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8183496 |
Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation
A method of forming a pattern (700) on a work piece (1260) includes placing a pattern mask (1210) over the work piece, placing an aperture (100, 500, 600, 1220) over the pattern mask, and placing...
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8163469 |
Coating and developing apparatus, coating and developing method, and storage medium
A coating and developing apparatus has: a treatment block-including a water repellent module performing water repellent treatment on a substrate, a coating module, and a developing module; a...
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8133823 |
Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and...
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8119547 |
Method of manufacturing a semiconductor integrated circuit device including elimination of static charge of a treated wafer
A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container....
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8110510 |
Low temperature synthesis of nanowires in solution
Methods synthesizing nanowires in solution at low temperatures (e.g., about 400° C. or lower) are provided. In the present methods, the nanowires are synthesized by exposing nanowire precursors to ...
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8110511 |
Methods and systems of transferring a substrate to minimize heat loss
A method of transferring one or more substrates between process modules or load lock stations while minimizing heat loss is provided. In some embodiments the method comprising the steps of:...
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8093103 |
Multiple chip module and package stacking method for storage devices
Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A...
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8084375 |
Hot edge ring with sloped upper surface
A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in...
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8080481 |
Method of manufacturing a nanowire device
The present invention provides a method for manufacturing a semiconductor nanowire device in mass production at a low cost without an additional complex nanowire alignment process or SOI substrate...
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8027528 |
Method for calculating height of chuck top and program storage medium for storing same method
A method is for calculating a height of a chuck top. A height of the top surface of the chuck top which corresponds to an arbitrary position specified on the XY coordinate plane by a computer is...
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8017430 |
Structured silicon anode
A battery can be fabricated from a substrate including silicon. This allows the battery to be produced as an integrated unit. The battery includes an anode formed from an array of spaced elongated...
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8004018 |
Fabrication method of electronic devices based on aligned high aspect ratio nanoparticle networks
A layer of high aspect ratio nanoparticles is disposed on a surface of a substrate under the influence of an electrical field applied on the substrate. To create the electrical field, a voltage is...
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7989797 |
Connectible nanotube circuit
Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.
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7968474 |
Methods for nanowire alignment and deposition
The present invention provides methods and systems for nanowire alignment and deposition. Energizing (e.g., an alternating current electric field) is used to align and associate nanowires with...
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7960297 |
Load lock design for rapid wafer heating
A semiconductor processing tool heats wafers using radiant heat and resistive heat in chamber or in a load lock where pressure changes. The wafers are heated in greater part with a resistive heat...
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7955946 |
Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an...
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7948096 |
Semiconductor using specific contact angle for immersion lithography
A semiconductor device having a specific contact angle for immersion lithography is disclosed. The semiconductor device includes a substrate and a top layer disposed on the substrate. The top layer...
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7939365 |
Phase change memory device, manufacturing method thereof and operating method thereof
A phase change memory (PCM) device, a manufacturing technique of making the PCM device, and a way of operating the PCM device is presented. The PCM device is structured to have a silicon on...
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7932190 |
Flow control of photo-polymerizable resin
This invention provides methods and systems, e.g., to control the flow of photo-polymerizable resins. In the method, e.g., flow of a photo-polymerizable resin is restricted from illuminated resin...
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7910904 |
Multi-level phase change memory
A phase change memory may be formed which is amenable to multilevel programming. The phase change material may be formed with a lateral extent which does not exceed the lateral extent of an...
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7897525 |
Methods and systems of transferring, docking and processing substrates
In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more...
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7890202 |
Method for creating wafer batches in an automated batch process tool
A method of batching substrates in an automated processing tool, the automated process tool and a system for batching substrates in the automated process tool. The method includes selecting a first...
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7883995 |
Method of forming stable functionalized nanoparticles
A novel top-down procedure for synthesis of stable passivated nanoparticles uses a one-step mechanochemical process to form and passivate the nanoparticles. High-energy ball milling (HEBM) can...
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7880318 |
Sensing system and method of making the same
A sensing system includes a nanowire, a passivation layer established on at least a portion of the nanowire, and a barrier layer established on the passivation layer.
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7875469 |
Method of operating and process for fabricating an electron source
A method of operating and process for fabricating an electron source. A conductive rod is covered by an insulating layer, by dipping the rod in an insulation solution, for example. The rod is then...
