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8148271 Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method  
A substrate processing apparatus comprises a processing chamber for storing a boat supporting multiple substrates and for processing the multiple substrates, a heater unit installed around the...
8026175 Cleaning apparatus of semiconductor substrate and method of manufacturing semiconductor device  
After a liquid chemical treatment is finished, in parallel with a washing away treatment and/or a drying treatment, by spraying from a nozzle for a cleaning liquid supplied by a cleaning line to an...
8007594 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device includes the step of conducting a cleaning process for a wafer formed with copper wiring lines to remove contaminations produced on a back surface...
7998876 Method of producing semiconductor element  
A method of producing a semiconductor element includes the steps of forming a wiring portion layer on a substrate; forming an interlayer insulation layer over the substrate and the wiring portion...
7972969 Method and apparatus for thinning a substrate  
A method is provided for controlling substrate thickness. At least one etchant is dispensed from at least one dispenser to a plurality of different locations on a surface of a spinning substrate to...
7887636 Substrate dryer and a drying method  
A substrate dryer includes, among other things, means for generating isopropyl alcohol bubbles, and a vibrator to atomize stored isopropyl alcohol. A heater may be provided to heat pumped isopropyl...
7884028 Method of removing material layer and remnant metal  
A method of removing material layer is disclosed. First, a semiconductor substrate is fixed on a rotating platform, where a remnant material layer is included on the surface of the semiconductor...
7833912 Semiconductor device and method of manufacturing the same  
According to an aspect of the present invention, there is provided a semiconductor device including a semiconductor substrate which includes a number of chip areas, a processed film which is formed...
7776709 Cut-and-paste imprint lithographic mold and method therefor  
A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.
7759252 Method of two-step backside etching  
The present invention is related to a method of two-step backside-etching. First, a substrate with a plurality of hard masks is provided. Next, the back and the edge of the substrate are...
7745237 Pattern forming method and pattern forming system  
Method of forming a pattern by a nanoimprint technique starts with preparing a mold with nanostructures on its surface. The mold is pressed against a substrate or plate coated with a resin film....
7655496 Metal lift-off systems and methods using liquid solvent and frozen gas  
A method of fabricating a semiconductor device includes patterning a layer of photoresist onto a surface of a wafer to define metal feature areas and residual metal areas. A layer of metal is...
7566652 Electrically inactive via for electromigration reliability improvement  
A semiconductor device 300 includes a metal line 304 formed in a first dielectric layer 302. A capping layer 306 is formed the metal line 304. A second dielectric layer 308 is formed over the first...
7541293 Method for manufacturing semiconductor device  
According to the present invention, a process for changing the form of a processed film is performed to planarize it before the processed film which is formed on a wafer is processed in a...
7476554 Substrate processing method  
A substrate processing method of the present invention includes the steps of placing a substrate inside a vacuum container containing particles and processing the substrate inside the container...
7470622 Fabrication and use of polished silicon micro-mirrors  
A method of fabricating silicon micro-mirrors includes etching from opposite sides of a silicon wafer with a polished surface on at least one of the opposite sides, to form silicon bars each having...
7446051 Method of etching silicon  
Silicon (12) is etched through a mask (11) comprising a layer of organic resin material (such as novolac) through which openings (32) are formed in the areas to be etched. The layer of organic...
7431861 Etchant, replenishment solution and method for producing copper wiring using the same  
An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric...
7405139 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch  
A method of preventing the formation of cracks on the backside of a silicon (Si) semiconductor chip or wafer during the processing thereof. Also provided is a method for inhibiting the propagation...
7396483 Uniform chemical etching method  
The invention concerns a method of wet chemical etching of a wafer comprising at least one surface layer of silicon-germanium (SiGe) for etching by dispensing an etching solution deposited on a...
7387455 Substrate processing device, substrate processing method, and developing device  
Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated...
7354869 Substrate processing method, substrate processing apparatus, and semiconductor device manufacturing method  
A method for a substrate processing apparatus having a substrate holding mechanism and a chemical solution dispensing/sucking mechanism including a chemical solution dispensing port for supplying a...
7351642 Deglaze route to compensate for film non-uniformities after STI oxide processing  
A process and method for compensating for a radial non-uniformity on a wafer that includes the steps of: centering a rotational thickness non-uniformity of a film on the wafer about the axis of the...
7344955 Cut-and-paste imprint lithographic mold and method therefor  
A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.
7338909 Micro-etching method to replicate alignment marks for semiconductor wafer photolithography  
A method and apparatus for locally etching a substrate area the method including providing a substrate comprising a process surface; depositing a material layer over the process surface; and,...
7276449 Gas assisted method for applying resist stripper and gas-resist stripper combinations  
A method for moving resist stripper across the surface of a semiconductor substrate includes applying a wet chemical resist stripper, such as an organic or oxidizing wet chemical resist stripper,...
