |
Method and system for chemical mechanical polishing pad cleaning
In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and...
|
|
|
7270595 |
Polishing pad with oscillating path groove network
A polishing pad ( 20 ) for polishing a wafer ( 32 ) or other article, the pad having a groove network ( 60 ) configured to increase the residence time polishing medium ( 46 ) on the pad. The groove...
|
|
|
7270596 |
Chemical mechanical polishing process
A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided...
|
|
|
7267604 |
Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method
Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a...
|
|
|
7266880 |
Method of making a monolithic magnetic read-while-write head apparatus
A method for fabricating a multi-track thin-film magnetoresistive tape head with precisely-aligned read/write track-pairs fabricated on a monolithic substrate wafer is provided. The wafer is...
|
|
|
7266881 |
Method of manufacturing a top portion and a bottom portion for later assembly of a hermitically sealed hard disk drive
A hermetically sealed mobile hard disk drive that combines high storage capacity and performance with low power consumption and portable operation, including an integrated base substrate. One...
|
|
|
7267603 |
Back grinding methods for fabricating an image sensor
Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the...
|
|
|
7264535 |
Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
During planarization of wafers, the thickness of a layer of a wafer is measured at a number of locations, after the wafer has been planarized by chemical mechanical polishing. The thickness...
|
|
|
7263763 |
Planarization method for a structure having a first surface for etching and a second surface
A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with...
|
|
|
7264537 |
Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system
Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system....
|
|
|
7264539 |
Systems and methods for removing microfeature workpiece surface defects
Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface...
|
|
|
7260887 |
Apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes...
|
|
|
7260884 |
Method of manufacturing a drum assembly associated with video tape machine
A method of manufacturing a drum assembly associated with a digital betacam video tape machine is disclosed. The method includes providing a helical scan drum assembly having a stationary upper...
|
|
|
7258599 |
Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer...
|
|
|
7258598 |
Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit...
|
|
|
7254884 |
Method for fabricating a pole tip in a magnetic transducer using feed-forward and feedback
Methods for fabricating pole piece tips for a magnetic transducer are disclosed. The ion-milling operations for trimming P 2 and notching P 1 are controlled using feed-forward and feedback. The...
|
|
|
7255629 |
Polishing assembly with a window
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is...
|
|
|
7254885 |
Wafer-level fabrication method for top or side slider bond pads
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises...
|
|
|
7255630 |
Methods of manufacturing carrier heads for polishing micro-device workpieces
Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a...
|
|
|
7255632 |
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two...
|
|
|
7255633 |
Radial-biased polishing pad
The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric...
|
|
|
7252575 |
Polishing state monitoring apparatus and polishing apparatus and method
A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring...
|
|
|
7252577 |
Methods for lapping using pneumatically actuated flexible coupling end effectors
Methods for performing surface lapping using a robotic system are provided. In one embodiment, a method for lapping a surface includes providing a lapping assembly having a first base coupled to a...
|
|
|
7246424 |
Magnetic devices having magnetic features with CMP stop layers
A magnetic device having a magnetic feature, the magnetic feature including a magnetic portion comprising a magnetic material, a region of non-magnetic material adjacent to the magnetic portion,...
|
|
|
7247082 |
Polishing composition
A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively...
|
|
|
7247080 |
Feedback controlled polishing processes
Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a...
|
|
|
7246427 |
Method to achieve both narrow track width and effective longitudinal stabilization in a CPP GMR read head
Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a...
|
|
|
7244168 |
Methods for reducing delamination during chemical mechanical polishing
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a...
|
|
|
7244169 |
In-line contiguous resistive lapping guide for magnetic sensors
An in-line lapping guide uses a contiguous resistor in a cavity to separate a lithographically-defined sensor from the in-line lapping guide. As lapping proceeds through the cavity toward the...
|
|
|
7240416 |
Process for manufacturing electrically conductive components
A method of forming a device, such as an electrode array for a cochlear implant. The method comprises a step of forming a predetermined pattern of relatively electrically conductive regions and...
|
|
|
7241204 |
Polishing pad, method of producing same and method of polishing
A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70...
|
|
|
7238089 |
Polishing method for inner surface of tubular brittle material and tubular brittle material obtained by polishing method
An object of the present invention is to provide a polishing method for producing, in a relatively short period of time, a tubular brittle material having an inner surface of high surface precision...
|
|
|
7238087 |
Planarizing device and a planarization method for semiconductor substrates
A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment...
|
|
|
7237323 |
Method for manufacturing a magnetic head
A method of making a magnetic head having an air bearing surface (ABS) composed of a flat and smooth worked surface and having a reduced step produced between a rail portion on the ABS and an...
|
|
|
7237321 |
Method for fabricating a CPP magnetic transducer using CMP-assisted lift-off and a CMP-resistant metal layer
A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is...
|
|
|
7238084 |
Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same
Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing...
|
|
|
7238083 |
Wafer carrier with pressurized membrane and retaining ring actuator
A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the...
|
|
|
7238088 |
Enhanced diamond polishing
A grown single crystal diamond is polished using a non contact polishing technique, which leaves a residue on the diamond surface. In one embodiment, a wet chemical etch is performed to remove the...
|
|
|
7237315 |
Method for fabricating a resonator
A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate....
|