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7867814 |
Resistance memory element and method of manufacturing the same
A resistance memory element having a pair of electrodes and an insulating film sandwiched between a pair of electrodes includes a plurality of cylindrical electrodes of a cylindrical structure of...
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7867921 |
Reduction of etch-rate drift in HDP processes
A processing chamber is seasoned by providing a flow of season precursors to the processing chamber. A high-density plasma is formed from the season precursors by applying at least 7500 W of source...
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7855156 |
Method of and apparatus for inline deposition of materials on a non-planar surface
In manufacturing a semiconductor device, a first chamber is provided. An opening couples the first chamber to a first environment through which at least one substrate can pass. A first seal...
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7846781 |
Deletable nanotube circuit
Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.
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RE41989 |
Method and apparatus for electronic device manufacture using shadow masks
Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least...
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7842535 |
Structured silicon anode
A silicon/lithium battery can be fabricated from a silicon substrate. This allows the battery to be produced as an integrated unit on a chip. The battery includes a silicon anode formed from...
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7842623 |
Composition for removing an insulation material and related methods
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent...
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7838308 |
Method of controlling embedded material/gate proximity
A method that includes forming a gate of a semiconductor device on a substrate and forming a recess for an embedded silicon-straining material in source and drain regions for the gate. In this...
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7825037 |
Fabrication of enclosed nanochannels using silica nanoparticles
In accordance with the invention, there is a method of forming a nanochannel including depositing a photosensitive film stack over a substrate and forming a pattern on the film stack using...
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7807587 |
Substrate processing apparatus and substrate processing method
The present invention is a substrate processing apparatus including: a holder that holds substrates in a tier-like manner; a processing container that contains the holder and that conducts a...
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7803661 |
Flip chip laser bonding process
An apparatus for heating a chip includes: a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip; and a beam intensity adjuster disposed on a laser...
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7799663 |
Fabrication of semiconductor metamaterials
A method of fabricating a semiconductor metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises...
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7795061 |
Method of creating MEMS device cavities by a non-etching process
MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One...
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7794611 |
Micropump for integrated device for biological analyses
A micropump includes a body (10) of semiconductor material, accommodating fluid-tight chambers (32), having an internal preset pressure, lower than atmospheric pressure. The fluid-tight chambers...
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7790479 |
Method and device for monitoring the contamination of substrate wafers
A device is used to measure contamination directly in transport enclosures of FOUP or SMIF type, for example. The transport enclosure is placed on an adapter that sets up direct communication...
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7786465 |
Deletable nanotube circuit
Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.
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7755111 |
Programmable power management using a nanotube structure
Programmable power management using a nanotube structure is disclosed. In one embodiment, a method includes coupling a nanotube structure of an integrated circuit to a conductive surface when a...
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7754623 |
Apparatus for forming film hole
An exemplary film hole forming apparatus (400) includes a chemical etching system (410) and a driving system (420). The driving system includes a transmission belt, which passes through the...
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7745330 |
Method of carbon nanotube modification
Carbon nanotube apparatus, and methods of carbon nanotube modification, include carbon nanotubes having locally modified properties with the positioning of the modifications being controlled. More...
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7737055 |
Systems and methods for manipulating liquid films on semiconductor substrates
A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An...
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7732867 |
Method for manufacturing SOQ substrate
Hydrogen ions are implanted to a surface (main surface) of the single crystal Si substrate 10 to form the hydrogen ion implanted layer (ion-implanted damage layer) 11. As a result of the hydrogen...
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7713889 |
Substrate processing method, photomask manufacturing method, photomask, and device manufacturing method
A device linewidth characteristic is predicted based on a sharp-edged feature of a projected image of a predetermined pattern (steps 104 to 110), and an exposure condition of the pattern is...
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7713888 |
Magnetic processing of electronic materials
The electronic properties (such as electron mobility, resistivity, etc.) of an electronic material can be modified/enhanced when subjected to dynamic or stationary magnetic fields in conjunction...
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7709300 |
Structure and method for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masks
A method and system for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masks, or with other two-mask lithographic processes employing a trim mask. The method and...
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7696505 |
Connectible nanotube circuit
Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.
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