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9033763 Deburring device  
A deburring device includes a barrel with a granulated polishing member filled therein. The barrel is configured by a case formed with an opening hole, and drop prevention member which is fixed to...
9017142 Mass finishing apparatus and method  
A finishing apparatus and method for surface finishing workpieces. A tub is rotatable about vertical axis and operable to hold and rotate abrasive media completely submerged in water or other...
9011205 Titanium aluminide article with improved surface finish  
Titanium-containing articles having improved surface finishes and methods for changing the surface of titanium containing articles, for example by removing overstock, are provided. One example...
8998679 Surface treatment of a polymeric stent  
Methods of treating the polymeric surfaces of a stent with a fluid including a solvent for the surface polymer are disclosed.
8986070 Method for trimming the working layers of a double-side grinding apparatus  
A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous...
8974268 Method of preparing an edge-strengthened article  
A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the...
8968053 Method for the treatment of steel surfaces, particularly of cheesemaking machines  
In order to avoid using anti-stick paints, based on polytetrafluoroethylene or the like, on parts of cheesemaking machines which are to be in contact with hot curds (pastafilata), their surfaces...
8956430 Polishing composition  
A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b)...
8951095 High selectivity slurry delivery system  
Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for...
8932109 Method for producing multiple-phase surfaces  
A workpiece having a multiple-phase working surface, and a lapping process for producing the surface, the process including: (a) providing a system including: (i) a workpiece having a...
8932108 High speed barrel polishing device  
A method useful for polishing a large number of miniature components such as multi-layer electronic components, within a high speed barrel polishing device, is disclosed. In various embodiments of...
8920570 Methods and apparatus for cleaning oilfield tools  
The disclosure relates to the cleaning of rods made of metal, particularly to the method of reclamation of used standard length rods, such as pump rods already used in the mechanical deep-pumping...
8911281 Method for trimming the working layers of a double-side grinding apparatus  
A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous...
8900372 Cryogenic cleaning methods for reclaiming and reprocessing oilfield tools  
The disclosure relates to the cleaning of rods made of metal, particularly to the method of reclamation of used standard length rods, such as pump rods already used in the mechanical deep-pumping...
8888559 Wet sanding compositions  
A wet sanding adjuvant is comprised of a composition comprising: (1) an alkali metal or ammonium salt of an alkoxylated alkyl sulfate; (2) an alkali metal or ammonium salt of an alphaolefin...
8840803 Thermally conductive nanocomposition and method of making the same  
A nanocomposite fluid includes a fluid medium; and a nanoparticle composition comprising nanoparticles which are electrically insulating and thermally conductive. A method of making the...
8834230 Wafer polishing method and double-side polishing apparatus  
The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table...
8821213 Piercing and/or cutting devices for abrasive waterjet systems and associated systems and methods  
Embodiments of abrasive jet piercing and/or cutting devices are described herein. In some embodiments, a piercing device includes a holding or positioning device coupling a mixing tube to a...
8801496 Reducing agglomeration of particles while manufacturing a lapping plate using oil-based slurry  
Embodiments of the present invention pertain to reducing agglomeration of particles while manufacturing a lapping plate using an oil-based slurry. According to one embodiment, an oil-based slurry...
8795030 Surface treatment of a polymeric stent  
Methods of treating the polymeric surfaces of a stent with a fluid including a solvent for the surface polymer are disclosed.
8790160 Chemical mechanical polishing composition and method for polishing phase change alloys  
A method for chemical mechanical polishing of a substrate comprising a germanium-antimony-tellurium chalcogenide phase change alloy (GST) using a chemical mechanical polishing composition...
8776370 Method of maintaining gas turbine engine components  
An example method of maintaining a serviceable component of a gas turbine engine includes selecting a used component, using a fluid to move an abrasive against a surface of the used component, and...
8777695 Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method  
An ultrasonic cleaning apparatus according to the present invention comprises a plurality of cleaning tanks configured to store a cleaning liquid, an object-to-be-processed holder capable of being...
8758090 Polishing method and polishing device  
A polishing method includes: mounting a wafer on a fixed abrasive polishing pad located on a polishing platen; delivering a polishing slurry to the fixed abrasive polishing pad to polish the...
8759216 Compositions and methods for polishing silicon nitride materials  
The present invention provides a method for polishing silicon nitride-containing substrates. The method comprises abrading a surface of a silicon nitride substrate with a polishing composition,...
