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7407893 |
Liquid precursors for the CVD deposition of amorphous carbon films
Methods are provided for depositing amorphous carbon materials. In one aspect, the invention provides a method for processing a substrate including positioning the substrate in a processing...
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7358162 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device, includes the steps of: raising a temperature of a sapphire substrate which is included in the semiconductor device from a room temperature to a...
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7338828 |
Growth of planar non-polar {1 -1 0 0} m-plane gallium nitride with metalorganic chemical vapor deposition (MOCVD)
A method of growing planar non-polar m-plane III-Nitride material, such as an m-plane gallium nitride (GaN) epitaxial layer, wherein the III-Nitride material is grown on a suitable substrate, such...
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7327036 |
Method for depositing a group III-nitride material on a silicon substrate and device therefor
The present invention is related to a device comprising a substrate comprising a silicon substrate having a porous top layer, a second layer on said top layer, said second layer made of a material...
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7312156 |
Method and apparatus for supporting a semiconductor wafer during processing
A semiconductor wafer is processed while being supported without mechanical contact. Instead, the wafer is supported by gas streams emanating from a large number of passages in side sections...
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7309660 |
Buffer layer for selective SiGe growth for uniform nucleation
Methods for preparing a surface for selective silicon-germanium epitaxy by forming a thin silicon (Si) buffer layer or a thin, low concentration SiGe buffer layer for uniform nucleation, are...
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7294520 |
Method for fabricating a plurality of semiconductor bodies, and electronic semiconductor body
A method for fabricating a plurality of semiconductor bodies, in particular based on nitride compound semiconductor material. The method includes forming a mask layer ( 3 ) over a substrate ( 1 )...
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7285500 |
Thin films and methods of making them
Thin, smooth silicon-containing films are prepared by deposition methods that utilize a silicon containing precursor. In preferred embodiments, the methods result in Si-containing films that are...
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7259108 |
Methods for fabricating strained layers on semiconductor substrates
Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain...
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7189639 |
Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applications
A method is disclosed for depositing a dielectric film on a substrate having a plurality of gaps formed between adjacent raised surfaces disposed in a high density plasma substrate processing...
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7186663 |
High density plasma process for silicon thin films
A method is provided for forming a Si and Si—Ge thin films. The method comprises: providing a low temperature substrate material of plastic or glass; supplying an atmosphere; performing a...
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7176146 |
Method of making a molecule-surface interface
This invention is generally related to a method of making a molecule-surface interface comprising at least one surface comprising at least one material and at least one organic group wherein the...
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7157379 |
Strained semiconductor structures
A method for in situ formation of low defect, strained silicon and a device formed according to the method are disclosed. In one embodiment, a silicon germanium layer is formed on a substrate, and...
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7144747 |
Method for thermally treating a substrate that comprises several layers
A method of thermally treating a substrate that has multiple layers is provided. A substrate layer that is covered on opposite sides is oxidized from side edges thereof toward a center thereof such...
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7135416 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device including a gallium nitride related semiconductor. The method include preparing a substrate having surface of a gallium nitride related...
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7132372 |
Method for preparing a semiconductor substrate surface for semiconductor device fabrication
A method for preparing a semiconductor substrate surface ( 28 ) for semiconductor device fabrication, includes providing a semiconductor substrate ( 20 ) having a pure Ge surface layer ( 28 ) or a...
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7078300 |
Thin germanium oxynitride gate dielectric for germanium-based devices
A method for producing thin, below 6 nm of equivalent oxide thickness, germanium oxynitride layer on Ge-based materials for use as gate dielectric is disclosed. The method involves a two step...
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7067401 |
Fabrication method of nitride semiconductors and nitride semiconductor structure fabricated thereby
Disclosed is a method of fabricating nitride semiconductors in a MOCVD reactor. GaN is first deposited on an inner wall of the MOCVD reactor, and a sapphire substrate is loaded into the MOCVD...
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7060632 |
Methods for fabricating strained layers on semiconductor substrates
Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain...
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7060620 |
Method of preparing a surface of a semiconductor wafer to make it epiready
The invention concerns a method of preparing the surface of a semiconductor wafer intended for microelectronics and/or optoelectronics applications. In particular, a method of preparing a SiC...
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7041530 |
Method of production of nano particle dispersed composite material
A method of the production of a nanoparticle dispersed composite material capable of controlling a particle size and a three dimensional arrangement of the nanoparticles is provided. The method of...
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7001849 |
Surface treatment and protection method for cadmium zinc telluride crystals
A method for treatment of the surface of a CdZnTe (CZT) crystal that provides a native dielectric coating to reduce surface leakage currents and thereby, improve the resolution of instruments...
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6987073 |
Low selectivity deposition methods
A deposition method includes forming a nucleation layer over a substrate, forming a layer of a first substance at least one monolayer thick chemisorbed on the nucleation layer, and forming a layer...
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6933244 |
Method of fabrication for III-V semiconductor surface passivation
A method passivates a surface of a semiconductor structure. The method provides III-V semiconductor material having a surface to be passivated. Upon the surface of the III-V semiconductor material...
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6921726 |
Growing smooth semiconductor layers
A method includes epitaxially growing a semiconductor layer with a free surface and performing an anneal that reduces atomic roughness on the free surface. The free surface has an orientation with...
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6855641 |
CMOS transistor having different PMOS and NMOS gate electrode structures and method of fabrication thereof
In a CMOS semiconductor device using a silicon germanium gate and a method of fabricating the same, a gate insulating layer, a conductive electrode layer that is a seed layer, a silicon germanium...
