|
Match
|
Document |
Document Title |
|
|
7575503 |
Vacuum-assisted pad conditioning system
A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and...
|
|
|
7544113 |
Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system
An apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and...
|
|
|
7507143 |
Truing method for grinding wheel
In a grinding machine comprising conductive grinding wheels, the invention presents a truing technique capable of truing grindstone surfaces of grinding wheels at high precision in a short time. ...
|
|
|
7473162 |
Pad conditioner dresser with varying pressure
Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and...
|
|
|
7473159 |
Detection of diamond contamination in polishing pad and reconditioning system therefor
A reconditioning system for reconditioning a damaged polishing pad is disclosed. The reconditioning system includes a reconditioning disk including a plurality of diamonds for reconditioning the...
|
|
|
7458879 |
Dressing apparatus and substrate holding apparatus
A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the...
|
|
|
7413986 |
Feedforward and feedback control for conditioning of chemical mechanical polishing pad
A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a...
|
|
|
7407433 |
Pad characterization tool
Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored...
|
|
|
7404754 |
CNC tungsten steel cutting machine
A CNC tungsten steel cutting machine suitably used to cut a metal material, such as tungsten carbide steel, includes an operational platform, a cutting mechanism, a feeding mechanism, a delivering...
|
|
|
7357695 |
Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or...
|
|
|
7326103 |
Vertically adjustable chemical mechanical polishing head and method for use thereof
The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.
|
|
|
7306506 |
In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals...
|
|
|
7300342 |
Scratch removal device and method
A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing...
|
|
|
7278901 |
Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film
A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided....
|
|
|
7198543 |
Gear grinding machine
A gear grinding machine comprises: a moving mechanism rotatably mounted with a threaded grinding wheel, and arranged to move the threaded grinding wheel along directions of X, Z, and Y, and to turn...
|
|
|
7198542 |
Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or...
|
|
|
7195543 |
Machine tool with 5 machining axes with a continuous grinding tool profilling system
A machine tool for machining a part by on-head and continuous grinding tool profiling includes a part holder support driven into rotation by first driving means around a first axis in a vertical...
|
|
|
7172495 |
Method and apparatus using a sensor for finish-machining teeth
Teeth of a workpiece of a workpiece are finish-machined by first gauging shapes of the workpiece teeth and generating actual-value signals corresponding thereto. These actual-value signals are...
|
|
|
7137872 |
Scratch removal device and method
A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing...
|
|
|
7131891 |
Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or...
|
|
|
7125312 |
Rotor-grinding machine comprising a rotary head with two grinding wheels
The invention relates to a machine ( 1 ) for grinding the blades of a turbine rotor ( 2 ) or a compressor. The inventive machine consists of a rotary head ( 6 ) which is provided with two different...
|
|
|
7125316 |
Method and device for producing molds for toothed belts
The invention relates to a method and to a device for producing molds for toothed belts. A grinding wheel ( 9 ) that has a profiled periphery is used instead of a milling cutter to provide the...
|
|
|
7118448 |
Truing method for grinding wheel, its truing device and grinding machine
A method and apparatus are used for truing grindstones. Grinding wheels are arranged in a manner such that the respective grindstone surfaces are disposed apart from each other to define a space...
|
|
|
7108581 |
Polishing apparatus
A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the...
|
|
|
7089081 |
Modeling an abrasive process to achieve controlled material removal
In general, techniques are described that allow an abrasive manufacturing process to achieve a controlled performance parameter, e.g., an amount of material removal, without requiring the use of...
|
|
|
7077722 |
Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a...
|
|
|
7070479 |
Arrangement and method for conditioning a polishing pad
An in-situ measurement of thickness profiles of polishing pads ( 1 ) used in chemical mechanical polishing (CMP) is enabled by arranging sensors ( 7 ) for measuring distances together with a...
|
|
|
7059939 |
Polishing pad conditioner and monitoring method therefor
A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A...
|
|
|
7040956 |
Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a...
|
|
|
7037178 |
Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing
The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the...
|
|
|
7011568 |
Grinder with adjustable tool rest
A grinding tool with a toll rest includes an adjustment mechanism to adjust the position of the tool rest responsive to wear of the grinding wheel.