8741008 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method  
A chemical mechanical polishing aqueous dispersion includes (A) a graft polymer that includes an anionic functional group in a trunk polymer, and (B) abrasive grains.
8734204 Polishing solution for metal films and polishing method using the same  
A polishing solution for metal films that comprises an oxidizing agent, a metal oxide solubilizer, a metal corrosion preventing agent, a water-soluble polymer and water, wherein the water-soluble...
8732949 Process for manufacturing a single-piece blisk by cutting with an abrasive water jet  
A process for manufacturing a single-piece blisk, including: using an abrasive water jet to cut a block of material, so as to create blade preforms extending radially from a disk, then milling the...
8734751 Method and apparatus for recycling and treating wastes of silicon wafer cutting and polishing processes  
A method is provided for recycling and treating the wastes of silicon wafer cutting and polishing processes. To begin with, a dewatered filter cake is mixed with water so that the filter cake is...
8702472 Polishing composition and polishing method using the same  
A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1×Y1≦0...
8696823 Methods and systems for abrasive cleaning and barrier coating/sealing of pipes  
Methods for abrasive cleaning, deburring, providing barrier coatings and sealing leaks in existing pipes, in a single operation, in one pass by intermittent bursts of dry particulates forced and...
8689777 Wire and methodology for cutting materials with wire  
Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7...
8684793 Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization  
A method for chemical mechanical planarization of ruthenium is provided. A semiconductor substrate comprising ruthenium is contacted with a chemical mechanical polishing system comprising an...
8662960 Method for vibration polishing vehicle wheel  
A method for polishing a vehicle wheel, the wheel includes a plurality of holes and a cylindrical rim. A polishing media storage tank holding abrasive media is vibrated to cause the medium to flow...
8657647 Method of polishing bladed disks for a turbomachine and polishing device  
A device for polishing centrifugal impellers for a turbomachine including a vat configured to be filled with a polishing agent, and an impeller support configured to make the impeller rotate...
8641477 Stent and method and device for fabricating the stent  
Stent, as well as a method and device for fabricating the stent, wherein the stent has a tubular lattice structure comprising individual struts and at least one strut of which at least one...
8622783 Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet  
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the...
8622785 Method of making antireflective roughened surface and lens barrel with roughened surface made by the method  
A method of turning the surface of a die, which is used to make a product, into an antireflective roughened one includes the steps of: a) producing a first roughness on the surface of the die; and...
8602843 Abrasive machining media containing thermoplastic polymer  
The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of...
8591288 Method and device for mechanically processing diamond  
Method and device for processing a surface (5) of a diamond (1) with a mechanical part (3) which is moved in relation to the surface (5) of the diamond (1), whereby unbound diamond grains (2) are...
8585465 Planarization of a material system in a semiconductor device by using a non-selective in situ prepared slurry  
For complex CMP processes requiring the removal of different dielectric materials, possibly in the presence of a polysilicon material, a slurry material may be adapted at the point of use by...
8574330 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device  
A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a...
8545291 Polishing pad, manufacturing method thereof and polishing method  
A polishing pad capable of improving an affinity to polishing liquid and stabilizing polishing performance is provided. A polishing pad 10 is equipped with a urethane sheet 2. The urethane sheet 2...
8523639 Self cleaning and adjustable slurry delivery arm  
Embodiments of the invention provide a slurry delivery and rinse system for a chemical mechanical polishing (CMP) apparatus which is capable of self-cleaning, and which can adjustably deliver the...
8517795 Surface treatment method for vacuum member  
A surface-treating process and a forming process in which an inner surface of a vacuum member is mechanically polished in the presence of a liquid medium including no hydrogen atom.
8518613 Optical member base material for EUV lithography, and method for producing same  
The present invention relates to a method for producing an optical member base material for EUVL, comprising performing the following in this order to obtain an optical member base material for...
8512099 Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers  
A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier...
8506359 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method  
A chemical mechanical polishing aqueous dispersion including (A) silica particles, and (B1) an organic acid, the sodium content, the potassium content, and the ammonium ion content of the silica...
8500517 Preparation of synthetic quartz glass substrates  
A synthetic quartz glass substrate is prepared by (1) polishing a synthetic quartz glass substrate with a polishing slurry comprising colloidal particles, an ionic organic compound having an...
8500516 Method for polishing a semiconductor wafer  
A method for polishing a semiconductor wafer having a first side and a second side, the method includes polishing the first side using a Fixed Abrasive Polishing (FAP) with a polishing pad...