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7618897 |
Alkali etching liquid for silicon wafer and etching method using same
An alkali etching liquid for a silicon wafer that includes an aqueous solution of potassium hydroxide, and from 0.1 g/L to 0.5 g/L of diethylene triamine pentaacetic acid. Furthermore, the Fe...
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7611995 |
Method for removing silicon oxide film and processing apparatus
A silicon dioxide film removing method is capable of removing a silicon dioxide film, such as a natural oxide film or a chemical oxide film, at a temperature considerably higher than a room...
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7608548 |
Method for cleaning a multilayer substrate and method for bonding substrates and method for producing a bonded wafer
Disclosed is a method for cleaning a multilayer substrate at least having a silicon single crystal wafer with a SiGe layer epitaxially grown on a surface of the silicon single crystal wafer, where...
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7608547 |
Etchant and method for fabricating liquid crystal display using the same
Provided are an etchant used for a transparent conductive oxide layer and a method for fabricating a liquid crystal display (LCD) using the etchant. The etchant includes 2-5 wt % sulfuric acid,...
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7605076 |
Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed
An insulating film formed on a conducting layer is dry-etched so as to make a connection hole in the insulating film to expose the conducting layer. Plasma is supplied onto the exposed conducting...
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7605075 |
Multilayer circuit board and method of manufacturing the same
A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two...
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7601642 |
Method of processing silicon wafer
The inventive method for processing a silicon wafer is a method comprising step 11 in which a single crystal ingot is sliced into thin disc-like wafers; step 13 in which the surface of each...
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7601621 |
Method of forming surface irregularities and method of manufacturing gallium nitride-based light emitting diode
A method of forming surface irregularities comprises preparing a GaN substrate; forming a mask on a surface of the GaN substrate, the mask defining a surface-irregularity formation region; and...
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7598168 |
Method of fabricating dual damascene interconnection and etchant for stripping sacrificial layer
A method of forming a dual damascene semiconductor interconnection and an etchant composition specially adapted for stripping a sacrificial layer in a dual damascene fabrication process without...
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7592266 |
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
The removing solution containing a cerium (IV) nitrate salt, periodic acid or a hypochlorite can be applied to metals containing copper, silver or palladium and also to metals containing other...
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7591959 |
Etchants and etchant systems with plural etch selectivities
An etchant for removing materials with a plurality of selectivities exhibits a first etch selectivity at a first temperature and a second etch selectivity at a second temperature. The etchant may...
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7585781 |
Method of forming openings in an organic resin material
A thin film of organic resin material ( 17 ), such as novolac, is used as an etch mask and openings ( 32 ) are formed in the mask in a predetermined pattern to allow processing in selected areas...
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7585779 |
Fabrication method of semiconductor device
A fabrication method of a semiconductor device includes steps of performing any one of O 2 ashing, organic processing, and dry etching on a surface of a GaN-based semiconductor layer, etching the...
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7582570 |
Compositions for removal of processing byproducts and method for using same
A composition and methods for using the composition in removing processing byproducts is provided. The composition can be non-aqueous or semi-aqueous. The non-aqueous composition includes a...
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7579309 |
Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor
The present invention relates to a method for characterizing defects on silicon surfaces, such as silicon wafers, a method for treating silicon surfaces with an etching solution, and an etching...
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7579284 |
Etching solution, method of forming a pattern using the same, method of manufacturing a multiple gate oxide layer using the same and method of manufacturing a flash memory device using the same
Example embodiments of the present invention relate to an etching solution, a method of forming a pattern using the same, a method of manufacturing a multiple gate oxide layer using the same and a...
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7579280 |
Method of patterning a film
A method of patterning a thin film. The method includes forming a mask on a film to be patterned. The film is then etched in alignment with the mask to form a patterned film having a pair of...
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7572739 |
Tape removal in semiconductor structure fabrication
A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer...
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7572735 |
Blanket resist to protect active side of semiconductor
Yield loss in semiconductor processing is mitigated by forming a resist over an active side of a semiconductor workpiece or wafer, as well as around the edge of the wafer. The resist mitigates the...
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7569491 |
Method for enlarging a nano-structure
A method and system for fabricating nano-scale structures, such as channels (i.e., nano-channels) or vias (i.e., nano-vias. An open nano-structure, is formed in a substrate. Thereafter, an optional...
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7569490 |
Electrochemical etching
Methods to etch a workpiece are described. In one embodiment, a workpiece is disposed within an etchant solution having a composition comprising a dilute acid and a non-ionic surfactant. An...
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7569478 |
Method and apparatus for manufacturing semiconductor device, control program and computer storage medium
In a method for manufacturing a semiconductor device having a dual damascene structure, a semiconductor substrate formed by stacking a trench mask and a via hole resist mask on an insulating film...
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7566666 |
Composition for removing an insulation material and related methods
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent...
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7566596 |
Method of manufacturing a thin film transistor substrate and stripping composition
A method of manufacturing a thin film transistor substrate includes forming a transistor thin layer pattern, forming a protecting layer, forming a photoresist film, forming a pixel electrode and a...
