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7108583 |
Method for removing material from a semiconductor wafer
The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are...
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7108586 |
Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts
Particles of strontium carbonate, barium carbonate, strontium sulfate and/or barium sulfate having a sufficient degree of fineness, especially when produced synthetically, are suitable as abrasive...
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7108582 |
Polishing machine
A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing...
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7108579 |
Method and device for polishing
The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact...
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7103960 |
Method for providing a backing member for an acoustic transducer array
A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of...
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7104867 |
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to...
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7104870 |
Modified radial motion (MRM) method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears
The present invention relates to a modified radial motion method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears, which is capable of modifying a locus of a cutter...
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7104871 |
Method and apparatus for reconditioning compact discs
An apparatus and method for re-surfacing compact discs. One method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium...
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7104869 |
Barrier removal at low polish pressure
The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using...
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7101259 |
Polishing method and apparatus
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing...
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7101261 |
Fluid-pressure regulated wafer polishing head
A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force...
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7101254 |
System and method for in-line metal profile measurement
A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce...
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7101251 |
Polishing system with in-line and in-situ metrology
A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial...
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7101252 |
Polishing method and apparatus
A chemical mechanical polishing method for polishing an oxide film and a protective film formed on a substrate having recesses comprises four steps. The first step planarizes the oxide film using a...
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7101255 |
Polishing apparatus
This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a...
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7100266 |
Method of forming a beveled writing pole of a perpendicular writing element
A beveled writing pole includes a top portion, a beveled portion, and a throat portion. The top portion has an end that defines a writing pole tip. The beveled portion adjoins the top portion and...
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7098255 |
Process for producing polyurethane foam
A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound and a second ingredient comprising a compound containing an active...
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7097540 |
Methods and apparatus for machining formed parts to obtain a desired profile
A multiple pass machining method for removing excess flash from a formed part to approximate a desired, curved profile on the formed part includes moving the part relative to a grinder in p...
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7097537 |
Determination of position of sensor measurements during polishing
A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a...
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7096567 |
Method for measuring amount of grinding in magnetic head producing process
The present invention is an object to provide an apparatus or a method making it possible to easily effect connection between additional electrodes, etc. and lead electrodes when performing a...
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7094131 |
Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive...
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7094129 |
Magnetic recording head burnishing method
A slider burnishing method is introduced, in which the slider is brought into a predetermined surface contact with the rotating disk for a specified period. The predetermined surface contact end...
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7094132 |
Method of and apparatus for magnetic-abrasive machining of wafers
A method of magnetic-abrasive machining of parts has the steps of supporting a part, generating a magnetic field by magnetic means located at one side of the part, placing a magnetic-abrasive...
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7090567 |
Method and an element for surface polishing
A surface polishing method in which a workpiece having at least one surface for polishing is set into rotation and has said surface pressed against a polishing element that is driven with motion in...
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7090560 |
System and method for detecting abrasive article orientation
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing...
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7086935 |
Cellulose-containing polishing compositions and methods relating thereto
An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the...
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7086933 |
Flexible polishing fluid delivery system
A method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, an apparatus for delivering a polishing fluid to a chemical...
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7083502 |
Method for simultaneous two-disk texturing
Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly...
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7083501 |
Methods and apparatus for the chemical mechanical planarization of electronic devices
Method and apparatus for chemically and mechanically planarizing the surface of a silicon wafer which includes a compressible non-cellualar lapping surface and a slurry disposed between the wafer...
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7083495 |
Advanced process control approach for Cu interconnect wiring sheet resistance control
A wafer based APC method for controlling an oxide (Cu, or TaN) polish step is described and combines a feed forward model that compensates for incoming wafer variations with a feed backward model...
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7081042 |
Substrate removal from polishing tool
Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad...
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7081037 |
Pad conditioner setup
A method for inspecting the uniformity of the pressure applied between a conditioner and a polishing pad on a chemical mechanical polisher. A sheet of pressure sensitive material is placed between...
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RE39194 |
Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates
A method and apparatus for mechanical and/or chemical-mechanical planarization of microelectronic substrates. In one embodiment, an apparatus for controlling the planarizing characteristics of a...
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7077725 |
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
In advanced electrolytic polish (AEP) method, a metal wafer ( 10 ) acts as an anodic electrodes and another metal plate ( 65 ) is used as a cathodic electrode. A voltage differential is applied to...
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7077728 |
Method for reducing edge array erosion in a high-density array
According to one exemplary embodiment, a method of fabricating an array on a substrate includes forming a layer of a first material adjacent to and over a plurality of segments of a second material...
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7077726 |
Semiconductor wafer with improved local flatness, and method for its production
A process for producing semiconductor wafers comprises simultaneous grinding of both sides of the semiconductor wafers in a single step, 1S-DDG, wherein this grinding is the only material-removing...
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7077727 |
Process for chemical-mechanical polishing of metal substrates
Abrasive composition for the chemical-mechanical polishing in one stage of substrates used in the microelectronics semiconductors industry containing at least one metal layer and one insulator...
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7074109 |
Chemical mechanical polishing control system and method
A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the...
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7074113 |
Methods and apparatus for removing conductive material from a microelectronic substrate
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to first and second...
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7074114 |
Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a...
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7073250 |
Method of manufacturing thin film magnetic head having partial insulating layer formed on bottom pole layer through gap layer
A thin film magnetic head wherein a partial insulating layer is formed on a bottom pole layer with a gap layer provided therebetween, the gap depth Gd being regulated by the distance from a surface...
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7074115 |
Polishing pad
A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40°...
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7070485 |
Polishing composition
A polishing composition to remove metal from a dielectric layer by, either single step CMP polishing, or two step CMP polishing, the composition including, an aqueous solution provided with a...
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7070703 |
Process for producing glass disk substrates for magnetically recordable data storage disks
A polished glass disk is prepared for a magnetically recordable coating by texturing the surfaces with a highly abrasive material being abrasively engaged with the surfaces as the disk is rotated,...
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7070476 |
In-situ metalization monitoring using eddy current measurements during the process for removing the film
A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and...
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7070477 |
Method of polishing semiconductor wafer
In a wafer polishing method, a within-wafer distribution model of a removal rate and a within-wafer distribution model of a polishing process are selected, and a within-wafer distribution of a...
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7070480 |
Method and apparatus for polishing substrates
Method and apparatus for polishing substrates. A chemical mechanical polishing article comprises a body and a patterned surface. The patterned surface comprises a plurality of slurry distribution...
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7070484 |
Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry
A chemical mechanical polishing (CMP) method is disclosed in which a new polishing pad is broken-in and conditioned into a steady operating state while using a silica (SiO 2 ) based CMP slurry and...
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7070478 |
Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of...
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7065984 |
Substrate for information recording media and manufacturing method thereof, information recording medium, and starting material glass plate
A substrate for use as a disk substrate in a hard disk drive or the like, an information recording medium such as a magnetic disk, and a starting material glass plate which is a starting material...
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