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7601051 |
Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine
A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a...
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7591711 |
Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The...
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7591714 |
Wafer grinding and tape attaching apparatus and method
A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and...
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7589023 |
Method of manufacturing semiconductor wafer
A method of manufacturing a semiconductor wafer, comprising the step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by using an abrasive cloth with a...
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7585203 |
Bowling ball surface treatment machine and bowling ball surface treatment method
A bowling ball surface treatment machine includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball, the ball movement guider having a guider...
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7572173 |
Polishing apparatus and pad replacing method thereof
A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping...
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7559825 |
Method of polishing a semiconductor wafer
Semiconductor wafers have a front surface, a back surface, a notch, and an edge. A method of polishing a wafer includes polishing at least one of the surfaces and the notch of the wafer using a...
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7547242 |
Substrate polishing apparatus
A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and...
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7534166 |
Chemical mechanical polishing apparatus
An edge section of a wafer can be polished, and at same time, a polishing surface of a polishing member can be dressed by a dresser mechanism. A polishing member has annular concave trenches, which...
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7527544 |
System of using offset gage for CMP polishing pad alignment and adjustment
A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In...
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7520796 |
Polishing pad with grooves to reduce slurry consumption
A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The...
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7520955 |
Carrier head with a multilayer retaining ring for chemical mechanical polishing
A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
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7513818 |
Polishing endpoint detection system and method using friction sensor
A system, method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing...
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7510460 |
Substrate polishing apparatus
A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing...
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7503837 |
Composite retaining ring
A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower...
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7488240 |
Polishing device
A polishing device includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head has a retainer ring for retaining the wafer in the in-plane...
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7481695 |
Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
CMP systems and methods implement instructions for moving a polishing pad relative to a wafer and a retainer ring and for applying pressure for CMP operations. Feedback of polishing pad position is...
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7465221 |
Polishing apparatus
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit...
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7459397 |
Polishing method for semiconductor substrate, and polishing jig used therein
During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to...
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7438632 |
Method and apparatus for cleaning a web-based chemical mechanical planarization system
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system....
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7438795 |
Electrochemical-mechanical polishing system
Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction...
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7429207 |
System for endpoint detection with polishing pad
A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in...
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7419420 |
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to...
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7407433 |
Pad characterization tool
Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored...
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7404757 |
Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system
An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a...
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7390242 |
Diamond tool blade with circular cutting edge
An apparatus for turning a hard and/or brittle material includes a precision workpiece spindle, a workpiece support, a hard and/or brittle workpiece rigidly coupled to the workpiece support, and a...
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7371152 |
Non-uniform subaperture polishing
A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the...
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7367867 |
Two-side working machine
A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are...
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7364497 |
Polish pad and chemical mechanical polishing apparatus comprising the same
A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor...
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7364493 |
Lap grinding and polishing machine
An apparatus, system and method for grinding or polishing an optic is provided. The apparatus includes a shell adapted to a bending profile, torque actuators attached at an outer edge of the shell...
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7357698 |
Polishing pad and chemical mechanical polishing apparatus using the same
A polishing pad for chemically mechanically polishing a semiconductor wafer comprises a first groove pattern circularly formed on the surface of the polishing pad, and a second groove pattern...
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7354335 |
CMP apparatus and load cup mechanism
In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work...
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7344434 |
Retaining ring with shaped surface
A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat,...
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7338353 |
Loading device for chemical mechanical polisher of semiconductor wafer
The present invention related to a loading device for a chemical mechanical polisher of semiconductor wafers comprising: a loading cup on wherein a cup plate is installed in a cup-shaped bath, a...
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7314402 |
Method and apparatus for controlling slurry distribution
A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved...
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7306509 |
Processing device, processing method and method of manufacturing semiconductor device
A CMP apparatus 1 is constructed comprising a wafer chucking mechanism 20 which carries and holds a wafer W, a polishing pad 4 which performs polishing working on the surface of the wafer W...
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7303466 |
Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones
A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is...
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7300332 |
Polished state monitoring apparatus and polishing apparatus using the same
A polished state monitoring apparatus capable of easily grasping the progress of polishing is provided. The polished state monitoring apparatus monitors the progress of polishing of a surface to be...
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7294038 |
Process control in electrochemically assisted planarization
In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing...
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7294040 |
Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the...
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7278908 |
Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular
A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached,...
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7273407 |
Transparent polishing pad
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an...
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7267607 |
Transparent microporous materials for CMP
The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01...
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7252577 |
Methods for lapping using pneumatically actuated flexible coupling end effectors
Methods for performing surface lapping using a robotic system are provided. In one embodiment, a method for lapping a surface includes providing a lapping assembly having a first base coupled to a...
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7247084 |
Polishing head elbow fitting
An improvement is provided for a wafer carrier having an annular inflatable tube for exerting pressure on the edge of a perforated plate during wafer dechucking, and a flexible plastic tube for...
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7244168 |
Methods for reducing delamination during chemical mechanical polishing
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a...
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7238092 |
Low-force electrochemical mechanical processing method and apparatus
The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece...
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7229341 |
Method and apparatus for chemical mechanical polishing
A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly...
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7229339 |
CMP apparatus and method
Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a...
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7229340 |
Monitoring a metal layer during chemical mechanical polishing
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor...
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