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7621799 |
Polishing method and polishing device
Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid...
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7438632 |
Method and apparatus for cleaning a web-based chemical mechanical planarization system
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system....
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7431634 |
Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly
In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the...
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7303467 |
Chemical mechanical polishing apparatus with rotating belt
A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally...
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7278905 |
Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then...
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7241204 |
Polishing pad, method of producing same and method of polishing
A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70...
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7179154 |
Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated...
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7153182 |
System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing
A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting...
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7144304 |
Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the...
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7115023 |
Process tape for cleaning or processing the edge of a semiconductor wafer
A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first...
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7115021 |
Abrasive, method of polishing target member and process for producing semiconductor device
To polish polishing target surfaces of SiO 2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a...
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7104875 |
Chemical mechanical polishing apparatus with rotating belt
A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet,...
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7090560 |
System and method for detecting abrasive article orientation
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing...
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7063607 |
Bowling ball resurfacing apparatus
A bowling ball resurfacing apparatus comprises a housing, first and second vertical support rollers mounted to the housing for rotation about parallel vertical axes, each of the vertical support...
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7044837 |
Magnetic head cleaning method
A method for cleaning a magnetic head using a cleaning tape comprising a substrate and a cleaning layer, wherein the cleaning tape has a stiffness of 2 or less in a width direction, and the...
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7029369 |
End-point detection apparatus
An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the...
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7018276 |
Air platen for leading edge and trailing edge control
An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt....
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6991512 |
Apparatus for edge polishing uniformity control
An invention is provided for a platen for use in a CMP system. The platen includes an inner set of pressure sub regions capable of providing pressure to a polishing pad disposed above the platen....
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6971950 |
Polishing silicon wafers
An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric...
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6955588 |
Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations,...
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6926589 |
Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
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6908369 |
Apparatus for and method of smoothing substrate surface
An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable...
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6899594 |
Relative lateral motion in linear CMP
Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a...
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6896600 |
Liquid dispense manifold for chemical-mechanical polisher
A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a...
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6893329 |
Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk
An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object...
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6875085 |
Polishing system including a hydrostatic fluid bearing support
A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One...
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6843706 |
Polishing apparatus
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or...
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6837779 |
Chemical mechanical polisher with grooved belt
A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt...
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6837774 |
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
A linear chemical mechanical polishing apparatus that is equipped with a programmable pneumatic support platen and a method for controlling the polishing profile on a wafer surface during a linear...
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6790128 |
Fluid conserving platen for optimizing edge polishing
A platen is disclosed. The platen includes a support surface for supporting a portion of a linear polishing belt during a chemical mechanical polishing (CMP) operation. The platen also includes a...
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6786810 |
Abrasive article having a window system for polishing wafers, and methods
A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating...
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6761626 |
Air platen for leading edge and trailing edge control
An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt....
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6755723 |
Polishing head assembly
A polishing head assembly for retaining an object that is subject to polishing with a polishing pad is disclosed. The polishing head assembly comprises a head retainer assembly movably coupled to a...
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6746320 |
Linear reciprocating disposable belt polishing method and apparatus
An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side...
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6736710 |
Polisher for polishing end surface of semiconductor wafer
A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel...
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6729945 |
Apparatus for controlling leading edge and trailing edge polishing
A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside...
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6712679 |
Platen assembly having a topographically altered platen surface
An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one...
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6712670 |
Method and apparatus for applying downward force on wafer during CMP
An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A...
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6663468 |
Method for polishing surface of semiconductor device substrate
The problem of non-uniform polishing properties of a circumferential surface area of a substrate, so-called edge sagging phenomenon, is solved. When a thin film formed on a top surface of the...
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6659849 |
Platen with debris control for chemical mechanical planarization
Generally, a method and apparatus for cleaning a backside of a web of polishing material. In one embodiment, the apparatus includes a platen having a support surface adapted to support the backside...
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6641470 |
Apparatus for accurate endpoint detection in supported polishing pads
An optical window structure is disclosed. The optical window structure includes a support layer that has a reinforcement layer and a cushioning layer. In addition, the optical windows structure has...
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6629875 |
Machine for grinding-polishing of a water edge
The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing...
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6626744 |
Planarization system with multiple polishing pads
An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system...
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6620035 |
Grooved rollers for a linear chemical mechanical planarization system
In a linear chemical mechanical planarization (CMP) system, a surface of each roller of a pair of rollers is disclosed which includes a first set of grooves covering a first portion of the surface...
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6612904 |
Field controlled polishing apparatus
A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux...
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6582284 |
Method of superfinishing parts with a cylindrical surface
A method of superfinishing the cylindrical surface of a part which is intended to be mounted in circular guides and to be moved in translation along its axis relative to the guides places an...
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6572459 |
Machine for machining in particular superfinishing, cylindrical surfaces of circular cylindrical workpieces, using an abrasive belt moving tangentially
Machine for machining using abrasive belts circular workpieces supported by at least one pair of parallel rollers. To pass the workpieces under the machining station(s) 6 , the support rollers ...
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6567718 |
Method and apparatus for monitoring consumable performance
A method for monitoring consumable performance in a processing tool comprises storing a performance model of the processing tool; receiving a consumable item characteristic of a consumable item in...
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6561880 |
Apparatus and method for cleaning the polishing pad of a linear polisher
A linear chemical mechanical polishing apparatus equipped with a brush means and a solvent spray means for cleaning the polishing pad during a chemical mechanical polishing process is described....
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6558239 |
Polishing apparatus
A polishing apparatus has a feed reel for feeding a polishing tape wound thereon and having a polishing surface, a take-up reel for reeling up the polishing tape from the feed reel, a presser for...
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