|
|
|
7000607 |
Gemstone and corresponding method of cutting
A gemstone having a crown, a girdle and a pavilion, wherein the girdle is shaped such that, when viewed in plan view, it is primarily bounded by four pairs of parallel straight edges. Three of the...
|
|
|
7001249 |
Methods and systems for finishing edges of glass sheets
Methods and systems are disclosed whereby the edges of a glass sheet may be beveled with minimal equipment down time. Preferably such methods and systems bevel the upper and lower edges along...
|
|
|
6991519 |
Angle head grinding method
A computer controlled grinding machine grinds a cylindrical region and an annular shoulder of a rotatable workpiece. Relative movement is effected between the workpiece and a grinding wheel along a...
|
|
|
6988933 |
Truing method and apparatus
In a truing method and apparatus, an analyzing method is employed to calculate a truing shape from which a grinding surface having been trued with a grinding wheel being rotated at a low rotational...
|
|
|
6951503 |
System and method for in-situ measuring and monitoring CMP polishing pad thickness
A system for measuring and scanning a CMP polishing pad thickness is described. The system includes a first sensor arm capable of being moved in a direction substantially parallel with and at a...
|
|
|
6939202 |
Substrate retainer wear detection method and apparatus
An apparatus and method are provided for detecting wear in substrate retainers used for chemical mechanical planarization processes. A substrate retainer is provided that is adapted to enable a...
|
|
|
6929536 |
System for chemical mechanical polishing comprising an improved pad conditioner
A system and method for chemical mechanical polishing of a substrate is disclosed in which a polishing pad is conditioned by directing a fluid jet to the surface of the polishing pad. Thus, the use...
|
|
|
6896596 |
Polishing pad ironing system
An ironing assembly for use in chemical mechanical planarization (CMP) is provided. The ironing assembly is designed for use over a linear polishing pad which has a plurality of asperities and...
|
|
|
6893324 |
Angle head grinding apparatus
A computer controlled grinding machine grinds a cylindrical region and an annular shoulder of a rotatable workpiece. Relative movement is effected between the workpiece and a grinding wheel along a...
|
|
|
6875092 |
Method for the manufacture of a femoral prosthesis
In accordance with certain aspects of the invention, an exemplary claim can define the steps of providing a rotating mount for the initially cast prosthesis in association with a numerically or...
|
|
|
6837773 |
Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
A method and apparatus for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a...
|
|
|
6761615 |
In-situ wear measurement apparatus for dicing saw blades
An in-situ method and apparatus for monitoring wear of a dicing saw blade. The apparatus, which is mounted on a cooling block of the dicing saw, has a transmitter to emit a parallel beam of light...
|
|
|
6733365 |
Method and apparatus for hard machining
A hard machining process uses a cylindrical tool ( 21 ) of ceramic or other hard machining material of comparatively low cost that provides a circular cutting edge to be engaged in cutting relation...
|
|
|
6722948 |
Pad conditioning monitor
A modification to a chemical mechanical polishing conditioner of a type having a member with a conditioning surface adapted to apply a force to and condition a polishing pad. The conditioner...
|
|
|
6702646 |
Method and apparatus for monitoring polishing plate condition
An apparatus for monitoring a condition of a polishing plate, in particular for detecting the time for the polishing plate to be reconditioned or replaced, comprising a measuring unit containing at...
|
|
|
6684704 |
Measuring the surface properties of polishing pads using ultrasonic reflectance
The present invention provides a system and method for measuring the surface properties of polishing pads using noncontact ultrasonic reflectance. An ultrasonic probe is located over the polishing...
|
|
|
6616508 |
Internal grinding method and internal grinding machine
An internal grinding method for grinding an inner surface of a work having a straight line generatrix shape while performing an in-process inner-diameter size measurement intermittently through...
|
|
|
6607423 |
Method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning
A system and method are presented for selectively conditioning a surface of a polishing pad of a CMP apparatus in order to achieve a desired surface profile of a semiconductor wafer. The...
|
|
|
6599174 |
Eliminating dishing non-uniformity of a process layer
A method includes providing at least one wafer having a process layer formed thereon. A surface of the process layer is polished using a first polishing process that is comprised of a slurry and a...
|