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7625821 |
Process and apparatus for thinning a semiconductor workpiece
The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a...
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7622391 |
Method of forming an electrically conductive line in an integrated circuit
A method of forming a semiconductor structure comprises providing a semiconductor structure comprising a layer of a dielectric material provided over an electrically conductive feature. An opening...
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7615475 |
Method for fabricating landing polysilicon contact structures for semiconductor devices
A method for forming an integrated circuit device, e.g., memory, logic. The method includes providing a semiconductor substrate (e.g., silicon wafer) comprising a surface region and forming a...
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7611552 |
Semiconductor polishing composition
A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the...
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7601642 |
Method of processing silicon wafer
The inventive method for processing a silicon wafer is a method comprising step 11 in which a single crystal ingot is sliced into thin disc-like wafers; step 13 in which the surface of each...
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7598175 |
Apparatus and method for confined area planarization
A proximity head and associated method of use is provided for performing confined area planarization of a semiconductor wafer. The proximity head includes a chamber defined to maintain an...
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7597729 |
Polishing composition and polishing method using the same
A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition...
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7589023 |
Method of manufacturing semiconductor wafer
A method of manufacturing a semiconductor wafer, comprising the step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by using an abrasive cloth with a...
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7589022 |
Method of chemical mechanical polishing and method of fabricating semiconductor device using the same
There is provided a method of chemical mechanical polishing (CMP) and a method of fabricating a semiconductor device using the same. The method includes forming a layer to be polished on a...
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7585341 |
Polishing material comprising diamond clusters
Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and...
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7582221 |
Wafer manufacturing method, polishing apparatus, and wafer
The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof...
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7582127 |
Polishing composition for a tungsten-containing substrate
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching,...
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7579279 |
Method to passivate conductive surfaces during semiconductor processing
A method for processing semiconductor wafers is disclosed. A solution is applied to a semiconductor wafer to prevent dendrites and electrolytic reactions at the surface of metal interconnects. The...
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7575615 |
Process for preparing a polishing composition
The present invention relates to a process for preparing a polishing composition comprising a colloidal silica prepared from a silicate. The first step involves adjusting the pH of a silica...
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7572693 |
Methods for transistor formation using selective gate implantation
Methods are disclosed for semiconductor device fabrication in which dopants are selectively implanted into transistor gate structures to counteract or compensate for dopant depletion during...
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7563716 |
Polishing method
A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable...
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7557041 |
Apparatus and method for supplying chemicals
A chemical supplying apparatus includes first and second mixing tanks for mixing and supplying chemical slurries used in a semiconductor fabrication process. The slurries are alternately provided...
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7556972 |
Detection and characterization of SiCOH-based dielectric materials during device fabrication
Processes and apparatuses are disclosed for detecting and characterizing SiCOH-based dielectric materials during integrated circuit fabrication. The processes generally include chromatographically...
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7553768 |
Substrate and a method for polishing a substrate
A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a...
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7553700 |
Chemical-enhanced package singulation process
Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment...
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7553430 |
Polishing slurries and methods for chemical mechanical polishing
Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble...
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7550387 |
Semiconductor wafer processing method
A semiconductor wafer processing method for planarizing an additional layer formed on the front side of a semiconductor wafer. First, the wafer is held on a chuck table included in a cutting device...
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7550092 |
Chemical mechanical polishing composition
A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue...
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7550020 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle...
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7544618 |
Two-step chemical mechanical polishing process
A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a...
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7544617 |
Die scale control of chemical mechanical polishing
A method for control of chemical mechanical polishing of a pattern dependant non-uniform wafer surfaces in a die scale wherein the die in the wafer surface have a plurality of zones of different...
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7544606 |
Method to implement stress free polishing
A method of forming a metal feature in a low-k dielectric layer is provided. The method includes forming an opening in a low-k dielectric layer, forming a metal layer having a substantially planar...
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7541287 |
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method
A semiconductor wafer is guided in a cutout in a carrier while a thickness of the semiconductor wafer is reduced to a target thickness by material removal from the front and back surfaces...
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7534719 |
Method for reduction in metal dishing after CMP
A protective barrier layer, formed of a material such as titanium or titanium nitride for which removal by chemical mechanical polishing (CMP) is primarily mechanical rather than primarily...
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7534277 |
Slurry composition for secondary polishing of silicon wafer
Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of...
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7524347 |
CMP composition comprising surfactant
The invention provides a polishing composition comprising fumed alumina, alpha alumina, silica, a nonionic surfactant, a metal chelating organic acid, and a liquid carrier. The invention further...
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7521363 |
MEMS device with non-standard profile
A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a...
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7514363 |
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, benzenesulfonic acid compound, a per-compound...
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7513920 |
Free radical-forming activator attached to solid and used to enhance CMP formulations
A CMP composition having: a fluid comprising water and at least one oxidizing compound that produces free radicals when contacted with an activator; and a plurality of particles having a surface...
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7510973 |
Method for forming fine pattern in semiconductor device
A method for forming a fine pattern in a semiconductor device is provided. In one aspect, the method can construct a fine pattern in semiconductor devices. The fine pattern has a critical dimension...
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7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device
A method of processing a substrate which enables a surface damaged layer and polishing remnants on the surface of an insulating film to be removed, and enable the amount removed of the surface...
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7510970 |
Process for manufacturing semiconductor integrated circuit device
In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device...
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7504337 |
IC chip uniform delayering methods
Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the...
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7501051 |
Electropolishing electrolyte and method for planarizing a metal layer using the same
The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the...
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7501035 |
Method of manufacturing replica diffraction grating
A method of manufacturing a replica diffraction grating includes the steps of: forming a metal thin film on a grating surface of a master diffraction grating, adhering a replica substrate to the...
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7498263 |
Method of planarizing an inter-metal insulation film
A method for forming a planarized inter-metal insulation film is provided. The method includes applying a CMP process to an insulation film as controlled by a polish-stop layer pattern formed on an...
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7485162 |
Polishing composition
A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from...
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7476613 |
Method of forming an electrical contact in a semiconductor device using an improved self-aligned contact (SAC) process
A contact for a semiconductor device is made by performing, inter alia, a CMP process on an interlayer insulation layer to expose a first hard mask layer of each conductive line. The interlayer...
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7475368 |
Deflection analysis system and method for circuit design
A system, a method and a computer program product for analyzing a circuit design provide for discretizing the circuit design into a series of pixels. A fraction of at least one constituent material...
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7456106 |
Method for producing a silicon wafer
Provided is a method for producing a silicon wafer whose surfaces exhibit precise flatness and minute surface roughness, and which allows one to visually discriminate between the front and rear...
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7452816 |
Semiconductor processing method and chemical mechanical polishing methods
This invention includes a chemical mechanical polishing method including providing a substrate having an organic material to be polished by chemical mechanical polishing. In one implementation, the...
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7452481 |
Polishing slurry and method of reclaiming wafers
The polishing slurry contains monoclinic zirconium oxide particles having a crystallite size of 10 to 1,000 nm and an average particle diameter of 30 to 2,000 nm in an amount of 1 to 20 weight %, a...
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7446045 |
Method of manufacturing nitride substrate for semiconductors
In an independent GaN film manufactured by creating a GaN layer on a base heterosubstrate using vapor-phase deposition and then removing the base substrate, owing to layer-base discrepancy in...
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7446039 |
Integrated circuit system with dummy region
An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second...
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7446020 |
Wafer dividing method and dividing apparatus
A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising the steps of:
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