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6841436 |
Method of fabricating SiC semiconductor device
In a method of fabricating a SiC semiconductor device, a surface of a SiC layer ( 5, 48, 102 ) is processed into a cleaned surface terminated at Si. An oxide film ( 7, 49, 105 ) is formed on the...
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6833328 |
Method for removing a coating from a substrate, and related compositions
A method for selectively removing one or more coatings from the surface of a substrate is described. The coating is treated with an aqueous composition which includes an acid of the formula H x AF...
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6815323 |
Ohmic contacts on n-type silicon carbide using carbon films
Ohmic contact formation inclusive of Carbon films on 4H and 6H n-type Silicon Carbide is disclosed. Contact formation includes an initial RF sputtering to produce an amorphous Carbon film with the...
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6797643 |
Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power
A method of depositing a low dielectric constant film on a substrate. In one embodiment, the method includes the steps of positioning the substrate in a deposition chamber, providing a gas mixture...
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6706542 |
Application of InAIAs double-layer to block dopant out-diffusion in III-V device Fabrication
The present invention relates to a multi-layer dopant barrier and its method of fabrication for use in semiconductor structures. In an illustrative embodiment, the multi-layer dopant barrier is...
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6703293 |
Implantation at elevated temperatures for amorphization re-crystallization of Si1-xGex films on silicon substrates
A method of fabricating a Si 1−X Ge X film on a silicon substrate includes preparing a silicon substrate; epitaxially depositing a Si 1−X Ge X layer on the silicon substrate forming a Si...
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6624078 |
Methods for analyzing the effectiveness of wafer backside cleaning
A method for using a monitor substrate to determine effectiveness of a cleaning operation is provided. The method includes selecting a substrate from a lot of substrates and inspecting a surface of...
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6620665 |
Method for fabricating semiconductor device
A process control is performed for fabricating both a wafer for a device including a Ge-containing semiconductor film and a wafer for a device, for example, including no Ge-containing semiconductor...
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6613695 |
Surface preparation prior to deposition
Methods are provided herein for treating substrate surfaces in preparation for subsequent nucleation-sensitive depositions (e.g., polysilicon or poly-SiGe) and adsorption-driven deposition (e.g....
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6610612 |
Method of efficient controllable and repeatable wet oxidation in a phosphorous-rich III-V material system
A method of selectively oxidizing III-V semiconductor material is provided. There is provided a III-V semiconductor system comprising a short-period super lattice (SSL) of N periods of alternating...
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6593193 |
Semiconductor device and method for fabricating the same
An insulating-gate semiconductor device has a first nitride semiconductor layer formed over a substrate and an insulating oxidation layer obtained by oxidizing a second nitride semiconductor layer...
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6566277 |
Liquid-phase growth method, liquid-phase growth apparatus, and solar cell
The present invention provides a method for producing a semiconductor substrate which comprises the steps of growing a first semiconductor layer on a substrate in liquid phase at a properly...
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6566162 |
Method of producing Cu (In, Ga) (Se, S) 2 semiconductor film
A method of producing a semiconductor film of Cu(M III )(M VI ) 2 wherein M III represents In 1-x Ga x where x is between 0 and 1 and M VI represents Se y S 1-y where y is between 0.5 and 1,...
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6563166 |
Flash cell device
A memory device includes a first memory cell and a second memory cell both controlled by a common control gate. The device includes: a substrate; first and second stacks each including an...
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6563144 |
Process for growing epitaxial gallium nitride and composite wafers
A novel growth procedure to grow epitaxial Group III metal nitride thin films on lattice-mismatched substrates is proposed. Demonstrated are the quality improvement of epitaxial GaN layers using a...
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6531414 |
Method of oxidizing strain-compensated superlattice of group III-V semiconductor
A method of forming a native oxide from at least one strain-compensated superlattice of Group III-V semiconductor material, where each at least one superlattice includes two monolayers of a Group...
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6524969 |
High density plasma chemical vapor deposition (HDP-CVD) processing of gallium arsenide wafers
Method for processing gallium arsenide (GaAs) wafers is provided. One embodiment of the invention provides a method for processing a substrate comprising disposing the substrate on a substrate...
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6498050 |
Bipolar transistor, semiconductor light emitting device and semiconductor device
In a GaAs type semiconductor device, In p Ga 1−p N (0<p≦1) is used to thereby form heterojunction having a large difference in energy gap, thereby providing a high performance semiconductor...
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6479312 |
Gallium phosphide luminescent device
By providing a nitrogen-doped low carrier concentration layer 13 having both of a donor concentration and an acceptor concentration controlled below 1×10 16 /cm 3 at a p-n junction portion...
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6464780 |
Method for the production of a monocrystalline layer on a substrate with a non-adapted lattice and component containing one or several such layers
The invention relates to a method for the production of a monocrystalline layer on a substrate with a non-adapted lattice. To this end, a monocrystalline substrate with a buried amply defective...
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6451711 |
Epitaxial wafer apparatus
A system for coating the surface of compound semiconductor wafers includes providing a single-wafer epitaxial production system in a cluster-tool architecture with a loading, storage, and transfer...
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6380101 |
Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof
Microcontact printing to pattern a self-assembled monolayer (SAM) of an alkanephosphonic acid on a film of indium zinc oxide (IZO). The SAM is robust enough to protect the undelying IZO from wet...
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6346481 |
Method of reducing pitting of a coated heater
Provided herein is a method of depositing a film on a substrate in a high temperature chemical vapor deposition (CVD) reactor, comprising the steps of polishing sharp corner(s) of the surface of a...
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6319566 |
Method of molecular-scale pattern imprinting at surfaces
A method for mask-free molecular or atomic patterning of surfaces of reactive solids is disclosed. A molecular-scale pattern of adsorbate molecules is used in place of the conventional macroscopic...
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