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7566574 |
Method of performing a double-sided process
A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines...
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7563717 |
Method for fabricating a semiconductor device
The method includes chemical-mechanical polishing to planarize an insulating interlayer deposited on a lower pattern. The insulating interlayer is polished using a surfactant. The...
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7560386 |
Method of manufacturing nonvolatile semiconductor memory device
A method of manufacturing a nonvolatile semiconductor memory device may include forming a pad oxide layer pattern and a mask pattern on a semiconductor substrate, forming a trench within the...
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7547642 |
Micro-structure manufacturing method
A method of manufacturing a micro-structure includes dry-etching a sacrificial layer provided to a silicon substrate to form structures the sacrificial layer reacting with etching gas to generate...
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7547627 |
Method for manufacturing semiconductor device
It is an object of the present invention to provide a semiconductor device including a wiring having a preferable shape. A manufacturing method includes the steps of forming a first conductive...
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7547398 |
Self-aligned process for fabricating imprint templates containing variously etched features
A process that enables coplanarization of the structures that have been created in multiple independent etch steps. The various etches are performed independently by selectively exposing only...
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7544624 |
Systems and methods for processing microfeature workpieces
Systems and methods for processing microfeature workpieces are disclosed herein. In one embodiment, the system comprises a processing chamber having a workpiece processing site configured to...
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7541293 |
Method for manufacturing semiconductor device
According to the present invention, a process for changing the form of a processed film is performed to planarize it before the processed film which is formed on a wafer is processed in a...
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7541286 |
Method for manufacturing semiconductor device using KrF light source
A semiconductor device manufacturing method using a KrF light source is disclosed. Embodiments relate to a method for manufacturing a semiconductor device including forming an oxide film over a...
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7540968 |
Micro movable device and method of making the same using wet etching
A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base...
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7537709 |
Method for isotropic etching of copper
Copper and copper alloys are etched to provide uniform and smooth surface by employing an aqueous composition that comprises an oxidant, a mixture of at least one weak complexant and at least one...
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7534365 |
Ultra-violet assisted anisotropic etching of PET
A method for etching a substrate is described wherein a substrate is positioned in a solution of solvent and the substrate is exposed to excitation energy. The method may be applied to the...
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7531463 |
Fabrication of semiconductor interconnect structure
An etching process for selectively etching exposed metal surfaces of a substrate and forming a conductive capping layer over the metal surfaces is described. In some embodiments, the etching...
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7531462 |
Method of inspecting semiconductor wafer
A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer;...
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7531406 |
Method for fabricating an electrical component
An electrical component, such as a DRAM semiconductor memory or a field-effect transistor is fabricated. At least one capacitor having a dielectric ( 130 ) and at least one connection electrode (...
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7531045 |
Method for removing haze in a photo mask
An apparatus for removing haze in a photo mask includes sealed chamber having a bake module disposed therein to support a photo mask, a reactant gas feed line to feed a reactant gas into the...
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7524771 |
Substrate processing method using alkaline solution and acid solution
Particles adhering to the surface of a substrate are removed by physical action of injection of droplets or megasonic vibrations or by combination of the physical action and slight etching on the...
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7524752 |
Method of manufacturing semiconductor device
In a method of manufacturing a semiconductor device which method is made up of a process of forming a wiring groove using a hard mask, a metal hard mask 107 is used to form a wiring groove 111 ,...
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7524733 |
Asymmetric source/drain transistor employing selective epitaxial growth (SEG) layer and method of fabricating same
According to some embodiments of the invention, a method includes preparing a semiconductor substrate having an active region, doping channel ions in the active region, forming a planarized...
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7524705 |
Method for manufacturing a semiconductor substrate and method for manufacturing a semiconductor device
A method for manufacturing a semiconductor substrate includes forming a first semiconductor layer on a predetermined region of a semiconductor base, forming a second semiconductor layer whose...
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7521374 |
Method and apparatus for cleaning semiconductor substrates
According to one aspect of the present invention, a method and apparatus for cleaning a semiconductor substrate is provided. The method may include supporting a semiconductor substrate, the...
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7521373 |
Compositions for dissolution of low-k dielectric films, and methods of use
An improved composition and method for cleaning the surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k dielectric material such as silicon...
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7517809 |
Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) and other semiconductor substrates having such sacrificial layers is...
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7517808 |
Method for forming and removing a patterned silicone film
A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce...
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7517465 |
Ultra lightweight photovoltaic device and method for its manufacture
An ultra lightweight semiconductor device such as a photovoltaic device is fabricated on a non-etchable barrier layer which is disposed upon an etchable substrate. The device is contacted with an...
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7514369 |
Method of producing porous silicon particles by stain-etching and silicon nanoparticles from stain-etched silicon powder
The present invention is for a porous silicon powder comprising silicon particles wherein the outermost layers of said particles are porous. The present invention is also directed to a method of...
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