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7429537 Methods and apparatus for rinsing and drying  
A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first...
7429338 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization  
A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one...
7427168 Developing method and developing unit  
In a developing method for performing developing treatment of a substrate by supplying a developing solution onto a resist film formed on a surface of the substrate, the present invention controls...
7422696 Multicomponent nanorods  
Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the...
7419908 Process for making an array of wells  
A method of fabricating electronic, optical or magnetic devices requiring an array of large numbers of small feature in which regions defining individual features of the array are foamed by the...
7416989 Adsorption based material removal process  
Methods for accurate and conformal removal of atomic layers of materials make use of the self-limiting nature of adsorption of at least one reactant on the substrate surface. In certain...
7416984 Method of producing a MEMS device  
A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom...
7413996 High k gate insulator removal  
A method of forming a high k gate insulation layer in an integrated circuit on a substrate. A high k layer is deposited onto the substrate, and patterned with a mask to define the high k gate...
7410909 Method of removing ion implanted photoresist  
A method of removing an ion implanted photoresist comprises performing first cleaning a semiconductor substrate having the ion implanted photoresist using hot deionized water to which a megasonic...
7410908 Manufacturing method for a semiconductor device  
A manufacturing method for a semiconductor device, includes: preparing a semiconductor wafer having an active surface, a side surface, a rear surface on the side opposite the active surface, and a...
7405164 Apparatus and method for removing a photoresist structure from a substrate  
In an apparatus and method for removing a photoresist structure from a substrate, a chamber for receiving the substrate includes a showerhead for uniformly distributing a mixture of water vapor and...
7405163 Selectively accelerated plating of metal features  
An accelerator solution is globally applied to a workpiece to form an accelerator film, and then a portion of the accelerator film is selectively removed from the workpiece to form an acceleration...
7405139 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch  
A method of preventing the formation of cracks on the backside of a silicon (Si) semiconductor chip or wafer during the processing thereof. Also provided is a method for inhibiting the propagation...
7402530 Method for manufacturing semiconductor device and semiconductor device  
A first oxide film and a second oxide film 16 are formed in a first region 13 a and a second region 13 b , respectively, on the surface of the semiconductor substrate 10 , via thermal...
7402529 Method of applying cladding material on conductive lines of MRAM devices  
A method of fabricating a cladding region for use in MRAM devices includes the formation of a conductive bit line proximate to a magnetoresistive memory device. The conductive bit line is immersed...
7402523 Etching method  
A method for etching an insulation film through a patterned mask, includes the steps of etching the insulation film until just before an underlayer is about to be exposed by applying a plasma, and...
7402258 Methods of removing metal contaminants from a component for a plasma processing apparatus  
Methods of removing metal contaminants from a component for a plasma processing apparatus are provided. The method includes cleaning a surface of the component with a cleaning liquid that includes...
7399713 Selective treatment of microelectric workpiece surfaces  
This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or...
7399690 Methods of fabricating semiconductor devices and structures thereof  
Methods of forming spacers on sidewalls of features of semiconductor devices and structures thereof are disclosed. A preferred embodiment comprises a semiconductor device including a workpiece and...
7399424 Compositions for dissolution of low-k dielectric films, and methods of use  
An improved composition and method for cleaning the surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k dielectric material such as silicon...
7396733 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device  
A method for manufacturing a semiconductor substrate, including: forming a first semiconductor layer on a semiconductive base; forming a second semiconductor layer, having a smaller etching...
7396708 Etching method for metal layer of display panel  
An etching process of a metal layer of a display panel is provided. First, a substrate with at least one display panel region, a testing device region, and a non-device region is provided. Then, a...
7396484 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries  
Ophthalmic surgical blades are manufactured from either a single crystal or poly-crystalline material, preferably in the form of a wafer. The method comprises preparing the single crystal or...
7395611 System processing a substrate using dynamic liquid meniscus  
A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to...
7393790 Method of manufacturing carrier wafer and resulting carrier wafer structures  
A method is disclosed for preparing carrier wafers for semiconductor device manufacture. The method includes the steps of sorting a plurality of standard carrier wafer blanks into batches by...
7390754 Method of forming a silicide  
A method of stripping a remnant metal is disclosed. The remnant metal is formed on a transitional silicide of a silicon substrate. Firstly, a surface oxidation process is performed on the...
7390752 Self-aligning patterning method  
The present invention relates to a self-aligning patterning method which can be used to manufacture a plurality of multi-layer thin film transistors on a substrate. The method comprises firstly...
