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7622206 |
Silicon substrate for magnetic recording medium and magnetic recording medium
To provide a substrate which is not substantially chipped or cracked on the substrate end faces even when the substrate is a silicon substrate made of a brittle material, and provide a substrate...
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7621799 |
Polishing method and polishing device
Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid...
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7614936 |
Spectrum based endpointing for chemical mechanical polishing
Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery...
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7605074 |
Chemical mechanical polishing and method for manufacturing semiconductor device using the same
Provided is a CMP method. According to the CMP method, an interlayer insulating layer having two or more layers is etched to form a trench and/or via hole, and a combined thickness of the two or...
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7604527 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process...
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7591712 |
Method of producing silicon blocks and silicon wafers
A method of producing silicon blocks by cutting a silicon ingot is provided. The method uses a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the...
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7585665 |
Apparatus for ultrafinely shattering organic granular substances
The present invention is directed to provide an apparatus which is capable of continuously and effectively shattering wastes including organic substances and even such wastes as including fat or...
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7585341 |
Polishing material comprising diamond clusters
Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and...
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7584532 |
Apparatus for processing a magnetic head slider
An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium. The apparatus for...
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7578724 |
Incorporation of particulate additives into metal working surfaces
A mechanical device for lapping, and a method therefore, the device including: (a) a metal workpiece having a metal working surface; (b) a contact surface, disposed generally opposite the working...
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7559825 |
Method of polishing a semiconductor wafer
Semiconductor wafers have a front surface, a back surface, a notch, and an edge. A method of polishing a wafer includes polishing at least one of the surfaces and the notch of the wafer using a...
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7540800 |
Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer (W) using a polishing apparatus ( 1 ) includes a first polishing step for polishing...
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7534162 |
Grooved platen with channels or pathway to ambient air
A polish pad ( 120 ) and platen ( 130 ) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen ( 130 ) having a grooved or channeled surface ( 136 ) which is...
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7527546 |
Viscoelastic polisher and polishing method using the same
A viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius...
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7520797 |
Platen endpoint window with pressure relief
A polish pad ( 40, 42 ) and platen ( 50 ) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen ( 50 ) having a vented endpoint window ( 62, 72, 82 ) with one...
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7520795 |
Grooved retaining ring
A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
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7514016 |
Methodology of chemical mechanical nanogrinding for ultra precision finishing of workpieces
A chemical-mechanical nanogrinding process achieves near-zero pole tip recession (PTR) to minimize magnetic space loss of the head transducer to media spacing loss, alumina recession and trailing...
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7513820 |
Method and apparatus for producing micro-texture on a slider substrate using chemical and mechanical polishing techniques
A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is...
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7501346 |
Gallium and chromium ions for oxide rate enhancement
The invention provides a chemical-mechanical polishing composition comprising silica, a compound in an amount sufficient to provide about 0.2 mM to about 10 mM of a metal cation selected from the...
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7497764 |
Method and apparatus for ultrasonic machining
A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially...
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7494519 |
Abrasive agglomerate polishing method
Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive...
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7489984 |
System for designing, previewing, and cutting natural stone veneer to deliver ready for installation
The present invention relates to a method of designing, previewing a stone veneer project in its entirety before a single stone is cut; cutting and finishing the edges of a stone to form...
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7470169 |
Method of polishing semiconductor wafers by using double-sided polisher
During polishing of the semiconductor wafer by using a double-sided polisher, a larger difference as compared to the prior art is created between a frictional resistance acting on a front surface...
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7467460 |
Method of manufacturing slider
A slider manufacturing method includes: providing a row bar constructed from multiple slider bodies having a surface for forming an air bearing surface (ABS); forming multiple cutting lines on the...
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7455571 |
Window polishing pad
A window polishing pad having a reduced stress pad window formed therein for performing optical end point detection are provided, wherein the window polishing pad comprises a pad window and a...
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7427227 |
Method and apparatus for fluid polishing
In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2 a in a slurry flow rate target process until the flow rate increases to a target...
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7422512 |
Method and apparatus for surface treatment of a long piece of material
An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from...
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7419421 |
Slider having rounded corners and edges, and method for producing the same
A slider body characterized by rounded corners and edges and smooth surfaces, formed by polishing with a polymeric fiber and a free abrasive slurry of submicron particles.
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7413832 |
Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains...
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7410409 |
Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl...
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7390423 |
Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises...
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7390241 |
Linear motion apparatus and method for manufacturing thereof
A linear motion apparatus has a guide shaft including a spiral-shaped or linear-shaped rolling element rolling groove, a movable body including a spiral-shaped or linear-shaped rolling element...
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7386935 |
Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes...
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7377836 |
Versatile wafer refining
Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New...
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7374473 |
Texturing slurry and texturing method by using same
Texturing slurry for texturing a substrate for a magnetic hard disk is obtained by dispersing abrading particles of a specified kind in a specified kind of dispersant. The abrading particles...
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7368017 |
Method and apparatus for semiconductor wafer planarization
Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a...
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7367870 |
Polishing fluid and polishing method
A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more compounds selected from one...
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7354526 |
Processing method for glass substrate, processed glass product and stress applying apparatus
A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part...
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7347767 |
Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment...
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7344989 |
CMP wafer contamination reduced by insitu clean
Reducing CMP wafer contamination by in-situ clean is disclosed herein. The invention can be employed in a method in which a conductive layer is formed on a surface of a semiconductor wafer. After a...
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7331844 |
Polishing method
A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves,...
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7320735 |
Fan cleaning method and apparatus
A simple yet effective system for cleaning fans and air circulators facilitates the cleaning of ceiling and hard-to-reach units without having to remove the blades or other parts to be cleaned. A...
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7316603 |
Compositions and methods for tantalum CMP
A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox...
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7303601 |
Polishing composition
A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R)...
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7303600 |
Unexpanded perlite ore polishing composition and methods
An unexpanded perlite ore polishing composition is shown. The composition comprises base material having grains of unexpanded perlite ore of a selected distribution of particle sizes which undergo...
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7300342 |
Scratch removal device and method
A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing...
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7297048 |
Apparatus and methods for dispensing particulate media
A particulate media/fluid delivery system comprises a tank for containing a supply of particulate media, preferably an abrasive powder. A modulator is disposed upstream of the tank for modulating...
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7294049 |
Method and apparatus for removing material from microfeature workpieces
Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to...
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7294042 |
Method and apparatus for abrasive recycling and waste separation system
The present invention provides a method of handling abrasive solids materials used in an abrasive cutting procedure which jets a high-pressure abrasive slurry through a nozzle ( 7 ) onto a work...
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7288021 |
Chemical-mechanical polishing of metals in an oxidized form
The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized...
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