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8166630 |
Magnetic head slider manufacturing method
To provide a manufacturing method which can adjust the lengths of a recording element and a reproducing element for enabling manufacture of high-quality magnetic head sliders. The manufacturing...
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8161627 |
Method of making a write head lapping guide about aligned to a non-magnetic layer surrounding a write pole
A method in one embodiment includes forming an electric lapping guide layer; forming a write pole; forming a first gap layer over the write pole; masking a portion of the first gap layer for...
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8145342 |
Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side...
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8142257 |
Detecting device for abnormal workpiece rotation in non-circular workpiece grinding machine
In a non-circular workpiece grinding machine, a proximity sensor is arranged to face a non-circular portion of a workpiece for sensing a maximum diameter portion of the non-circular portion to...
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8137160 |
Gear matching device and gear machining apparatus
Provided is a gear matching device which performs gear matching to establish a rotational phase relationship between a grindstone (13) and a gear-shaped workpiece (W) in which the grindstone and...
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8113913 |
Method for the simultaneous grinding of a plurality of semiconductor wafers
Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein...
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8100738 |
Grinding machine and method for grinding work pieces between centers and for centerless grinding in which the work piece can be supported between a grinding wheel, and a regulating wheel either between centers on a work piece axis or on a rest for centerless grinding
A grinding machine for grinding work pieces between centers, as well as for centerless grinding, features a drive for a grinding wheel and a drive for a regulating wheel. The work piece can be...
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8100739 |
Substrate holding apparatus, polishing apparatus, and polishing method
A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a...
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8083571 |
Polishing apparatus
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing...
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8070555 |
Visual feedback for airfoil polishing
A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system...
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8070556 |
Grinding wheel for roll grinding and method of roll grinding
A method of grinding a ferrous roll may include: rotating a grinding wheel on a machine spindle to form a rotating grinding wheel; rotating a ferrous roll to form a rotating roll surface; bringing...
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8038508 |
Apparatus for polishing a wafer and method for detecting a polishing end point by the same
A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head...
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8025554 |
Method of polishing work
In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps...
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8002607 |
Polishing apparatus and polishing method
A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member...
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7997953 |
Precision machining method
A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a)...
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7996986 |
Apparatus for forming magnetic recording heads
An apparatus includes: a first layer having a near field transducer positioned in a waveguide cladding; a second layer having a magnetic pole piece; a third layer including a solid immersion...
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7988531 |
Grinding machine
Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around...
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7988532 |
Apparatus for fabricating liquid crystal display panels
A cut section checking/aligning unit simultaneously checks cut sections of unit liquid crystal display panels that are separated from within first and second base substrates and aligns the unit...
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7988528 |
Apparatus and method for grinding threaded portion of workpiece
An apparatus for grinding a threaded portion of a workpiece, is provided. The threaded portion has a spiral groove formed therein. The apparatus includes a motor, a grinding cord, a detector and a...
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7987583 |
Magnetic head slider testing apparatus and magnetic head slider testing method
A step portion for mounting a row bar is provided at a table stepping down from the face of the table, and by lowering a pair of hooks crossing over the step portion in its width direction, a row...
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7985120 |
Apparatus and method for grinding workpiece
An apparatus and method for grinding a workpiece by rotating the workpiece about a rotational axis, rotating a cylindrical grinding wheel about a rotational axis being parallel to the rotational...
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7980920 |
Spectacle lens manufacturing method
A manufacturing method of a spectacle lens improving a manufacturing yield and a production efficiency is provided. The manufacturing method of the spectacle lens in which necessary information for...
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7980922 |
Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate....
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7976358 |
Polishing apparatus and polishing method
A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and...
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7967660 |
Polishing apparatus and polishing method
A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member...
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7963824 |
Method of grooving or counter-beveling the periphery of an ophthalmic lens
A method for grooving or counter-beveling the periphery of an opthamalic lens in a grinding machine is provided. The grinding machine includes a lens support with a mechanism configured to rotate...
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7955159 |
Machining of ceramic materials
Milling strategies for machining dental ceramic materials are provided that reduce milling time while maintaining strength, accuracy and marginal integrity.
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7950981 |
Precision machining apparatus and precision machining method
A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is...
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7927185 |
Method for assessing workpiece nanotopology using a double side wafer grinder
A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method...
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7896726 |
Method and apparatus for removing coatings from a substrate using multiple sequential steps
A method and apparatus for removing a coating having an irregular surface configuration that includes mapping the irregular surface configuration, and using the mapping determination in controlling...
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7892070 |
Process of using a polishing apparatus including a platen window and a polishing pad
A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second...
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7871306 |
Minimal force air bearing for lapping tool
A lapping tool for lapping a wafer section in a well controlled manner, has a head with an actuator for bending the row tool, and a force multiplier coupled between the actuator and row tool to...
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7854646 |
Substrate polishing apparatus and substrate polishing method
The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing...
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7854060 |
Magnetic head substructure for use for manufacturing a magnetic head
A substructure in which a plurality of pre-head portions are aligned in rows is to be cut later so that the pre-head portions are separated from one another. A surface formed by cutting the...
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7846006 |
Dressing a wafer polishing pad
A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the...
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7846007 |
System and method for dressing a wafer polishing pad
A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the...
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7837533 |
Apparatus for processing and measuring workpieces which are provided with cutting teeth
The present invention relates to an apparatus (10) for processing and measuring workpieces, in particular plate-shaped or cylindrical workpieces, which are provided with cutting teeth (S), with a...
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7828627 |
O.D. centerless grinding machine
In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel...
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7780503 |
Polishing apparatus and polishing method
A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus...
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7757383 |
System for lapping a head having an electrical lapping guide (ELG) on a wafer
A system for lapping a head on a wafer including at least one head each having an electrical lapping guide (ELG), a plurality of wafer contacts in electrical communication with the ELG, and a...
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7722434 |
Apparatus for measurement of parameters in process equipment
Some problems related to processing workpieces are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting data...
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7716811 |
Method for manufacturing a thin film magnetic head
Head elements are formed on a wafer to suppress deterioration in pinning strength of a pinned layer, which is caused by ESD generated during air bearing surface polishing of a thin film magnetic...
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7703193 |
Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes...
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7690966 |
Method and apparatus for detecting planarization of metal films prior to clearing
A method for planarizing a semiconductor substrate is provided. The method initiates with tracking a signal corresponding to a thickness of a conductive film disposed on the semiconductor...
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7681303 |
Method for manufacturing a magnetic head slider
Embodiments of the present invention provide a method of manufacturing a magnetic head slider, the method being adapted so that throat height of a main magnetic pole piece of a perpendicular...
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7677954 |
O.D. centerless grinding machine
In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel...
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7670206 |
Substrate polishing apparatus and substrate polishing method
The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing...
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7666062 |
Grinding apparatus with magnetic bearings
A grinding wheel having a convex grinding surface is attached to a wheel spindle that is contactlessly supported by a casing through a controlled type axial magnetic bearing and controlled type...
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7662022 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a...
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7662023 |
Double side wafer grinder and methods for assessing workpiece nanotopology
A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned...
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