7186577 Method for monitoring a density profile of impurities  
A method of monitoring a density profile of impurities, the method including presetting a monitoring position of a thin layer coated on a substrate, the density profile of impurities being...
7179753 Process for planarizing substrates of semiconductor technology  
In a process for planarization of semiconductor substrates in which a layer which has been applied to a semiconductor substrate which has a trench and/or contact holes is removed such that the...
7160808 Chuck for supporting wafers with a fluid  
A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer...
7151058 Etchant for etching nitride and method for removing a nitride layer using the same  
In a method for removing a nitride layer of a semiconductor device, an etchant including about 15 to about 40 percent by volume of hydrofluoric acid, about 15 to about 60 percent by volume of...
7119027 Method for manufacturing display device that includes supplying solution to the underside of a glass substrate  
Where a thin film formed on a glass substrate is etched with a solution containing a fluoride, insoluble residues formed by the reaction of the solution with glass substrate components adhere to...
7119026 Basic material for patterning and patterning method  
A pattern forming method of the present invention includes the steps of forming, on a substrate before droplets are ejected onto the substrate, a water repelling area, in which a contact angle...
7022610 Wet cleaning method to eliminate copper corrosion  
A method for cleaning semiconductor substrates includes a DI water clean operation that uses a spin speed no greater than 350 rpm. The cleaning method may include additional cleaning operations...
7008877 Etching of chromium layers on photomasks utilizing high density plasma and low frequency RF bias  
The present invention provides a method and an apparatus for etching a photolithographic substrate. The photolithographic substrate is placed on a support member in a vacuum chamber. A processing...
6992014 Method and apparatus for etch rate uniformity control  
A method for controlling a process on a substrate. The method comprising: providing the substrate, the substrate having an upper surface, an opposite lower surface and an edge between the upper and...
6969688 Wet etchant composition and method for etching HfO2 and ZrO2  
A wet etchant solution composition and method for etching oxides of hafnium and zirconium including at least one solvent present at greater than about 50 weight percent with respect to an arbitrary...
6967174 Wafer chuck for use in edge bevel removal of copper from silicon wafers  
A wafer chuck includes alignment members that allows a semiconductor wafer to be properly aligned on the chuck without using a separate alignment stage. The alignment members may be cams, for...
6955994 Method of manufacturing semiconductor device and method of manufacturing optical wave guide  
A method of manufacturing a semiconductor device, including the steps of (a) rowing an InP layer on a surface of starting growth, resulting in the InP layer having a convex structure, and (b) wet...
6861359 Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backside  
In order to prevent dusting from a peripheral end portion of a wafer, a semiconductor film formed is removed from at least the entire surface of the backside of the wafer and from the peripheral...
6855640 Apparatus and process for bulk wet etch with leakage protection  
When using hot alkaline etchants such as KOH, the wafer front side, where various devices and/or circuits are located, must be isolated from any contact with the etchant. This has been achieved by...
6828196 Trench filling process for preventing formation of voids in trench  
Embodiments of the present invention relate to a process for filling a trench structure of a semiconductor device to prevent formation of voids in the trench structure so as to minimize current...
6821892 Intelligent wet etching tool as a function of chemical concentration, temperature and film loss  
A method is disclosed for accurately predicting the wet etch end points as a function of the temperature and concentration of the etching solution, as well as of the thickness of the film to be...
6815371 Edge bead removal for spin-on materials containing low volatility solvents using carbon dioxide cleaning  
Methods are provided for removing edge beads from spin-on films. A spin-on film is removed from a region of a surface of a spin-coated substrate adjacent to an edge of the surface by spinning the...
6806205 Stiction-free microstructure releasing method for fabricating MEMS device  
Disclosed is a a method of fabricating a MEMS device by means of surface micromachining without leaving any stiction or residues by etching silicon oxide of a sacrificial layer, which is an...
6806209 Develop processing method of a resist surface on a substrate for reduced processing time and reduced defect density  
A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a...
6803323 Method of forming a component overlying a semiconductor substrate  
A passive integrated component (10) is formed overlying a semiconductor substrate by etching a composite conductive layer using a solution of sodium persulfate or ceric ammonium nitrate to remove a...
6794291 Reactor for processing a semiconductor wafer  
An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The...
6794270 Method for shallow trench isolation fabrication and partial oxide layer removal  
A method for forming thoroughly deposited shallow trench isolation. A first oxide layer is formed conformally over the surface of a semiconductor substrate and on a trench thereon with an aspect...
6790786 Etching processes for integrated circuit manufacturing including methods of forming capacitors  
The invention includes semiconductor processing methods, including methods of forming capacitors. In one implementation, a semiconductor processing method includes providing a semiconductor...
6780780 Method for removing Si-needles of wafer  
This application is about a method for removing the deep trench Si-needles on a wafer. The method includes steps of forming a photoresist layer on a frontside surface of the wafer, removing a...
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