7390745 Pattern enhancement by crystallographic etching  
A method for producing predetermined shapes in a crystalline Si-containing material that have substantially uniform straight sides or edges and well-defined inside and outside corners is provided...
7387739 Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument  
A plurality of penetrating holes are formed in a substrate, each of the penetrating holes connecting a first opening and a second opening larger than the first opening. An etching resistant film is...
7384877 Technique for reducing silicide defects by reducing deleterious effects of particle bombardment prior to silicidation  
By reducing the effect of particle bombardment during the sequence for forming a metal silicide in semiconductor devices, the defect rate and the metal silicide uniformity may be enhanced. For this...
7384870 Method for manufacturing glass substrate  
A method for providing a high quality glass substrate that if free of residual polishing particles. The method includes polishing the surface of the glass plate with a polishing agent containing...
7384869 Protection of silicon from phosphoric acid using thick chemical oxide  
A method for protecting exposed silicon from attack by phosphoric acid during wet etching and stripping processes is provided. According to various embodiments of the method, a thick chemical oxide...
7381694 Composition and method for removing photoresist materials from electronic components  
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The...
7378355 System and methods for polishing a wafer  
In methods for smoothing or polishing a surface of a wafer, such as a silicon wafer, a liquid layer is formed on a surface of the wafer. The liquid layer may be an invisible microscopic layer, or a...
7378353 High selectivity BPSG to TEOS etchant  
An organic acid/fluoride-containing solution etchant having high selectivity for BPSG to TEOS. In an exemplary situation, a TEOS layer may be used to prevent contamination of other components in a...
7377991 Ultrasonic assisted etch using corrosive liquids  
An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least...
7371694 Semiconductor device fabrication method and fabrication apparatus  
The flatness of the surface of a Si substrate is requested as the present gate length is miniaturized. The present invention is a semiconductor device fabrication method for flattening a silicon...
7371693 Manufacturing method of semiconductor device with chamfering  
Cost is reduced and reliability is improved with a CSP type semiconductor device. A glass substrate which works as a supporting plate is bonded through an adhesive to a first surface of a...
7371333 Methods of etching nickel silicide and cobalt silicide and methods of forming conductive lines  
The invention includes methods of etching nickel silicide and cobalt silicide, and methods of forming conductive lines. In one implementation, a substrate comprising nickel silicide is exposed to a...
7368416 Methods of removing metal-containing materials  
Various methods for selectively etching metal-containing materials (such as, for example, metal nitrides, which can include, for example, titanium nitride) relative to one or more of silicon,...
7368397 Method for monitoring edge bead removal process of copper metal interconnection  
Disclosed is a method for monitoring an edge bead removal process for a copper metal interconnection. The method includes the steps of (a) forming a copper metal layer on a semiconductor wafer, (b)...
7368396 Dry etching methods  
A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (referred to collectively as “slots”) in the substrates. The process...
7368395 Method for fabricating a nano-imprinting mold  
An imprinting apparatus and method of fabrication provide a mold having a pattern for imprinting. The apparatus includes a semiconductor substrate polished in a [ 110 ] direction. The semiconductor...
7367343 Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution  
The invention includes methods of cleaning a surface of a cobalt-containing material, methods of forming an opening to a cobalt-containing material, semiconductor processing methods of forming an...
7365021 Methods of fabricating a semiconductor device using an organic compound and fluoride-based buffered solution  
Methods are provided for fabricating a semiconductor device that include the steps of: sequentially forming a metal interconnection and a protecting layer on a semiconductor substrate; forming a...
7361610 Method of etching a glass substrate  
The present invention discloses an etching apparatus comprising an etching bath having an etchant; an etchant recycling part in the etching bath; a DI and undiluted etchant supply part for...
7361609 Mask patterns for semiconductor device fabrication and related methods  
Methods of forming an integrated circuit device may include forming a resist pattern on a layer of an integrated circuit device with portions of the layer being exposed through openings of the...
7361286 Method of detecting etching end-point  
A method of detecting an etching end-point includes the steps of: forming a mask on a pattern area of an etching object; forming an etching indicator on an etching area of the etching object, which...
7358195 Method for fabricating liquid crystal display device  
In etching a metal line formed as a dual layer of aluminum alloy and molybdenum, the metal line consisting of the dual layer of aluminum alloy and molybdenum is etched through one-time wet etching...
7354870 Process for chemical etching of parts fabricated by stereolithography  
A process for chemically etching a stereolithography resin involves chemically etching a shaped object of the resin at a temperature in a range of from about 20° C. to about 30° C. for a time of...
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